Abstract: An antenna assembly includes a patch antenna, a metal layer, and a feed-in signal layer. The metal layer is disposed on a side of the patch antenna and includes a first slot and a second slot. The feed-in signal layer is disposed on a side of the metal layer opposite the second antenna and includes a transmitting port, a receiving port, a hybrid coupler, and two microstrips. The transmitting port and the receiving port are connected to the hybrid coupler, and the two microstrips are extended in the direction away from the hybrid coupler. Projections of two ends of the two microstrips onto the metal layer are overlapped with the first slot and the second slot. An antenna array is also mentioned.

Abstract: Embodiments with present disclosure provides a gate-all-around FET device including extended bottom inner spacers. The extended bottom inner prevents the subsequently formed epitaxial source/drain region from volume loss and induces compressive strain in the channel region to prevent strain loss and channel resistance degradation.

Abstract: A fluid ejection device may include a fluid ejection die including nozzles and fluid feed holes. Each nozzle may have a nozzle orifice formed in a top surface of the fluid ejection die. The fluid feed holes may be formed in a bottom surface of the fluid ejection die and fluidly connected to the nozzles. The fluid ejection device may include a molded panel into which the fluid ejection die is at least partially embedded, the molded panel having a fluid slot formed therethrough such that the fluid slot is fluidly connected to the fluid feed holes of the fluid ejection die, the molded panel formed with a mold chase and a release liner coupled to and at least partially covering an interior surface of the mold chase, the mold chase having a fluid slot feature corresponding to the fluid slot.

Abstract: An semiconductor package includes a redistribution structure, a first semiconductor device, a second semiconductor device, an underfill layer and an encapsulant. The first semiconductor device is disposed on and electrically connected with the redistribution structure, wherein the first semiconductor device has a first bottom surface, a first top surface and a first side surface connecting with the first bottom surface and the first top surface, the first side surface comprises a first sub-surface and a second sub-surface connected with each other, the first sub-surface is connected with the first bottom surface, and a first obtuse angle is between the first sub-surface and the second sub-surface.

Abstract: An example device may comprise a molded structure and a dependent device coupled to the molded structure. The molded structure comprises thermo-electric traces and channels. The channels are between ten ?m and two hundred ?m, or less in one dimension. The dependent device comprises apertures corresponding to the channels and through which fluids, electromagnetic radiation, or a combination thereof is to travel. The dependent device also comprises contacts corresponding to the thermo-electric traces of the molded structure.

Abstract: A fluid-ejection die cartridge includes a cartridge body. The fluid-ejection die cartridge includes a fluid-ejection die fluidically attached to the cartridge body. The fluid-ejection die is to eject fluid. The fluid-ejection die cartridge includes a stamped nanoceramic layer on an exposed fluid-ejection nozzle plate of the fluid-ejection die attached to the cartridge body.

Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The method may be performed by a UE. In certain configurations, the UE receives, from a base station, a configuration instruction for enabling a subband full duplex (SBFD) timing alignment (TA) mechanism and a constant c. The UE enables the SBFD TA mechanism according to the configuration instruction. The UE receives, from the base station, a timing adjustment command, which includes a propagation delay ?i for the UE. The UE determines whether an uplink (UL) transmission is to be performed in a SBFD slot. In response to determining the UL transmission to be performed in the SBFD slot, the UE applies a timing alignment delay to the UL transmission with respect to the SBFD slot start boundary. The timing alignment delay is determined by both the constant c and the propagation delay ?i.

Abstract: Methods, systems, and devices for using secured tunnels (e.g., SSH tunnels), for example with microservices-based architectures and/or operating-system level virtualization technologies, An example method may include receiving, by a secured tunnel server and via a secured tunnel, network traffic intended for a first original destination of the plurality of original destinations; selecting, using a plurality of override rules that indicate mappings between a plurality of original destinations and respective override destinations, an override destination for the network traffic intended for the first original destination; and forwarding, by the secured tunnel server, the network traffic to the override destination.

Abstract: A microfluidic device is described. The microfluidic device comprises a reaction chamber and a temperature control module overlaying the reaction chamber. The temperature control module comprises a temperature regulating flow channel disposed between two layers and in thermal contact with the reaction chamber, and wherein at least a portion of each layer comprises an optically transparent material. Also described is a method of manufacturing a microfluidic device and a method of controlling temperature of a reaction in a microfluidic device.

Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus is a UE. The UE receives, from a base station, a measurement configuration for measuring cross-link interference (CLI) in a subband full-duplexing (SBFD) slot and a reporting configuration for reporting the CLI. The UE performs measurements of the CLI on measurement resources indicated by the measurement configuration. The UE reports an indication of the measured CLI to the base station according to the reporting configuration.

Abstract: A photo-definable hydrophobic composition (“composition”) is presented. The composition can include from about 0.01 wt % to about 20 wt % of a polyether modified siloxane and from about 80 wt % to about 99.99 wt % of a polymeric photoresist. The polymeric photoresist can be selected from an epoxy-based photoresist, a bisbenzocyclobutene-based photoresist, a polyimide-based photoresist, a polybenzoxazole-based photoresist, a polyimide-polybenzoxazole-based photoresist, an admixture, or a combination thereof.

Abstract: Apparatus and methods are provided downlink and uplink CSI and power control for subband full duplex (SBFD) system. In one novel aspect, two CSI-RS configurations are configured for DL CSI, one for the DL-only slots and one for the SBFD slots. In one embodiment, the UE performs channel estimation individually using the CSI-RS configured for the DL-only slots and the SBFD slots. In another embodiment, the CSI-RS signals are periodic or aperiodic. The periodicity of CSI-RS for SBFD slots and DL-only slots are different. In one embodiment, the UE receives a first SRS configuration for UL-only slots and a second SRS configuration for the SBFD slots, transmits the SRS signals on UL-only slots and SBFD slots based on the first SRS configuration and the second SRS configuration. In another novel aspect, the UE receives two different sets of power control parameters for UL-only slots and the SBFD slots.

Abstract: In various examples, a printbar is formed from multiple modular fluid ejection subassemblies joined together through a molding process that provides for a continuous planar substrate surface. A mold may secure the modular fluid ejection subassemblies during a molding process in which a runner conveys a molding material to seams between the joined modular fluid ejection subassemblies.

Abstract: An example digital microfluidic device can include a hydrophobic electrowetting surface including an array of electrodes. The individual electrodes can have a shape with three or more sides. The array of electrodes can include a parking electrode and an adjacent electrode that is adjacent to the parking electrode. A cover can be positioned over the electrowetting surface at a gap distance sufficient to accommodate a liquid droplet between the cover and the electrowetting surface. A plurality of droplet barriers can be positioned on three or more sides of the parking electrode. The droplet barriers can constrain movement of a liquid droplet from the parking electrode to the adjacent electrode.

Abstract: An image identification method is provided, including: storing at least one normal state image of at least one test object; an automatic codec receiving the at least one normal state image to become a trained automatic codec; at least one camera device capturing at least one state image of the at least one test object; a computer device receiving the at least one state image, and the trained automatic codec performing feature extraction and reconstruction on the at least one state image to generate at least one reconstructed state image; and the computer device comparing the at least one state image and the at least one reconstructed state image, and determining whether the at least one state image is a normal state image. The present invention also provides an image identification system.

Abstract: A fluid-ejection die cartridge includes a cartridge body. The fluid-ejection die cartridge includes a fluid-ejection die fluidically attached to the cartridge body. The fluid-ejection die is to eject fluid. The fluid-ejection die cartridge includes a stamped nanoceramic layer on an exposed fluid-ejection nozzle plate of the fluid-ejection die attached to the cartridge body.

Abstract: The present disclosure is drawn to microfluidic devices. A microfluidic device can include a substrate, a lid mounted to the substrate, and a microchip mounted to the substrate. The lid mounted to the substrate can form a discrete microfluidic chamber between structures including an interior surface of the lid and a portion of the substrate. The lid can include an inlet and a vent positioned relative to one another to facilitate loading of fluid to the discrete microfluidic chamber via capillary action. A portion of the microchip can be positioned within the discrete microfluidic chamber.

Abstract: An equipment for monitoring physiological status of a user includes a sound detection unit, a chest detection unit, an abdomen detection unit, and a control unit. The sound detection unit is configured to detect sound of breath and to generate a sound detection signal based on the sound of breath. The chest detection unit is configured to detect a parameter related to movement of a chest and to generate a chest detection signal based on the detection. The abdomen detection unit is configured to detect a parameter related to movement of an abdomen and to generate an abdomen detection signal based on the detection. The control unit is electrically connected to the sound detection unit, the chest detection unit, and the abdomen detection unit and is configured to determine a breathing status of a user based on the sound detection signal, the chest detection signal, and the abdomen detection signal.

Abstract: An example device may comprise a molded structure and a dependent device coupled to the molded structure. The molded structure comprises thermo-electric traces and channels. The channels are between ten ?m and two hundred ?m, or less in one dimension. The dependent device comprises apertures corresponding to the channels and through which fluids, electromagnetic radiation, or a combination thereof is to travel. The dependent device also comprises contacts corresponding to the thermo-electric traces of the molded structure.

Abstract: A method includes applying a mold chase to a fluid ejection die to at least partially define at least one cavity. The mold chase includes a feature to contact a fluid ejection portion of the fluid ejection die, and at least one structure separate from the feature to contact a first end portion adjacent a first end of the fluid ejection die. The method includes filling the at least one cavity with a mold compound to produce a molded carrier for the fluid ejection die.