Abstract: A method may include etching a number of holes into a carrier wafer layer to form a plurality of filters in the carrier wafer layer, patterning a chamber layer over a first side of the carrier wafer layer to form chambers above each filter formed in the carrier wafer layer, forming a layer over the chamber layer, grinding a second side of the carrier wafer layer to expose the number of holes etched into the carrier wafer layer, and bonding a molded substrate to the carrier wafer layer opposite the chamber layer.

Abstract: A test tube preparation device uses a labeling device to include a linking module to link a positioning unit, and the positioning unit can be used to place a tube body and finely adjust a position of the tube body relative to the label generating module of the surface treating device to complete the label generation, label conveyance, tube labeling and tube delivery, and provide a preparation device for effectively integrating the label and applying to the tube body before and after the labeling of the tube body, so as to improve the quality of the generation of the tube body and the label. Further, the present invention further provides a test tube preparation method.

Abstract: A mold assembly may include a mold frame having an opening extending in a plane and a movable mold insert adjuster to move a mold insert having a slot forming protrusion within the plane within opening.

Abstract: An example fluidic device may comprise a fluidic die and a support element coupled to the fluidic die. A fluid channel may be arranged within the support element and may define a fluid path through the support element and a fluid aperture of the fluidic die. A conductive element may be arranged in the fluid path and be coupled to a ground of the fluidic die. A material and size of the conductive element may be selected to engender galvanic effect at an approximately zero potential.

Abstract: In one example, a process for making a micro device structure includes molding a micro device in a monolithic body of material and forming a fluid flow passage in the body through which fluid can pass directly to the micro device.

Abstract: A fluid entrained particle separation system may include a particle separator, a main fluid passage extending along an axis to guide translational fluid flow along the axis to the particle separator and a side fluid inlet connected to the main fluid passage to generate a vortex about the axis. The vortex concentrates less dense material in the fluid flow towards the axis.

Abstract: An example digital microfluidics device includes a device body having a primary substrate defining a planar primary substrate surface; a plurality of droplet processing components having respective component substrates overmolded in the primary substrate in a coplanar arrangement with the primary substrate surface; and an electrical interface carried on the primary substrate surface, the electrical interface defining a planar droplet manipulation surface and carrying a set of droplet manipulation electrodes adjacent to the droplet manipulation surface; the electrical interface configured to interconnect the droplet manipulation electrodes and at least a portion of the droplet processing components.

Abstract: A loop heat pipe evaporator includes a porous primary wick, and a nonporous envelope unseparatingly surrounding the primary wick. The primary wick and the envelope are of one-piece construction.

Abstract: Methods, systems, and devices for using secured tunnels (e.g., SSH tunnels), for example with microservices-based architectures and/or operating-system level virtualization technologies, An example method may include receiving, by a secured tunnel server and via a secured tunnel, network traffic intended for a first original destination of the plurality of original destinations; selecting, using a plurality of override rules that indicate mappings between a plurality of original destinations and respective override destinations, an override destination for the network traffic intended for the first original destination; and forwarding, by the secured tunnel server, the network traffic to the override destination.

Abstract: Fluid feed paths having enhanced wettability characteristics are disclosed. An example printhead includes a nozzle to expel fluid therefrom, and a fluid feed path to fluidly couple a fluid source and the nozzle. Fluid feed path walls are composed of a first material having a first wettability characteristic and a second material having a second wettability characteristic. The second wettability characteristic differing from the first wettability characteristic. A coating is formed on at least a portion of the fluid feed path defined by the first material and the second material of the substrate. The coating to harmonize the first wettability characteristic and the second wettability characteristic.

Abstract: A fluid ejection device includes a fluid ejection die including a first end portion positioned adjacent a first end of the fluid ejection die, and a fluid ejection portion positioned adjacent the first end portion. The fluid ejection die includes a contact pad positioned in the first end portion, and a fluid actuation device positioned in the fluid ejection portion. A carrier is attached to the fluid ejection die. The carrier includes a slot to provide fluid to the fluid actuation device. The slot extends longitudinally along the fluid ejection portion to a first slot end. A length from the first slot end to the first end of the fluid ejection die is less than 1.5 mm.

Abstract: A fluidic die includes a fluid channel layer including at least one fluid channel defined along a length of the fluid ejection device. The fluidic die also includes an interposer layer coupled to the fluid channel layer. The interposer layer includes a number of inlet ports defined in the interposer layer to fluidically couple the at least one channel layer to a fluid source, and a number of outlet ports defined in the interposer layer to fluidically couple the at least one channel layer to the fluid source.

Abstract: A fluid circulation and ejection system may include a microfluidic die, a single orifice fluid ejector having a drive chamber in the microfluidic die and a pressurized fluid source remote from the microfluidic die to create a pressure gradient across the drive chamber to circulate fluid across the drive chamber.

Abstract: An apparatus includes a polymer base layer having a surface. A die has a surface that is substantially coplanar with the surface of the polymer base layer. The die includes a fluidic actuator to control fluid flow across the surface of the die. A fluidic channel is coupled to the polymer base layer to provide a fluidic interconnect between the die and a fluidic input/output port.

Abstract: A microfluidic system includes, in an example, a substrate and at least two microfluidic devices embedded into the substrate, at least one of the microfluidic devices being different from a remaining number of microfluidic devices. A microfluidic apparatus includes at least two microfluidic devices embedded into a substrate, at least a first microfluidic device of the microfluidic devices being heterogenous to at least a second microfluidic device of the microfluidic devices and a microfluidic channel to fluidically couple the microfluidic devices to each other.

Abstract: A microfluidic apparatus may include, in an example, a substrate, at least one silicon die embedded into the substrate, and a planarization layer layered over, at least, a portion of the substrate that interfaces with the silicon die to prevent a fluid from contacting an edge of the silicon die.

Abstract: A fluid ejection head may include an integrated chamber-orifice layer forming an ejection chamber and an ejection orifice, a fluid actuator to eject fluid within the chamber through the ejection orifice, an orifice shield and an adhesive layer bonding the orifice shield to the integrated chamber-orifice layer.

Abstract: A fluid ejection head may include a fluid ejection face through which fluid ejection orifices extend. A coating is selectively coated over first portions of the fluid ejection face. Second portions of the fluid ejection face omit the coating.

Abstract: Examples include a fluid ejection device comprising a carrier, at least one fluid ejection die, and conductive traces at least partially embedded in the carrier. The carrier has a first portion and a second portion, where an angle of orientation between the first portion and the second portion is nonparallel. The first portion includes an array of openings formed through a top surface of the carrier. The second portion includes at least one die opening through a bottom surface of the carrier. The fluid ejection die is coupled to the second portion of the carrier. Fluid passages formed in a back surface of the fluid ejection die are exposed through the at least one die opening formed through the bottom surface of the carrier. The conductive traces have an array of contact points at first ends of the conductive traces. The array of contact points align with the array of openings of the first portion of the carrier such that the array of contact points are exposed through the array of openings.

Abstract: A fluid property sensor may comprising an integrated circuit (IC) including a fluid level sensor, and/or a pressure sensor; and an external interface electrically coupled to a proximal end of the EC, wherein the pressure sensor may be configured to measure a flexure of the fluid property sensor.