Patents by Inventor Chien Hua Chen

Chien Hua Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10557798
    Abstract: A housing may include sidewalls and a base extending between and supported by the sidewalls. The base and the sidewalls form a cavity. The housing support they substrate. The substrate supports a surface enhanced luminescence stage between the substrate and the base.
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: February 11, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Devin A. Mourey
  • Patent number: 10559512
    Abstract: A method of molding a circuit may include depositing a first epoxy mold compound (EMC) over a cavity, upon the first EMC gelling over a predetermined period of time, depositing a second EMC over the first EMC, and depositing a circuit in at least one of the first and second epoxy mold compounds. A circuit package may include a packaging and a circuit device in the packaging, wherein the packaging comprises a first EMC with a first CTE and a second EMC with a second CTE higher than the first CTE, the second EMC being dispensed onto the first EMC after the first EMC is allowed to gel to a predetermined degree.
    Type: Grant
    Filed: November 16, 2015
    Date of Patent: February 11, 2020
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Stephen Farrar
  • Patent number: 10557391
    Abstract: An incineration system includes an inlet channel supplying an inlet stream comprising a waste gas containing at least one volatile organic compound, a waste gas sensor measuring at least one property of the waste gas, an oxidizing gas supply controllably providing oxidizing gas to the inlet channel, an incinerator receiving the inlet stream from the inlet channel, an ignitor initiating combustion of the inlet stream in the reaction zone of the incinerator, and a controller receiving data from the waste gas sensor and controlling flow of oxidizing gas from the oxidizing gas supply into the inlet channel. The spiral heat exchanger defines a reaction zone, an incoming path from the inlet channels to the reaction zone, and an outgoing path from the reaction zone to an exhaust channel. The incoming path and the outgoing path extend in alternating concentric spirals with the incoming path being countercurrent to the outgoing path.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: February 11, 2020
    Assignee: ADVANCED COOLING TECHNOLOGIES, INC.
    Inventors: Chien-Hua Chen, Bradley Richard, Howard Pearlman, Joel Crawmer
  • Publication number: 20200038872
    Abstract: An apparatus includes a polymer base layer having a surface. A die that includes a fluid manipulation surface that is substantially coplanar with the surface of the polymer base layer. The die includes a control electrode to generate an electric field to perform microfluidic manipulation of fluid across the fluid manipulation surface of the die.
    Type: Application
    Filed: April 21, 2017
    Publication date: February 6, 2020
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Viktor SHKOLNIKOV, Chien-Hua CHEN
  • Publication number: 20200035654
    Abstract: A semiconductor package structure includes a plurality of transducer devices, a cap structure, at least one redistribution layer (RDL) and a protection material. The transducer devices are disposed side by side. Each of the transducer devices has at least one transducing region, and includes a die body and at least one transducing element. The die body has a first surface and a second surface opposite to the first surface. The transducing region is disposed adjacent to the first surface of the die body. The transducing element is disposed adjacent to the first surface of the die body and within the transducing region. The cap structure covers the transducing region of the transducer device to form an enclosed space. The redistribution layer (RDL) electrically connects the transducer devices. The protection material covers the transducer devices.
    Type: Application
    Filed: July 22, 2019
    Publication date: January 30, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chien-Hua CHEN, Cheng-Yuan KUNG
  • Publication number: 20200031126
    Abstract: A printhead includes a number of inkjet slivers molded into a moldable substrate. The overmolded inkjet slivers form at least one die. The printhead also includes a number of wire bonds electrically coupling the inkjet slivers to a side connector. The side connector electrically couples the inkjet slivers to a controller of a printing device.
    Type: Application
    Filed: October 7, 2019
    Publication date: January 30, 2020
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W Cumbie
  • Publication number: 20200023641
    Abstract: A method of forming a printbar module may include providing a printed circuit board (PCB) having a recess extending partially through the PCB and a dam surrounding the recess. An adhesive material may be applied to the recess and a printhead die sliver may be positioned in the recess. The printhead die sliver may be bonded with the PCB and the printhead die sliver and the PCB may be encapsulated with a molding compound. In response to encapsulating, a slot, extending through the PCB and the adhesive material may be formed, wherein the slot is in fluidic communication with fluid feed holes of the printhead die sliver to provide direct fluidic communication without fan-out.
    Type: Application
    Filed: August 15, 2019
    Publication date: January 23, 2020
    Inventors: Chien-Hua Chen, Michael W. Cumbie
  • Publication number: 20200019065
    Abstract: Embodiments described provide dynamic imaging systems that compensates for pattern defects resulting from distortion caused by warpage of the substrate. The methods and apparatus described are useful to create compensated exposure patterns. The dynamic imaging system includes an inspection system configured to provide 3D profile measurements and die shift measurements of the first substrate to the interface configured to provide compensated pattern data to the digital lithography system configured to receive the compensated pattern data from the interface and expose the photoresist with a compensated pattern.
    Type: Application
    Filed: July 10, 2018
    Publication date: January 16, 2020
    Inventors: Ching-Chang CHEN, Chien-Hua LAI, Wei-Chung CHEN, Shih-Hao KUO, Hsiu-Jen WANG
  • Publication number: 20200003601
    Abstract: A fluid reservoir may include a number of metal traces along a wall of the fluid reservoir, and a number of fuse circuits along a length of the metal traces. Each of the fuse circuits may include a fuse along a length of a respective metal trace, and a number of parasitic resistive elements in parallel to the fuse. The parasitic resistive elements reduce current flow through the fuse in the presence of a fluid contained within the fluid reservoir.
    Type: Application
    Filed: February 23, 2017
    Publication date: January 2, 2020
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Ning GE, Chien-Hua Chen, Alexander Govyadinov
  • Publication number: 20190389220
    Abstract: A fluid ejection device may include a fluid ejection die embedded in a moldable material, and a number of heat exchangers thermally coupled to an ejection side of the fluid ejection die. Further, the fluid ejection device may include a number of cooling channels defined in the moldable material thermally coupled to the heat exchangers.
    Type: Application
    Filed: March 15, 2017
    Publication date: December 26, 2019
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, Michael W Cumbie, James R Przybyla
  • Publication number: 20190393297
    Abstract: A capacitor bank structure includes a plurality of capacitors, a protection material, a first dielectric layer and a plurality of first pillars. The capacitors are disposed side by side. Each of the capacitors has a first surface and a second surface opposite to the first surface, and includes a plurality of first electrodes and a plurality of second electrodes. The first electrodes are disposed adjacent to the first surface for external connection, and the second electrodes are disposed adjacent to the second surface for external connection. The protection material covers the capacitors, sidewalls of the first electrodes and sidewalls of the second electrodes, and has a first surface corresponding to the first surface of the capacitor and a second surface corresponding to the second surface of the capacitor. The first dielectric layer is disposed on the first surface of the protection material, and defines a plurality of openings to expose the first electrodes.
    Type: Application
    Filed: June 20, 2019
    Publication date: December 26, 2019
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Yuan KUNG, Chien-Hua CHEN, Teck-Chong LEE, Hung-Yi LIN, Pao-Nan LEE, Hsin Hsiang WANG, Min-Tzu HSU, Po-Hao CHEN
  • Patent number: 10513070
    Abstract: A method includes placing a package structure into a mold chase, with top surfaces of device dies in the package structure contacting a release film in the mold chase. A molding compound is injected into an inner space of the mold chase through an injection port, with the injection port on a side of the mold chase. During the injection of the molding compound, a venting step is performed through a first venting port and a second venting port of the mold chase. The first venting port has a first flow rate, and the second port has a second flow rate different from the first flow rate.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: December 24, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Bor-Ping Jang, Yeong-Jyh Lin, Chien Ling Hwang, Chung-Shi Liu, Meng-Tse Chen, Ming-Da Cheng, Chen-Hua Yu
  • Patent number: 10515945
    Abstract: A semiconductor device includes a first conductive structure directly over an isolation structure; a second conductive structure directly over an active region; a first dielectric layer over the first and second conductive structures; a second dielectric layer over the first dielectric layer, wherein the first and second dielectric layers include different materials; a first conductive feature contacting the first conductive structure through at least the first and second dielectric layers; and a second conductive feature contacting the second conductive structure through at least the first and second dielectric layers, wherein the first and second conductive features include a same metal.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: December 24, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chih Wei Lu, Chung-Ju Lee, Chien-Hua Huang, Hsiang-Ku Shen, Zhao-Cheng Chen
  • Patent number: 10509193
    Abstract: A driving mechanism includes a frame, a carrying base, and a drive module. The carrying base is disposed in the frame, and includes a carrying body, a first stop element and a second stop element. The carrying body is configured to carry an optical element. The first stop element is disposed on the carrying body, and configured to limit the range of motion of the carrying body in a first direction. The second stop element is disposed on the carrying body, and configured to limit the range of motion of the carrying body in the first direction. The driving module is disposed in the frame, and configured to move the carrying body relative to the frame. The first direction is parallel to the axis of the optical element, and the first stop element is closer to the top portion of the frame than the second stop element.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: December 17, 2019
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Bing-Ru Song, Yi-Ho Chen, Chia-Pin Hsu, Chih-Wei Weng, Shin-Hua Chen, Chien-Lun Huang, Chao-Chun Chang, Shou-Jen Liu, Kun-Shih Lin, Nai-Wen Hsu, Yu-Cheng Lin, Shang-Yu Hsu, Yu-Huai Liao, Yi-Hsin Nieh, Shih-Ting Huang, Kuo-Chun Kao, Fu-Yuan Wu
  • Publication number: 20190377218
    Abstract: To prevent arcing discharge of a liquid crystal device. Provided is a liquid crystal device including a liquid crystal layer, a first substrate, a second substrate and an insulating film, wherein the liquid crystal layer is arranged between the first substrate and the second substrate, the first substrate includes electrode 1, the second substrate includes electrode 2, the insulating film is arranged between electrode 1 and electrode 2, and the insulating film is a cured product of a thermosetting polymer composition.
    Type: Application
    Filed: June 6, 2019
    Publication date: December 12, 2019
    Applicant: JNC CORPORATION
    Inventors: CHIEN CHENG LIU, YI CHENG LAN, YI PIN LEE, REN LUNG CHEN, KUIE HUA HSIEH, CHUN HUNG CHIANG, Hiroaki FUJITA
  • Patent number: 10505076
    Abstract: A light-emitting device comprises a semiconductor stack; a pad electrode comprising a periphery disposed on the semiconductor stack; and a finger electrode connected to the pad electrode, wherein the finger electrode comprises a first portion extended from the periphery of the pad electrode and a second portion away from the pad electrode, the first portion comprises a first side and a second side, the first side is opposite to the second side, the first side comprises a first arc having a first curvature radius, and the first curvature radius is larger than 10 ?m.
    Type: Grant
    Filed: December 24, 2018
    Date of Patent: December 10, 2019
    Assignee: Epistar Corporation
    Inventors: Chien-Hua Chou, Tai-Chun Wang, Chih-Tsung Su, Biau-Dar Chen
  • Patent number: 10500859
    Abstract: In some examples, a print cartridge comprises a printhead die that includes a die sliver molded into a molding. The die sliver includes a front surface exposed outside the molding to dispense fluid, and a back surface exposed outside the molding and flush with the molding to receive fluid. Edges of the die sliver contact the molding to form a joint between the die sliver and the molding.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: December 10, 2019
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie
  • Publication number: 20190369499
    Abstract: Embodiments herein beneficially enable simultaneous processing of a plurality of substrates in a digital direct write lithography processing system. In one embodiment a method of processing a plurality of substrate includes positioning a plurality of substrates on a substrate carrier of a processing system, positioning the substrate carrier under the plurality of optical modules, independently leveling each of the plurality of substrates, determining offset information for each of the plurality of substrates, generating patterning instructions based on the offset information for each of the plurality of substrates, and patterning each of the plurality of substrates using the plurality of optical modules. The processing system comprises a base, a motion stage disposed on the base, the substrate carrier disposed on the motion stage, a bridge disposed above a surface of the base and separated therefrom, and a plurality of optical modules disposed on the bridge.
    Type: Application
    Filed: March 19, 2019
    Publication date: December 5, 2019
    Inventors: Chien-Hua LAI, Chia-Hung KAO, Hsiu-Jen WANG, Shih-Hao KUO, Yi-Sheng LIU, Shih-Hsien LEE, Ching-Chang CHEN, Tsu-Hui YANG
  • Publication number: 20190368911
    Abstract: A liquid level sensor circuit for measuring a liquid level in the reservoir comprising two electrodes extending into the reservoir along at least part of a height of the reservoir down to a base of the reservoir, wherein the liquid level sensor circuit is arranged to have increased sensitivity near the base.
    Type: Application
    Filed: March 14, 2017
    Publication date: December 5, 2019
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, William R. Boucher, Michael W. Cumbie
  • Publication number: 20190366719
    Abstract: In an example, a method for making a fluid ejection apparatus may include forming a molding material over a fluid passage on a back surface of printhead die, embedding the printhead die in an encapsulant in a cavity in a printed circuit board such that at least one drop ejector of the printhead die is exposed at a front side of the printed circuit board, removing the encapsulant at a back side of the printed circuit board to expose the molding material, and removing the molding material to form a fluid feed slot through which fluid may flow to the fluid passage opening in the printhead die.
    Type: Application
    Filed: August 14, 2019
    Publication date: December 5, 2019
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Devin Alexander Mourey