Patents by Inventor Chien Hua Chen

Chien Hua Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11899367
    Abstract: An electron beam lithography system and an electron beam lithography process are disclosed herein for improving throughput. An exemplary method for increasing throughput achieved by an electron beam lithography system includes receiving an integrated circuit (IC) design layout that includes a target pattern, wherein the electron beam lithography system implements a first exposure dose to form the target pattern on a workpiece based on the IC design layout. The method further includes inserting a dummy pattern into the IC design layout to increase a pattern density of the IC design layout to greater than or equal to a threshold pattern density, thereby generating a modified IC design layout. The electron beam lithography system implements a second exposure dose that is less than the first exposure dose to form the target pattern on the workpiece based on the modified IC design layout.
    Type: Grant
    Filed: December 12, 2022
    Date of Patent: February 13, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Shih-Ming Chang, Wen Lo, Chun-Hung Liu, Chia-Hua Chang, Hsin-Wei Wu, Ta-Wei Ou, Chien-Chih Chen, Chien-Cheng Chen
  • Patent number: 11854929
    Abstract: An semiconductor package includes a redistribution structure, a first semiconductor device, a second semiconductor device, an underfill layer and an encapsulant. The first semiconductor device is disposed on and electrically connected with the redistribution structure, wherein the first semiconductor device has a first bottom surface, a first top surface and a first side surface connecting with the first bottom surface and the first top surface, the first side surface comprises a first sub-surface and a second sub-surface connected with each other, the first sub-surface is connected with the first bottom surface, and a first obtuse angle is between the first sub-surface and the second sub-surface.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: December 26, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Sheng Lin, Chin-Hua Wang, Shu-Shen Yeh, Chien-Hung Chen, Po-Yao Lin, Shin-Puu Jeng
  • Publication number: 20230391086
    Abstract: An example device may comprise a molded structure and a dependent device coupled to the molded structure. The molded structure comprises thermo-electric traces and channels. The channels are between ten ?m and two hundred ?m, or less in one dimension. The dependent device comprises apertures corresponding to the channels and through which fluids, electromagnetic radiation, or a combination thereof is to travel. The dependent device also comprises contacts corresponding to the thermo-electric traces of the molded structure.
    Type: Application
    Filed: August 23, 2023
    Publication date: December 7, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Michael G. Groh
  • Patent number: 11827021
    Abstract: A method includes applying a mold chase to a fluid ejection die to at least partially define at least one cavity. The mold chase includes a feature to contact a fluid ejection portion of the fluid ejection die, and at least one structure separate from the feature to contact a first end portion adjacent a first end of the fluid ejection die. The method includes filling the at least one cavity with a mold compound to produce a molded carrier for the fluid ejection die.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: November 28, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Christopher A. Leonard, Anthony M. Fuller
  • Publication number: 20230378007
    Abstract: A package assembly includes a package substrate, an interposer module on the package substrate, and a package lid on the interposer module and attached to the package substrate. The package lid includes an outer lid including an outer lid material and including an outer lid plate portion. The package lid further includes an inner lid including an inner lid material different than the outer lid material and including an inner lid plate portion attached to a bottom surface of the outer lid plate portion.
    Type: Application
    Filed: May 23, 2022
    Publication date: November 23, 2023
    Inventors: Yu-Sheng Lin, Shu-Shen Yeh, Chien-Shen Chen, Po-Yao Lin, Shin-Puu Jeng, Ming-Chih Yew, Chin-Hua Wang, Po-Chen Lai, Chia-Kuei Hsu
  • Publication number: 20230378024
    Abstract: A ring structure on a package substrate is divided into at least four different components, including a plurality of first pieces and a plurality of second pieces. By dividing the ring structure into at least four different components, the ring structure reduces flexibility of the package substrate, which thus reduces stress on a molding compound (e.g., in a range from approximately 1% to approximately 10%). As a result, molding cracking is reduced, which reduces defect rates and increases yield. Accordingly, raw materials, power, and processing resources are conserved that would otherwise be consumed with manufacturing additional packages when defect rates are higher.
    Type: Application
    Filed: May 17, 2022
    Publication date: November 23, 2023
    Inventors: Yu-Sheng LIN, Chien Hung CHEN, Po-Chen LAI, Chin-Hua WANG, Shin-Puu JENG
  • Publication number: 20230356527
    Abstract: In various examples, a fluid ejection device may include a fluid ejection die formed with a first material and that includes a bondpad and a plurality of fluid ejectors, and a cover layer adjacent the fluid ejection die. The cover may be formed with a second material that is different than the first material and may include a first region that overlays the bondpad and a second region that overlays the plurality of fluid ejectors. In various examples, the first and second regions are separated by a break in the cover layer. The break may be filled with a third material that is different than one or both of the first and second material.
    Type: Application
    Filed: July 14, 2023
    Publication date: November 9, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Anthony M. Fuller, Chien-Hua Chen
  • Patent number: 11807523
    Abstract: Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.
    Type: Grant
    Filed: September 22, 2021
    Date of Patent: November 7, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Devin A. Mourey, Michael G. Groh
  • Patent number: 11780227
    Abstract: At times, devices, such as semiconductor devices, may be attached to molded structures. The molded structure may have through holes or channels through which fluids and gasses (among other things) may travel, A number of processes exist for creating molded structures with through holes or channels. For instance, build up processes, such as lithography on dry film, may be used to create molded structures with through holes or channels. Substrate bonding and/or welding may also be used to yield molded structures with through holes or channels.
    Type: Grant
    Filed: June 25, 2019
    Date of Patent: October 10, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W Cumbie, Michael G Groh
  • Patent number: 11780226
    Abstract: A fluid ejection device can include a nozzle plate incorporating a non-coplanar surface. The non-coplanar surface can include a hydrophilic region of a hydrophilic material having a water contact angle from about 50° to about 90° and a hydrophobic coating including a hydrophobic material having a water contact angle from about 91° to about 160°.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: October 10, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael G. Groh, Bo Song, Veronica Frances Burnett Krim
  • Publication number: 20230278231
    Abstract: A robot gripper for moving wafer carriers and packing materials and a method of operating the same are provided. The gripper mechanism has two clamp assemblies, each with a support pin at the bottom. The clamps are configured to move towards or away from each other, and the support pins are configured to move relative to the clamp assemblies. The first clamp assembly has a main clamp and a secondary clamp with a protrusion, while the second clamp assembly has a similar configuration.
    Type: Application
    Filed: May 12, 2023
    Publication date: September 7, 2023
    Inventors: CHIEN-FA LEE, FENG-KUANG WU, FU-CHENG HUNG, CHI-WEI CHEN, CHIH-HUA CHEN
  • Publication number: 20230283951
    Abstract: A microphone system is disclosed, comprising: a microphone array and a processing unit. The microphone array comprises Q microphones that detect sound and generate Q audio signals. The processing unit is configured to perform operations comprising: spatial filtering over the Q audio signals using a trained model based on at least one target beam area (TBA) and coordinates of the Q microphones to generate a beamformed output signal originated from ? target sound source inside the at least one TBA, where ?>=0. Each TBA is defined by r time delay ranges for r combinations of two microphones out of the Q microphones, where Q>=3 and r>=1. A dimension of a first number for locations of all sound sources able to be distinguished by the processing unit increases as a dimension of a second number for a geometry formed by the Q microphones increases.
    Type: Application
    Filed: October 26, 2022
    Publication date: September 7, 2023
    Inventors: HSUEH-YING LAI, CHIH-SHENG CHEN, CHIEN-HUA HSU, Hua-Jun HONG, TSUNG-LIANG CHEN
  • Patent number: 11745507
    Abstract: In various examples, a fluid ejection device may include a fluid ejection die formed with a first material and that includes a bondpad and a plurality of fluid ejectors, and a cover layer adjacent the fluid ejection die. The cover may be formed with a second material that is different than the first material and may include a first region that overlays the bondpad and a second region that overlays the plurality of fluid ejectors. In various examples, the first and second regions are separated by a break in the cover layer. The break may be filled with a third material that is different than one or both of the first and second material.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: September 5, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Anthony M. Fuller, Chien-Hua Chen
  • Publication number: 20230273524
    Abstract: An electron beam lithography system and an electron beam lithography process are disclosed herein for improving throughput. An exemplary method for increasing throughput achieved by an electron beam lithography system includes receiving an integrated circuit (IC) design layout that includes a target pattern, wherein the electron beam lithography system implements a first exposure dose to form the target pattern on a workpiece based on the IC design layout. The method further includes inserting a dummy pattern into the IC design layout to increase a pattern density of the IC design layout to greater than or equal to a threshold pattern density, thereby generating a modified IC design layout. The electron beam lithography system implements a second exposure dose that is less than the first exposure dose to form the target pattern on the workpiece based on the modified IC design layout.
    Type: Application
    Filed: December 12, 2022
    Publication date: August 31, 2023
    Inventors: Shih-Ming Chang, Wen Lo, Chun-Hung Liu, Chia-Hua Chang, Hsin-Wei Wu, Ta-Wei Ou, Chien-Chih Chen, Chien-Cheng Chen
  • Patent number: 11742459
    Abstract: A light-emitting device comprises a semiconductor stack; a pad electrode comprising a periphery disposed on the semiconductor stack; and a finger electrode connected to the pad electrode, wherein the finger electrode comprises a first portion extended from the periphery of the pad electrode and a second portion away from the pad electrode, the first portion comprises a first side and a second side, the first side is opposite to the second side, the first side comprises a first arc having a first curvature radius, and the first curvature radius is larger than 10 ?m.
    Type: Grant
    Filed: August 2, 2022
    Date of Patent: August 29, 2023
    Assignee: EPISTAR CORPORATION
    Inventors: Chien-Hua Chou, Tai-Chun Wang, Chih-Tsung Su, Biau-Dar Chen
  • Publication number: 20230264197
    Abstract: A microfluidic package may include a fluid passage, a substrate having a substrate surface adjacent an interior of the fluid passage and components inset in the substrate, the components having component surfaces adjacent the fluid passage and substantially flush with the substrate surface.
    Type: Application
    Filed: April 28, 2023
    Publication date: August 24, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie
  • Publication number: 20230261036
    Abstract: A semiconductor device package includes a substrate, a first patterned conductive layer, a second patterned conductive layer, a dielectric layer, a third patterned conductive layer and a connector. The substrate has a top surface. The first patterned conductive layer is on the top surface of the substrate. The second patterned conductive layer contacts the first patterned conductive layer. The second patterned conductive layer includes a first portion, a second portion and a third portion. The second portion is connected between the first portion and the third portion. The dielectric layer is on the top surface of the substrate. The dielectric layer covers the first patterned conductive layer and surrounds the second portion and the third portion of the second patterned conductive layer. The first portion of the second patterned conductive layer is disposed on the dielectric layer.
    Type: Application
    Filed: April 25, 2023
    Publication date: August 17, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chien-Hua CHEN, Teck-Chong LEE
  • Patent number: 11721636
    Abstract: A circuit die may include an outermost circuit layer having electrical transmission routing and an alignment target overlying the outermost circuit layer.
    Type: Grant
    Filed: April 15, 2018
    Date of Patent: August 8, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Anthony M. Fuller, Michael W. Cumbie, Chien-Hua Chen
  • Patent number: 11691423
    Abstract: Aspects of the present disclosure are directed to forming a layer of material on a print head. As may be implemented in a manner consistent with examples herein, a layer of material from a transfer film is pressed against a surface of a print head, in which the surface defines fluid nozzle openings that extend from the surface into the print head. Portions of the material pressed onto the surface are therein adhered to the surface and caused to wrap over edges of the surface extending around the openings. The transfer film is removed along with a thickness of the material pressed into contact with the surface that remains adhered to the transfer film, as well as some or all of other regions of the material over the openings. The remaining layer of the material on the surface is thus formed with a uniform thickness.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: July 4, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael G. Groh, Bo Song
  • Patent number: 11691431
    Abstract: A fluid circulation and ejection system may include a microfluidic die, a single orifice fluid ejector having a drive chamber in the microfluidic die and a pressurized fluid source remote from the microfluidic die to create a pressure gradient across the drive chamber to circulate fluid across the drive chamber.
    Type: Grant
    Filed: March 18, 2022
    Date of Patent: July 4, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Si-lam Choy, Michael W. Cumbie, Chien-Hua Chen