Patents by Inventor Chien Hua Chen

Chien Hua Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Curved fluid ejection devices
    Patent number: 11351787
    Abstract: A curved fluid ejection device may include a plurality of fluid ejection dies overmolded with at least one layer of epoxy mold compound (EMC). Each of the fluid ejection dies and the EMC include a coefficient of thermal expansion (CTE). The combination of the CTE of the fluid ejection dies and the CTE of the at least one layer of EMC defines a curve within the curved fluid ejection device.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: June 7, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Si-Iam J. Choy
  • Fluid ejection dies
    Patent number: 11331915
    Abstract: A fluid ejection device may include a fluid ejection die embedded in a moldable material, a number of fluid actuators within the fluid ejection die to recirculate fluid within a number of firing chambers of the fluid ejection die, and a number of cooling channels defined in the moldable material thermally coupled to the fluid ejection die.
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: May 17, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie
  • COPLANAR MODULAR PRINTBARS
    Publication number: 20220143883
    Abstract: In various examples, a printbar is formed from multiple modular fluid ejection subassemblies joined together through a molding process that provides for a continuous planar substrate surface. A mold may secure the modular fluid ejection subassemblies during a molding process in which a runner conveys a molding material to seams between the joined modular fluid ejection subassemblies.
    Type: Application
    Filed: July 26, 2019
    Publication date: May 12, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Si-lam J. Choy, Michael W. Cumbie
  • UNIFORM PRINT HEAD SURFACE COATING
    Publication number: 20220143978
    Abstract: Aspects of the present disclosure are directed to forming a layer of material on a print head. As may be implemented in a manner consistent with examples herein, a layer of material from a transfer film is pressed against a surface of a print head, in which the surface defines fluid nozzle openings that extend from the surface into the print head. Portions of the material pressed onto the surface are therein adhered to the surface and caused to wrap over edges of the surface extending around the openings The transfer film is removed along with a thickness of the material pressed into contact with the surface that remains adhered to the transfer film, as well as some or all of other regions of the material over the openings The remaining layer of the material on the surface is thus formed with a uniform thickness.
    Type: Application
    Filed: July 30, 2019
    Publication date: May 12, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael G. Groh, Bo Song
  • FLUID EJECTION HEAD SERVICE WITH NON-WETTING LAYER
    Publication number: 20220143980
    Abstract: A fluid ejection system may include a fluid ejection head having a fluid ejection face through which fluid ejection orifices extend, a media supply to supply a medium for receiving fluid ejected through the fluid ejection orifices and a service station. The service station may include a substrate, an applicator to coat the substrate with a non-wetting layer having a controlled thickness and an actuator to move the substrate with the non-wetting layer into contact with the fluid ejection face without wiping the fluid ejection face.
    Type: Application
    Filed: July 30, 2019
    Publication date: May 12, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael G. Groh, Glen A. Hopkins
  • Particle separation
    Patent number: 11325125
    Abstract: A fluid entrained particle separator may include an inlet passage to direct particles entrained in a fluid, a first separation passage branching from the inlet passage, a second separation passage branching from the inlet passage and electrodes to create electric field exerting a dielectrophoretic force on the particles to direct the particles to the first separation passage or the second separation passage, wherein the first separation passage, the second separation passage, the electric field and the dielectrophoretic force extend in a plane.
    Type: Grant
    Filed: April 23, 2017
    Date of Patent: May 10, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Viktor Shkolnikov, Chien-Hua Chen
  • Print head interposers
    Patent number: 11325378
    Abstract: In example implementations, a method is provided, which may include providing a carrier, applying a thermal release tape over the carrier, attaching a print head die, a drive integrated circuit (IC) and an interposer on the thermal release tape, wherein the print head die comprises ink feed holes formed in a back surface of the print head die, encapsulating the print head die, the drive IC and the interposer with an epoxy molded compound (EMC), removing the carrier and the thermal release tape, and forming a slot over an area of the EMC that covers the ink feed holes, wherein the ink feed holes are to be fluidically coupled to the slot.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: May 10, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Devin Alexander Mourey, Chien-Hua Chen
  • Fluid property sensor
    Patent number: 11318750
    Abstract: In one example, a fluid property sensor includes an electrical circuit assembly (ECA), an elongated circuit (EC), and an external interface. The EC is attached to the ECA and includes multiple point sensors distributed along a length of the EC. The external interface is electrically coupled to a proximal end of the EC. The EC and the external interface are packaged together with an encasement on both sides of the ECA to form the fluid property sensor.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: May 3, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W Cumbie, Anthony D. Studer
  • Selective release of material in thermally degradable capsule
    Patent number: 11318469
    Abstract: An example system includes a microfluidic cavity; a retaining feature within the microfluidic cavity, and a releasing feature. The retaining feature is to position capsules at a predetermined location in the microfluidic cavity. The capsules have a thermally degradable shell enclosing a material therein. The releasing feature is to selectively cause degradation of the shell to release the material into the microfluidic opening. The releasing feature is to generate heat to facilitate degradation of the shell. In some examples, the retaining feature is a physical barrier sized to prevent flow of the capsule and to allow flow of the released materials through the microfluidic cavity.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: May 3, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Viktor Shkolnikov, Chien-Hua Chen
  • MOLDED STRUCTURES WITH CHANNELS
    Publication number: 20220126577
    Abstract: An example fluidic device may comprise a fluidic die, a unitary molded structure, and a fluidic fan-out structure—The unitary molded structure may comprise thermo-electric traces and fluidic channels and may be coupled to the fluidic die. A first dimension of the fluidic channels is between ten ?m to two hundred ?m, or less. The fluidic fan-out structure may also be coupled to the molded structure. The fluidic die, the molded structure, and the fluidic fan-out structure may be arranged such that a first fluidic channel of the fluidic channels is in fluid communication with an aperture of the fluidic die at a first extremity and to a fluidic fan-out fluid channel through hole of the fluidic fan-out structure at a second extremity.
    Type: Application
    Filed: June 25, 2019
    Publication date: April 28, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Michael G. Groh
  • MOLDED STRUCTURES WITH CHANNELS
    Publication number: 20220111647
    Abstract: At times, devices, such as semiconductor devices, may be attached to molded structures. The molded structure may have through holes or channels through which fluids and gasses (among other things) may travel, A number of processes exist for creating molded structures with through holes or channels. For instance, build up processes, such as lithography on dry film, may be used to create molded structures with through holes or channels. Substrate bonding and/or welding may also be used to yield molded structures with through holes or channels.
    Type: Application
    Filed: June 25, 2019
    Publication date: April 14, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W Cumbie, Michael G Groh
  • FLUID PROPELLING APPARATUS INCLUDING A HEAT SINK
    Publication number: 20220111645
    Abstract: A fluid propelling apparatus, including a plastic compound, a MEMS at least partially surrounded by the compound, and a heat sink next to the MEMS, to transfer heat away from the MEMS, wherein the heat sink is at least partly surrounded by the compound.
    Type: Application
    Filed: December 23, 2021
    Publication date: April 14, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Garrett E. Clark, Michael W. Cumbie, Chien-Hua Chen
  • FLUID EJECTION POLYMERIC RECIRCULATION CHANNEL
    Publication number: 20220105725
    Abstract: A fluid ejection assembly may include a fluid ejection die comprising a back face and a front face through which fluid is ejected. The fluid ejection die may further include a fan-out fluid passages converging towards the back face of the fluid ejection die, the fan-out fluid passages comprising a first fan-out fluid passage and a second fan-out fluid passage and a recirculation channel extending within a polymeric material from the first fan-out fluid passage to the second fan-out fluid passage adjacent the back face of the fluid ejection die.
    Type: Application
    Filed: June 25, 2019
    Publication date: April 7, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Si-Iam J. Choy
  • Fluid circulation and ejection
    Patent number: 11292265
    Abstract: A fluid circulation and ejection system may include a microfluidic die, a single orifice fluid ejector having a drive chamber in the microfluidic die and a pressurized fluid source remote from the microfluidic die to create a pressure gradient across the drive chamber to circulate fluid across the drive chamber.
    Type: Grant
    Filed: December 2, 2017
    Date of Patent: April 5, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Si-Lam Choy, Michael W. Cumbie, Chien-Hua Chen
  • Molded die slivers with exposed front and back surfaces
    Patent number: 11292257
    Abstract: In some examples, a print cartridge comprises a printhead die that includes a die sliver molded into a molding. The die sliver includes a front surface exposed outside the molding to dispense fluid, and a back surface exposed outside the molding and flush with the molding to receive fluid. Edges of the die sliver contact the molding to form a joint between the die sliver and the molding.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: April 5, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W Cumbie
  • Chip to chip fluidic interconnect
    Patent number: 11278892
    Abstract: A device may include a substrate, a first fluid processing chip, a second fluid processing chip, a tapered channel, and a fluid actuator. The first fluid processing chip may be disposed on the substrate and may process a micro-volume of fluid. The second fluid processing chip may be disposed on the substrate and co-planar with the first fluid processing chip. The second fluid processing chip may process at least a portion of the micro-volume of fluid. The tapered channel may be disposed between the first and second fluid processing chips to transport the at least the portion of the micro-volume of fluid from the first fluid processing chip to the second fluid processing chip. The fluid actuator may be disposed proximate to the tapered channel and may control movement of the at least the portion of the micro-volume of fluid within the tapered channel.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: March 22, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Viktor Shkolnikov, Chien-Hua Chen
  • Microfluidic chip
    Patent number: 11278887
    Abstract: A microfluidic device is provided that includes a substrate and microfluidic sub-chips embedded in the substrate. An electric field is applied between an adjacent pair microfluidic sub-chips to move a fluid droplet from one of the adjacent pair of microfluidic sub-chips to another of the adjacent pair microfluidic sub-chips.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: March 22, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Viktor Shkolnikov, Michael W. Cumbie, Chien-Hua Chen
  • FLUID EJECTION DEVICE WITH BREAK(S) IN COVER LAYER
    Publication number: 20220072858
    Abstract: In various examples, a fluid ejection device may include a fluid ejection die formed with a first material and that includes a bondpad and a plurality of fluid ejectors, and a cover layer adjacent the fluid ejection die. The cover may be formed with a second material that is different than the first material and may include a first region that overlays the bondpad and a second region that overlays the plurality of fluid ejectors. In various examples, the first and second regions are separated by a break in the cover layer. The break may be filled with a third material that is different than one or both of the first and second material.
    Type: Application
    Filed: April 29, 2019
    Publication date: March 10, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Anthony M. Fuller, Chien-Hua Chen
  • CURVED FLUID EJECTION DEVICES
    Publication number: 20220032626
    Abstract: A curved fluid ejection device may include a plurality of fluid ejection dies overmolded with at least one layer of epoxy mold compound (EMC). Each of the fluid ejection dies and the EMC include a coefficient of thermal expansion (CTE). The combination of the CTE of the fluid ejection dies and the CTE of the at least one layer of EMC defines a curve within the curved fluid ejection device.
    Type: Application
    Filed: November 21, 2018
    Publication date: February 3, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Si-lam J. Choy
  • Fluid propelling apparatus including a heat sink
    Patent number: 11235574
    Abstract: A fluid propelling apparatus, including a plastic compound, a MEMS at least partially surrounded by the compound, and a heat sink next to the MEMS, to transfer heat away from the MEMS, wherein the heat sink is at least partly surrounded by the compound.
    Type: Grant
    Filed: February 29, 2016
    Date of Patent: February 1, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Garrett E. Clark, Michael W. Cumbie, Chien-Hua Chen