Abstract: A fluid circulation and ejection system may include a microfluidic die, a single orifice fluid ejector having a drive chamber in the microfluidic die and a pressurized fluid source remote from the microfluidic die to create a pressure gradient across the drive chamber to circulate fluid across the drive chamber.

Abstract: An example system includes a primary channel having a first end and a second end, at least two reagent reservoirs coupled to the first end, and a controller. Each reservoir contains a reagent in a fluid solution and is associated with an integrated pump to drive a reagent droplet from the corresponding reagent reservoir into the primary channel towards the second end. The controller is coupled to the integrated pumps and operates according to a sequence to actuate the integrated pumps, the sequence being indicative of reagents in the reagent reservoirs. The actuation of the pumps is to drive the reagent droplets from the reagent reservoirs into the primary channel in accordance with the sequence. The example system also includes a shell material reservoir with a shell material and an associated shell material pump to drive the shell material into the primary channel to encapsulate the reagent droplets.

Abstract: In an example implementation, a reagent storage system for a microfluidic device includes a microfluidic chamber formed in a microfluidic device. A blister pack to store a reagent includes an electrically conductive membrane barrier adjacent to the chamber. A thinned region is formed in the membrane barrier, and a conductive trace is to supply electric current to heat and melt the thinned region. Melting the thinned region is to cause the membrane barrier to open and release the reagent into the chamber.

Abstract: A microfluidic package may include a fluid passage, a substrate having a substrate surface adjacent an interior of the fluid passage and components inset in the substrate, the components having component surfaces adjacent the fluid passage and substantially flush with the substrate surface.

Abstract: An example system includes an array of retaining features in a microfluidic cavity, an array of thermally controlled releasing features, and a controller coupled to each releasing feature in the array of releasing feature. Each retaining feature in the array of retaining features is to position capsules at a predetermined location, the capsules having a thermally degradable shell enclosing a biological reagent therein. Each releasing feature in the array of releasing features corresponds to a retaining feature and is to selectively cause degradation of the shell of a capsule. Each releasing feature is to generate thermal energy to facilitate degradation of the shell. The controller is to selectively activate at least one releasing feature in the array of thermally controlled releasing features to release the biological reagent in the capsules positioned at the retaining feature corresponding to the activated releasing feature.

Abstract: In one example in accordance with the present disclosure, a fluidic ejection die is described. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages.

Abstract: A fluid ejection device may include a fluid ejection die including nozzles and fluid feed holes. Each nozzle may have a nozzle orifice formed in a top surface of the fluid ejection die. The fluid feed holes may be formed in a bottom surface of the fluid ejection die and fluidly connected to the nozzles. The fluid ejection device may include a molded panel into which the fluid ejection die is at least partially embedded, the molded panel having a fluid slot formed therethrough such that the fluid slot is fluidly connected to the fluid feed holes of the fluid ejection die, the molded panel formed with a mold chase and a release liner coupled to and at least partially covering an interior surface of the mold chase, the mold chase having a fluid slot feature corresponding to the fluid slot.

Abstract: A fluid ejection device may include a fluid ejection die including nozzles and fluid feed holes. Each nozzle may have a nozzle orifice formed in a top surface of the fluid ejection die. The fluid feed holes may be formed in a bottom surface of the fluid ejection die and fluidly connected to the nozzles. The fluid ejection device may include a molded panel into which the fluid ejection die is at least partially embedded, the molded panel having a fluid slot formed therethrough such that the fluid slot is fluidly connected to the fluid feed holes of the fluid ejection die, the molded panel formed with a mold chase and a release liner coupled to and at least partially covering an interior surface of the mold chase, the mold chase having a fluid slot feature corresponding to the fluid slot.

Abstract: A molded microfluidic substrate includes a molding compound layer. The molded microfluidic substrate includes a microfluidic channel. The microfluidic channel of the molded microfluidic substrate is formed within the molding compound layer of the molded microfluidic substrate. The microfluidic channel of the molded microfluidic substrate corresponds to a sacrificial metal bond wire.

Abstract: A fluid ejection die includes an ejection nozzle and an ejection chamber fluidly connected to the ejection nozzle. The die includes a fluid input hole fluidly connected to the ejection chamber, a fluid output hole, and a fluid output channel fluidly connected to the ejection chamber and the fluid output hole. The die includes a fluid circulation rib positioned between the fluid input hole and the fluid output hole.

Abstract: A semiconductor device package includes a substrate, a first patterned conductive layer, a second patterned conductive layer, a dielectric layer, a third patterned conductive layer and a connector. The substrate has a top surface. The first patterned conductive layer is on the top surface of the substrate. The second patterned conductive layer contacts the first patterned conductive layer. The second patterned conductive layer includes a first portion, a second portion and a third portion. The second portion is connected between the first portion and the third portion. The dielectric layer is on the top surface of the substrate. The dielectric layer covers the first patterned conductive layer and surrounds the second portion and the third portion of the second patterned conductive layer. The first portion of the second patterned conductive layer is disposed on the dielectric layer.

Abstract: A semiconductor device package includes a glass carrier, a package body, a first circuit layer and a first antenna layer. The glass carrier has a first surface and a second surface opposite to the first surface. The package body is disposed on the first surface of the glass carrier. The package body has an interconnection structure penetrating the package body. The first circuit layer is disposed on the package body. The first circuit layer has a redistribution layer (RDL) electrically connected to the interconnection structure of the package body. The first antenna layer is disposed on the second surface of the glass carrier.

Abstract: A semiconductor package structure includes a plurality of transducer devices, a cap structure, at least one redistribution layer (RDL) and a protection material. The transducer devices are disposed side by side. Each of the transducer devices has at least one transducing region, and includes a die body and at least one transducing element. The die body has a first surface and a second surface opposite to the first surface. The transducing region is disposed adjacent to the first surface of the die body. The transducing element is disposed adjacent to the first surface of the die body and within the transducing region. The cap structure covers the transducing region of the transducer device to form an enclosed space. The redistribution layer (RDL) electrically connects the transducer devices. The protection material covers the transducer devices.

Abstract: A device includes: a die including a microfluidic device; a polymer substrate formed around the die; and a separate fluid manifold attached to the polymer substrate over the die and on a same side of the substrate as the die, the manifold to deliver fluid to the die.

Abstract: A fluid ejection assembly may include a fluid ejection die comprising a back face and a front face through which fluid is ejected. The fluid ejection die may further include a fan-out fluid passages converging towards the back face of the fluid ejection die, the fan-out fluid passages comprising a first fan-out fluid passage and a second fan-out fluid passage and a recirculation channel extending within a polymeric material from the first fan-out fluid passage to the second fan-out fluid passage adjacent the back face of the fluid ejection die.

Abstract: In an example implementation, a reagent storage system for a microfluidic device includes a microfluidic chamber formed in a microfluidic device. A blister pack to store a reagent includes an electrically conductive membrane barrier adjacent to the chamber. A thinned region is formed in the membrane barrier, and a conductive trace is to supply electric current to heat and melt the thinned region. Melting the thinned region is to cause the membrane barrier to open and release the reagent into the chamber.

Abstract: An example system includes an array of retaining features in a microfluidic cavity, an array of thermally controlled releasing features, and a controller coupled to each releasing feature in the array of releasing feature. Each retaining feature in the array of retaining features is to position capsules at a predetermined location, the capsules having a thermally degradable shell enclosing a biological reagent therein. Each releasing feature in the array of releasing features corresponds to a retaining feature and is to selectively cause degradation of the shell of a capsule. Each releasing feature is to generate thermal energy to facilitate degradation of the shell. The controller is to selectively activate at least one releasing feature in the array of thermally controlled releasing features to release the biological reagent in the capsules positioned at the retaining feature corresponding to the activated releasing feature.

Abstract: Examples include a process comprising forming a molded panel that includes a fluid ejection die molded in the molded panel. The molded panel is formed with a mold chase and a release liner. The mold chase has a fluid slot feature that aligns with fluid feed holes of the fluid ejection die. The mold chase and release liner is released from the molded panel such that the molded panel has a fluid slot formed therethrough corresponding to the fluid slot feature of the mold chase, and the fluid slot is fluidly connected to the fluid feed holes of the fluid ejection die.

Abstract: An example system includes an array of retaining features in a microfluidic cavity, an array of thermally controlled releasing features, and a controller coupled to each releasing feature in the array of releasing feature. Each retaining feature in the array of retaining features is to position capsules at a predetermined location, the capsules having a thermally degradable shell enclosing a biological reagent therein. Each releasing feature in the array of releasing features corresponds to a retaining feature and is to selectively cause degradation of the shell of a capsule. Each releasing feature is to generate thermal energy to facilitate degradation of the shell. The controller is to selectively activate at least one releasing feature in the array of thermally controlled releasing features to release the biological reagent in the capsules positioned at the retaining feature corresponding to the activated releasing feature.

Abstract: According to an example, a fluid ejection device may include a membrane including a first column of firing chambers, a second column of firing chambers, and a portioning wall, in which the portioning wall physically separates the first column of firing chambers from the second column of firing chambers. The fluid ejection device may also include a plurality of actuators and a substrate including a respective hole extending through the substrate from each of the firing chambers, in which an actuator of the plurality of actuators is provided in each of the firing chambers.