Patents by Inventor Chien Hua Chen

Chien Hua Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Molded die slivers with exposed front and back surfaces
    Patent number: 11292257
    Abstract: In some examples, a print cartridge comprises a printhead die that includes a die sliver molded into a molding. The die sliver includes a front surface exposed outside the molding to dispense fluid, and a back surface exposed outside the molding and flush with the molding to receive fluid. Edges of the die sliver contact the molding to form a joint between the die sliver and the molding.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: April 5, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W Cumbie
  • Fluid circulation and ejection
    Patent number: 11292265
    Abstract: A fluid circulation and ejection system may include a microfluidic die, a single orifice fluid ejector having a drive chamber in the microfluidic die and a pressurized fluid source remote from the microfluidic die to create a pressure gradient across the drive chamber to circulate fluid across the drive chamber.
    Type: Grant
    Filed: December 2, 2017
    Date of Patent: April 5, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Si-Lam Choy, Michael W. Cumbie, Chien-Hua Chen
  • Microfluidic chip
    Patent number: 11278887
    Abstract: A microfluidic device is provided that includes a substrate and microfluidic sub-chips embedded in the substrate. An electric field is applied between an adjacent pair microfluidic sub-chips to move a fluid droplet from one of the adjacent pair of microfluidic sub-chips to another of the adjacent pair microfluidic sub-chips.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: March 22, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Viktor Shkolnikov, Michael W. Cumbie, Chien-Hua Chen
  • Chip to chip fluidic interconnect
    Patent number: 11278892
    Abstract: A device may include a substrate, a first fluid processing chip, a second fluid processing chip, a tapered channel, and a fluid actuator. The first fluid processing chip may be disposed on the substrate and may process a micro-volume of fluid. The second fluid processing chip may be disposed on the substrate and co-planar with the first fluid processing chip. The second fluid processing chip may process at least a portion of the micro-volume of fluid. The tapered channel may be disposed between the first and second fluid processing chips to transport the at least the portion of the micro-volume of fluid from the first fluid processing chip to the second fluid processing chip. The fluid actuator may be disposed proximate to the tapered channel and may control movement of the at least the portion of the micro-volume of fluid within the tapered channel.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: March 22, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Viktor Shkolnikov, Chien-Hua Chen
  • FLUID EJECTION DEVICE WITH BREAK(S) IN COVER LAYER
    Publication number: 20220072858
    Abstract: In various examples, a fluid ejection device may include a fluid ejection die formed with a first material and that includes a bondpad and a plurality of fluid ejectors, and a cover layer adjacent the fluid ejection die. The cover may be formed with a second material that is different than the first material and may include a first region that overlays the bondpad and a second region that overlays the plurality of fluid ejectors. In various examples, the first and second regions are separated by a break in the cover layer. The break may be filled with a third material that is different than one or both of the first and second material.
    Type: Application
    Filed: April 29, 2019
    Publication date: March 10, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Anthony M. Fuller, Chien-Hua Chen
  • CURVED FLUID EJECTION DEVICES
    Publication number: 20220032626
    Abstract: A curved fluid ejection device may include a plurality of fluid ejection dies overmolded with at least one layer of epoxy mold compound (EMC). Each of the fluid ejection dies and the EMC include a coefficient of thermal expansion (CTE). The combination of the CTE of the fluid ejection dies and the CTE of the at least one layer of EMC defines a curve within the curved fluid ejection device.
    Type: Application
    Filed: November 21, 2018
    Publication date: February 3, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Si-lam J. Choy
  • Coplanar microfluidic manipulation
    Patent number: 11235328
    Abstract: An apparatus includes a polymer base layer having a surface. A die that includes a fluid manipulation surface that is substantially coplanar with the surface of the polymer base layer. The die includes a control electrode to generate an electric field to perform microfluidic manipulation of fluid across the fluid manipulation surface of the die.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: February 1, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Viktor Shkolnikov, Chien-Hua Chen
  • Fluid propelling apparatus including a heat sink
    Patent number: 11235574
    Abstract: A fluid propelling apparatus, including a plastic compound, a MEMS at least partially surrounded by the compound, and a heat sink next to the MEMS, to transfer heat away from the MEMS, wherein the heat sink is at least partly surrounded by the compound.
    Type: Grant
    Filed: February 29, 2016
    Date of Patent: February 1, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Garrett E. Clark, Michael W. Cumbie, Chien-Hua Chen
  • Two-step molding for a lead frame
    Patent number: 11227807
    Abstract: Examples for a two-step insert molding process to encapsulate a pre-molded lead frame (104, 304, 504, 704) are described herein. In some examples, a first circuit component (106, 306, 506) and a first portion of a trace array (110, 310, 510) of the pre-molded lead frame for an integrated circuit (1C) assembly are encapsulated by a first insert molding component (112, 312, 512a, 512b, 712). The trace array connects the first circuit component to a second circuit component (108, 308, 508) of the pre-molded lead frame. A second portion of the trace array is encapsulated by a second insert molding component (114, 314, 514, 714).
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: January 18, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Chien-Hua Chen
  • Thermal contact dies
    Patent number: 11225086
    Abstract: A thermal contact device may include a thermal contact die embedded in a moldable material. The thermal contact die may include a number of resistors integrated into the thermal contact die, and a number of heater drivers integrated into the thermal contact die and electronically coupled to the resistors. The moldable material is coplanar with a thermal contact side of the thermal contact device. Further, the moldable material includes at least one gradient edge along a medium feed path.
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: January 18, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W Cumbie, Reynaldo V Villavelez, Chien-Hua Chen
  • Fluidic dies with inlet and outlet channels
    Patent number: 11225074
    Abstract: In one example in accordance with the present disclosure, a fluidic ejection die is described. The die includes an array of nozzles. Each nozzle includes an ejection chamber, an opening, and a fluid actuator disposed within the ejection chamber. Each nozzle also includes an inlet passage to deliver fluid into the ejection chamber and an outlet passage to deliver fluid out of the ejection chamber. The fluidic ejection die also includes an array of channels divided into inlet channels and outlet channels. Each inlet channel is fluidly connected to a respective plurality of inlet passages and each outlet channel is fluidly connected to a respective plurality of outlet passages.
    Type: Grant
    Filed: September 11, 2017
    Date of Patent: January 18, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Chien-Hua Chen
  • APPLYING MOLD CHASE STRUCTURE TO END PORTION OF FLUID EJECTION DIE
    Publication number: 20220009231
    Abstract: A method includes applying a mold chase to a fluid ejection die to at least partially define at least one cavity. The mold chase includes a feature to contact a fluid ejection portion of the fluid ejection die, and at least one structure separate from the feature to contact a first end portion adjacent a first end of the fluid ejection die. The method includes filling the at least one cavity with a mold compound to produce a molded carrier for the fluid ejection die.
    Type: Application
    Filed: February 6, 2019
    Publication date: January 13, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Christopher A. Leonard, Anthony M. Fuller
  • THREE-DIMENSIONAL FEATURES FORMED IN MOLDED PANEL
    Publication number: 20220002149
    Abstract: Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.
    Type: Application
    Filed: September 22, 2021
    Publication date: January 6, 2022
    Inventors: Chien-Hua Chen, Devin A. Mourey, Michael G. Groh
  • IMAGE IDENTIFICATION METHOD AND SYSTEM
    Publication number: 20220005173
    Abstract: An image identification method is provided, including: storing at least one normal state image of at least one test object; an automatic codec receiving the at least one normal state image to become a trained automatic codec; at least one camera device capturing at least one state image of the at least one test object; a computer device receiving the at least one state image, and the trained automatic codec performing feature extraction and reconstruction on the at least one state image to generate at least one reconstructed state image; and the computer device comparing the at least one state image and the at least one reconstructed state image, and determining whether the at least one state image is a normal state image. The present invention also provides an image identification system.
    Type: Application
    Filed: June 23, 2021
    Publication date: January 6, 2022
    Inventors: Wen Jyi Hwang, Chien Hua Chen, Chien Wei Chen
  • Deformable covers on sensors and reservoirs
    Patent number: 11215562
    Abstract: Examples include a fluid device. The fluid device includes a substrate, a sensor coupled on the substrate. A reservoir is formed in the substrate adjacent to the sensor. A deformable cover is disposed to seal the sensor and the reservoir on the substrate.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: January 4, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael Cumbie, Viktor Shkolnikov
  • Fluid ejection die interlocked with molded body
    Patent number: 11214065
    Abstract: A fluid ejection device includes a fluid ejection die including a substrate and a fluid architecture supported by the substrate, and a molded body molded around the fluid ejection die, with the molded body interlocked with the fluid architecture of the fluid ejection die.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: January 4, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W Cumbie, Chien-Hua Chen
  • CIRCUIT DIE ALIGNMENT TARGET
    Publication number: 20210402782
    Abstract: A circuit die may include an outermost circuit layer having electrical transmission routing and an alignment target overlying the outermost circuit layer.
    Type: Application
    Filed: April 15, 2018
    Publication date: December 30, 2021
    Inventors: Anthony M. Fuller, Michael W. Cumbie, Chien-Hua Chen
  • Semiconductor package and semiconductor process
    Patent number: 11201125
    Abstract: The present disclosure relates to a semiconductor package and a method of manufacturing the same. In some embodiments, a semiconductor package includes a substrate, at least one die, a sealing ring and an inductor. The at least one die is mounted on the substrate and includes a plurality of component structures operating with acoustic waves. The component structures are arranged on a side of the at least one die that faces the substrate. The sealing ring is disposed between the at least one die and the substrate and surrounds the component structures. The inductor is disposed in the substrate.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: December 14, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Sheng-Chi Hsieh, Hung-Yi Lin, Cheng-Yuan Kung, Pao-Nan Lee, Chien-Hua Chen
  • FLUIDIC DIE WITH SURFACE CONDITION MONITORING
    Publication number: 20210370668
    Abstract: One example provides a fluidic die including a nozzle layer disposed on a substrate, the nozzle layer having an upper surface opposite the substrate and including a plurality of nozzles formed therein, each nozzle including a fluid chamber and a nozzle orifice extending through the nozzle layer from the upper surface to the fluid chamber. A conductive trace is exposed to the upper surface of the nozzle layer and extends proximate to a portion of the nozzle orifices, an impedance of the conductive trace indicative of a surface condition of the upper surface of the nozzle layer.
    Type: Application
    Filed: January 31, 2019
    Publication date: December 2, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Eric Martin, Daryl E. Anderson, James R. Przybyla, Chien-Hua Chen, Diane R. Hammerstad
  • Fluid ejection device
    Patent number: 11186090
    Abstract: Examples include a fluid ejection die embedded in a molded panel. The fluid ejection die comprises a substrate, and the substrate includes an army of nozzles extending therethrough. The substrate has a first surface in which nozzle orifices are formed and a second surface, opposite the first surface, in which nozzle inlet openings are formed. The fluid ejection die is embedded in the molded panel such that the first surface of the substrate is approximately planar with a top surface of the molded panel. The molded panel has a fluid channel formed therethrough in fluid communication with the nozzle inlet openings of the array of nozzles.
    Type: Grant
    Filed: November 1, 2016
    Date of Patent: November 30, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Erik D Torniainen