Patents by Inventor Chien Hua Chen

Chien Hua Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • FLUID EJECTION DEVICE INCLUDING FLUID OUTPUT CHANNEL
    Publication number: 20200331264
    Abstract: A fluid ejection die includes an ejection nozzle and an ejection chamber fluidly connected to the ejection nozzle. The die includes a fluid input hole fluidly connected to the ejection chamber, a fluid output hole, and a fluid output channel fluidly connected to the ejection chamber and the fluid output hole. The die includes a fluid circulation rib positioned between the fluid input hole and the fluid output hole.
    Type: Application
    Filed: June 30, 2020
    Publication date: October 22, 2020
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Michael W Cumbie, Chien-Hua Chen
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20200335458
    Abstract: A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a circuit layer, a first package body, a first antenna and an electronic component. The circuit layer has a first surface and a second surface opposite to the first surface. The first package body is disposed on the first surface of the circuit layer. The first antenna penetrates the first package body and is electrically connected to the circuit layer. The electronic component is disposed on the second surface of the circuit layer.
    Type: Application
    Filed: April 18, 2019
    Publication date: October 22, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chien-Hua CHEN, Sheng-Chi HSIEH
  • COMPLEX IMPEDANCE DETECTION
    Publication number: 20200331259
    Abstract: A printhead may include a nozzle, a firing chamber fluidly coupled to the nozzle, a printing fluid slot fluidly coupled to the firing chamber, and a sensor to detect a plurality of complex impedance values of a printing fluid at the printhead over a plurality of frequencies and create a printing fluid signature of the printing fluid. A method of determining at least one characteristic of a printing fluid provided to a printhead ma include, with a number of sensors, applying an alternating current at a plurality of frequencies over time to the printing fluid to receive a plurality of complex impedance values and comparing the plurality of complex impedance signals to a number of stored signals.
    Type: Application
    Filed: July 21, 2016
    Publication date: October 22, 2020
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua CHEN, Michael W. CUMBIE, Devin Alexander Mourey
  • FLUID FLOW STRUCTURE FORMING METHOD
    Publication number: 20200331272
    Abstract: A method for forming a fluid flow structure may include positioning rows of micro devices in a mold, wherein each of the micro devices comprising a chamber layer in which an ejection chamber is formed and an orifice layer over the chamber layer in which an orifice is formed. The method may further include molding an amorphous body to encapsulate the rows of the micro devices such that the amorphous body forms fluid channels such that each of the rows is fluidically coupled to a different one of the fluid channels.
    Type: Application
    Filed: July 2, 2020
    Publication date: October 22, 2020
    Inventors: Chien-Hua CHEN, Micheal W. CUMBIE
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20200335858
    Abstract: A semiconductor device package includes a first glass carrier, a package body, a first circuit layer and a first antenna layer. The first circuit layer is disposed on the first surface of the first glass carrier. The first circuit layer has a redistribution layer (RDL). The package body is disposed on the first circuit layer. The package body has an interconnection structure penetrating the package body and is electrically connected to the RDL of the first circuit layer. The first antenna layer is disposed on the second surface of the first glass carrier.
    Type: Application
    Filed: April 18, 2019
    Publication date: October 22, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chien-Hua CHEN, Sheng-Chi HSIEH, Chen-Chao WANG, Teck-Chong LEE
  • Fluid ejection dies
    Patent number: 10780697
    Abstract: A fluid ejection device may include a fluid ejection die embedded in a moldable material, and a number of heat exchangers thermally coupled to an ejection side of the fluid ejection die. Further, the fluid ejection device may include a number of cooling channels defined in the moldable material thermally coupled to the heat exchangers.
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: September 22, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W Cumbie, James R Przybyla
  • Printbars and methods of forming printbars
    Patent number: 10780696
    Abstract: A method of forming a printbar module may include providing a printed circuit board (PCB) having a recess extending partially through the PCB and a dam surrounding the recess. An adhesive material may be applied to the recess and a printhead die sliver may be positioned in the recess. The printhead die sliver may be bonded with the PCB and the printhead die sliver and the PCB may be encapsulated with a molding compound. In response to encapsulating, a slot, extending through the PCB and the adhesive material may be formed, wherein the slot is in fluidic communication with fluid feed holes of the printhead die sliver to provide direct fluidic communication without fan-out.
    Type: Grant
    Filed: August 15, 2019
    Date of Patent: September 22, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie
  • Inverted TIJ
    Patent number: 10780698
    Abstract: A fluid ejection die includes a substrate including an array of nozzles.
    Type: Grant
    Filed: June 29, 2016
    Date of Patent: September 22, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W Cumbie, Jr., Chien-Hua Chen, Erik D. Torniainen
  • FLUID CIRCULATION AND EJECTION
    Publication number: 20200290365
    Abstract: A fluid circulation and ejection system may include a microfluidic die, a single orifice fluid ejector having a drive chamber in the microfluidic die and a pressurized fluid source remote from the microfluidic die to create a pressure gradient across the drive chamber to circulate fluid across the drive chamber.
    Type: Application
    Filed: December 2, 2017
    Publication date: September 17, 2020
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Si-lam Choy, Michael W. Cumbie, Chien-Hua Chen
  • PLANARIZATION LAYERS OVER SILICON DIES
    Publication number: 20200282394
    Abstract: A microfluidic apparatus may include, in an example, a substrate, at least one silicon die embedded into the substrate, and a planarization layer layered over, at least, a portion of the substrate that interfaces with the silicon die to prevent a fluid from contacting an edge of the silicon die.
    Type: Application
    Filed: October 12, 2017
    Publication date: September 10, 2020
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Michael W. Cumbie, Chien-Hua Chen
  • CROSS-DIE RECIRCULATION CHANNELS AND CHAMBER RECIRCULATION CHANNELS
    Publication number: 20200282738
    Abstract: A die may, in an example, include at least one cross-die recirculation channel formed into the die to recirculate an amount of printing fluid therethrough, the cross-die recirculation channel including a first-sized inlet port and a first-sized outlet port formed on a first side of the die, at least one chamber recirculation channel formed into the die and fluidically coupled to the cross-die recirculation channel to recirculate an amount of printing fluid therethrough, the chamber recirculation channel including a second-sized inlet port and a second-sized outlet port, at least one pump formed within the chamber recirculation channel to recirculate the amount of printing fluid therethrough.
    Type: Application
    Filed: November 27, 2017
    Publication date: September 10, 2020
    Inventors: Chien-Hua Chen, Jeffrey R. Pollard, Michael W. Cumbie, Si-La in Choy
  • Flexible carrier for fluid flow structure
    Patent number: 10751997
    Abstract: In some examples, a method of making a printhead flow structure includes bonding a flex circuit to a flexible carrier with a thermal release tape, placing a printhead die on the flexible carrier, and debonding the printhead flow structure including the flex circuit and the printhead die from the flexible carrier at a temperature below a release temperature of the thermal release tape by flexing the flexible carrier.
    Type: Grant
    Filed: July 2, 2018
    Date of Patent: August 25, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael G. Groh, Michael W. Cumbie
  • Relative pressure sensor
    Patent number: 10753815
    Abstract: Examples provide an apparatus including a relative pressure sensor that includes a substrate and a cavity in a face of the substrate. The cavity has a floor in the substrate. A passage extends from the cavity. A membrane supports a pressure sensing device and is mounted to the substrate opposite the floor.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: August 25, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Chien-Hua Chen
  • FLUID EJECTION DIE MOLDED INTO MOLDED BODY
    Publication number: 20200247123
    Abstract: A fluid ejection device includes a molded body having a first molded surface and a second molded surface opposite the first molded surface, and a fluid ejection die molded into the molded body, with the fluid ejection die having a first surface substantially coplanar with the first molded surface of the molded body and a second surface substantially coplanar with the second molded surface of the molded body, with the first surface of the fluid ejection die having a plurality of fluid ejection orifices formed therein and the second surface of the fluid ejection die having at least one fluid feed slot formed therein.
    Type: Application
    Filed: April 24, 2017
    Publication date: August 6, 2020
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, Michael W Cumbie, Tony Fuller
  • MICROFLUIDIC DEVICES
    Publication number: 20200246799
    Abstract: In an example implementation, a reagent storage system for a microfluidic device includes a microfluidic chamber formed in a microfluidic device. A blister pack to store a reagent includes an electrically conductive membrane barrier adjacent to the chamber. A thinned region is formed in the membrane barrier, and a conductive trace is to supply electric current to heat and melt the thinned region. Melting the thinned region is to cause the membrane barrier to open and release the reagent into the chamber.
    Type: Application
    Filed: October 30, 2017
    Publication date: August 6, 2020
    Inventors: Viktor Shkolnikov, Michael W Cumbie, Chien-Hua Chen
  • FLUIDIC DIES
    Publication number: 20200238699
    Abstract: A fluidic die includes a fluid channel layer including at least one fluid channel defined along a length of the fluid ejection device. The fluidic die also includes an interposer layer coupled to the fluid channel layer. The interposer layer includes a number of inlet ports defined in the interposer layer to fluidically couple the at least one channel layer to a fluid source, and a number of outlet ports defined in the interposer layer to fluidically couple the at least one channel layer to the fluid source.
    Type: Application
    Filed: September 20, 2017
    Publication date: July 30, 2020
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Si-lam Choy, Chien-Hua Chen, Michael W Cumbie
  • FLUID EJECTION DIE HEAT EXCHANGERS
    Publication number: 20200238695
    Abstract: A fluid ejection device may include a fluid ejection die embedded in a moldable material, a number of fluid recirculation pumps within the fluid ejection die to recirculate fluid within a number of firing chambers of the fluid ejection die, and a number of heat exchangers thermally coupled to a fluid channel side of the fluid ejection die.
    Type: Application
    Filed: April 5, 2017
    Publication date: July 30, 2020
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, Michael W Cumbie, James R Przybyla
  • Fluid ejection device including fluid output channel
    Patent number: 10723128
    Abstract: Examples include a fluid ejection die. Examples comprise an ejection nozzle and an ejection chamber fluidly connected to the ejection nozzle. A fluid input hole is fluidly connected to the ejection chamber. A fluid output channel is also fluidly connected to the ejection chamber, and a fluid output hole is fluidly connected to the fluid output channel. Examples further comprise a fluid pump disposed in the fluid output channel to pump fluid from the ejection chamber out of the fluid output hole.
    Type: Grant
    Filed: November 1, 2016
    Date of Patent: July 28, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W Cumbie, Chien-Hua Chen
  • FLUID EJECTION DIE INTERLOCKED WITH MOLDED BODY
    Publication number: 20200223226
    Abstract: A fluid ejection device includes a fluid ejection die including a substrate and a fluid architecture supported by the substrate, and a molded body molded around the fluid ejection die, with the molded body interlocked with the fluid architecture of the fluid ejection die.
    Type: Application
    Filed: July 28, 2017
    Publication date: July 16, 2020
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Michael W Cumbie, Chien-Hua Chen
  • DEFORMABLE COVERS ON SENSORS AND RESERVOIRS
    Publication number: 20200225162
    Abstract: Examples include a fluid device. The fluid device includes a substrate, a sensor coupled on the substrate. A reservoir is formed in the substrate adjacent to the sensor. A deformable cover is disposed to seal the sensor and the reservoir on the substrate.
    Type: Application
    Filed: August 28, 2017
    Publication date: July 16, 2020
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael Cumbie, Viktor Shkolnikov