Abstract: A simulation method for milling by use of a dynamic position error includes the steps of: (a) generating a milling surface from a numerical control code, the milling surface having a plurality of grid points, the numerical control code having a position command; (b) calculating a normal vector for each of the plurality of grid points on the milling surface; (c) feeding back a position feedback of each of the plurality of grid points by the controller of the machine tool, and deriving a corresponding three-axis dynamic position error of the milling surface according to the position command and the position feedback; (d) calculating a component of the normal vector for the three-axis dynamic position error so as to obtain a normal-vector error value of the corresponding grid point; and, (e) displaying undercutting information of the normal-vector error value of the corresponding grid point on the milling surface.

Abstract: An optoelectronic device, comprising a first semiconductor layer comprising four boundaries comprising two longer sides and two shorter sides; a second semiconductor layer formed on the first semiconductor layer; and a plurality of first conductive type electrodes formed on the first semiconductor layer, wherein one first part of the plurality of first conductive type electrodes is formed on a corner constituted by one of the two longer sides and one of the two shorter sides, and wherein one fourth part of the plurality of first conductive type electrodes is formed along the one of the two longer sides, the one fourth part of the plurality of first conductive type electrodes comprises a head portion and a tail portion, the head portion comprises a width larger than that of the tail portion.

Abstract: A tool machine servo control simulation device and an establishing method of structure model are provided. The tool machine servo control simulation device includes a structure model and a processor. The structure model includes a position function, a velocity function and a drive property parameter. The processor includes a control signal receiver and a simulation component. The control signal receiver is used for receiving a servo command. The simulation component, response to the servo command, generates a simulation path according to the position function, the velocity function and the drive property parameter.

Abstract: A light-emitting device comprises a substrate; a first light-emitting unit and a second light-emitting unit formed on the substrate, each of the first light-emitting unit and the second light-emitting unit comprises a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer, wherein the first light-emitting unit comprises a first semiconductor mesa and a first surrounding part surrounding the first semiconductor mesa, and the second light-emitting unit comprises a second semiconductor mesa and a second surrounding part surrounding the second semiconductor mesa; a trench formed between the first light-emitting unit and the second light-emitting unit and exposing the substrate; a first insulating layer comprising a first opening on the first surrounding part and a second opening on the second semiconductor layer of the second light-emitting unit; and a connecting electrode comprising a first connecting part on the first

Abstract: An optoelectronic device, comprising a first semiconductor layer comprising four boundaries comprising two longer sides and two shorter sides; a second semiconductor layer formed on the first semiconductor layer; and a plurality of first conductive type electrodes formed on the first semiconductor layer, wherein one first part of the plurality of first conductive type electrodes is formed on a corner constituted by one of the two longer sides and one of the two shorter sides, and wherein one fourth part of the plurality of first conductive type electrodes is formed along the one of the two longer sides, the one fourth part of the plurality of first conductive type electrodes comprises a head portion and a tail portion, the head portion comprises a width larger than that of the tail portion.

Abstract: An adjustable damper includes a base, a first and second slidable members, a movable seat, a mass unit, and a first and second cantilevers. The first slidable member is slidably disposed on the base in a first direction. The movable seat is slidably disposed on the base in a second direction orthogonal to the first direction. The second slidable member is slidably disposed on the movable seat in the second direction. The mass unit is slidably disposed on the movable seat in the first direction. The first cantilever is fixed to a first connecting member. The first connecting member is connected to the movable seat. The first slidable member movably is disposed on the first cantilever. The second cantilever is fixed to a second connecting member. The second connecting member is connected to the mass unit. The second slidable member is movably disposed on the second cantilever.

Abstract: A tool machine servo control simulation device and an establishing method of structure model are provided. The tool machine servo control simulation device includes a structure model and a processor. The structure model includes a position function, a velocity function and a drive property parameter. The processor includes a control signal receiver and a simulation component. The control signal receiver is used for receiving a servo command. The simulation component, response to the servo command, generates a simulation path according to the position function, the velocity function and the drive property parameter.

Abstract: An adjustable damper includes a base, a first and second slidable members, a movable seat, a mass unit, and a first and second cantilevers. The first slidable member is slidably disposed on the base in a first direction. The movable seat is slidably disposed on the base in a second direction orthogonal to the first direction. The second slidable member is slidably disposed on the movable seat in the second direction. The mass unit is slidably disposed on the movable seat in the first direction. The first cantilever is fixed to a first connecting member. The first connecting member is connected to the movable seat. The first slidable member movably is disposed on the first cantilever. The second cantilever is fixed to a second connecting member. The second connecting member is connected to the mass unit. The second slidable member is movably disposed on the second cantilever.

Abstract: A light-emitting element includes a semiconductor light-emitting stack including a first semiconductor layer, a second semiconductor layer formed on the first semiconductor layer, and an active layer formed therebetween; a first conductive layer disposed on the second semiconductor layer and electrically connecting the second semiconductor layer; a second conductive layer disposed on the second semiconductor layer and electrically connecting the first semiconductor layer; and a cushion part disposed on and directly contacts the first conductive layer, wherein in a top view, the cushion part is surrounded by and electrically isolated from the second conductive layer.

Abstract: A system and method for aligning a probe, such as a wafer-level test probe, with wafer contacts is disclosed. An exemplary method includes receiving a wafer containing a plurality of alignment contacts and a probe card containing a plurality of probe points at a wafer test system. A historical offset correction is received. Based on the historical offset correct, an orientation value for the probe card relative to the wafer is determined. The probe card is aligned to the wafer using the orientation value in an attempt to bring a first probe point into contact with a first alignment contact. The connectivity of the first probe point and the first alignment contact is evaluated. An electrical test of the wafer is performed utilizing the aligned probe card, and the historical offset correction is updated based on the orientation value.

Abstract: A light-emitting element includes a semiconductor light-emitting stack including a first semiconductor layer, an active layer, and a second semiconductor layer; a first conductive layer disposed on the second semiconductor layer and electrically connecting the second semiconductor layer; a second conductive layer disposed on the second semiconductor layer and electrically connecting the first semiconductor layer; and a cushion part disposed on the semiconductor light-emitting stack; wherein in a top view, the cushion part is disposed in a center region of the light-emitting element.

Abstract: A machine tool feed drive design system is provided, which may include a component database, a detection module, a load condition estimation module and a calculation module. The component database may store the specification data of a plurality of feed drive components. The detection module may detect a plurality of operation signals from a machine tool during a period of time when the machine tool had been executing a machining process to a workpiece. The load condition estimation module may calculate a plurality of actual load conditions according to the operation signals and a device specification parameter of a feed drive of the machine tool. The calculation module may select at least one component combination from the feed drive components according to the actual load conditions and the specification data of the feed drive components to serve as an optimized feed drive specification.

Abstract: A process-orientated design method for machine tool structures comprises the steps of: (A) Defining design conditions including initial configurations, cutting requirements and boundary conditions for the machine tool; (B) Calculating cutting ability to generate information realizing a relationship between a maximum cutting depth and a spindle speed of the machine tool based on the initial configurations and the cutting requirements; (C) Performing an optimization to generate a frequency range for optimization based on the information relating the maximum cutting depth and the spindle speed; (D) Performing structural topology optimization to generate an optimized model based on the frequency range for optimization, the initial configurations and boundary conditions; and (E) Determining whether the optimized model fits the constraint condition; if positive, ends the design steps, and otherwise repeats steps (B)˜(D) until an optimized model fits the constraint condition appears.

Abstract: A touch panel includes a substrate, a conductive layer and a cover layer. The conductive layer is disposed on the substrate. The cover layer is disposed on the conductive layer, and includes a nonmetal element dispersed therein, wherein the cover layer has a thickness of T. The nonmetal element at a location of the cover layer where spaced from the conductive layer for a distance of 1/12T has a first concentration, and the nonmetal element at a location of the cover layer where spaced from the conductive layer for a distance of 7/12T has a second concentration, wherein the first concentration is less than the second concentration.

Abstract: A machine tool feed drive design system is provided, which may include a component database, a detection module, a load condition estimation module and a calculation module. The component database may store the specification data of a plurality of feed drive components. The detection module may detect a plurality of operation signals from a machine tool during a period of time when the machine tool had been executing a machining process to a workpiece. The load condition estimation module may calculate a plurality of actual load conditions according to the operation signals and a device specification parameter of a feed drive of the machine tool. The calculation module may select at least one component combination from the feed drive components according to the actual load conditions and the specification data of the feed drive components to serve as an optimized feed drive specification.

Abstract: An optoelectronic device, comprising a first semiconductor layer comprising four boundaries comprising two longer sides and two shorter sides; a second semiconductor layer formed on the first semiconductor layer; and a plurality of first conductive type electrodes formed on the first semiconductor layer, wherein one first part of the plurality of first conductive type electrodes is formed on a corner constituted by one of the two longer sides and one of the two shorter sides, and wherein one fourth part of the plurality of first conductive type electrodes is formed along the one of the two longer sides, the one fourth part of the plurality of first conductive type electrodes comprises a head portion and a tail portion, the head portion comprises a width larger than that of the tail portion.

Abstract: An optoelectronic device, comprising: a first semiconductor layer comprising four boundaries, a corner formed by two of the neighboring boundaries, a first surface, and a second surface opposite to the first surface; a second semiconductor layer formed on the first surface of the first semiconductor layer; a second conductive type electrode formed on the second semiconductor layer; and two first conductive type electrodes formed on the first surface, wherein the first conductive type electrodes are separated and formed a pattern.

Abstract: A light-emitting element includes a semiconductor light-emitting stack including a first semiconductor layer, an active layer, and a second semiconductor layer; a first conductive layer disposed on the second semiconductor layer and electrically connecting the second semiconductor layer; a second conductive layer disposed on the second semiconductor layer and electrically connecting the first semiconductor layer; and a cushion part disposed on the semiconductor light-emitting stack; wherein in a top view, the cushion part is disposed in a center region of the light-emitting element.

Abstract: A light-emitting element includes: a semiconductor light-emitting stack including a first semiconductor layer with a first conductivity, an active layer, and a second semiconductor layer with a second conductivity; a first conductive layer disposed on the semiconductor light-emitting stack and electrically connecting the second semiconductor layer; a first insulating layer on the first conductive layer; a second conductive layer disposed on the first insulating layer and electrically connecting the first semiconductor layer; a second insulating layer on the second conductive layer; a first pad and a second pad on the second conductive layer; and a cushion part disposed between the first pad and the second pad.