Patents by Inventor Chien Hua Chen

Chien Hua Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flip-top washing device for vegetables and fruits
    Patent number: 10702103
    Abstract: A flip-top washing device for vegetables and fruits has a housing assembly, a cover assembly pivotally connected to the housing assembly, a driving assembly mounted on the cover assembly, a washing basket mounted in the housing assembly, and an agitating panel assembly mounted on and connected with the washing basket. With multiple driving blocks of a driving member on the cover assembly and multiple connecting blocks on the agitating panel assembly and with an inclined surface and an vertical surface of each of the driving and connecting blocks, the driving member is able to be securely connected with the agitating panel assembly when closing the cover assembly onto the housing assembly. As the agitating panel assembly and the washing basket rotate, water inside the housing assembly is, strongly agitated so as to wash the vegetables and the fruits in the housing assembly.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: July 7, 2020
    Inventor: Chien-Hua Chen
  • MICROFLUIDIC DEVICES WITH LID FOR LOADING FLUID
    Publication number: 20200206734
    Abstract: The present disclosure is drawn to microfluidic devices. A microfluidic device can include a substrate, a lid mounted to the substrate, and a microchip mounted to the substrate. The lid mounted to the substrate can form a discrete microfluidic chamber between structures including an interior surface of the lid and a portion of the substrate. The lid can include an inlet and a vent positioned relative to one another to facilitate loading of fluid to the discrete microfluidic chamber via capillary action. A portion of the microchip can be positioned within the discrete microfluidic chamber.
    Type: Application
    Filed: November 22, 2017
    Publication date: July 2, 2020
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Hilary ELY, Adam HIGGINS, Rachel M. WHITE, Erik D. TORNIAINEN, Tod WOODFORD, Michael W. CUMBIE, Chien-Hua CHEN
  • MICROFLUIDIC PACKAGE
    Publication number: 20200197935
    Abstract: A microfluidic package may include a fluid passage, a substrate having a substrate surface adjacent an interior of the fluid passage and components inset in the substrate, the components having component surfaces adjacent the fluid passage and substantially flush with the substrate surface.
    Type: Application
    Filed: September 14, 2017
    Publication date: June 25, 2020
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua CHEN, Michael W. CUMBIE
  • FLUIDIC DIES WITH INLET AND OUTLET CHANNELS
    Publication number: 20200198340
    Abstract: In one example in accordance with the present disclosure, a fluidic ejection die is described. The die includes an array of nozzles. Each nozzle includes an ejection chamber, an opening, and a fluid actuator disposed within the ejection chamber. Each nozzle also includes an inlet passage to deliver fluid into the ejection chamber and an outlet passage to deliver fluid out of the ejection chamber. The fluidic ejection die also includes an array of channels divided into inlet channels and outlet channels. Each inlet channel is fluidly connected to a respective plurality of inlet passages and each outlet channel is fluidly connected to a respective plurality of outlet passages.
    Type: Application
    Filed: September 11, 2017
    Publication date: June 25, 2020
    Inventors: Michael W. Cumbie, Chien-Hua Chen
  • Circuit package
    Patent number: 10685898
    Abstract: A circuit package comprises a circuit device in a first epoxy mold compound and a second epoxy mold compound of different compositions.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: June 16, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Stephen Farrar
  • MOLDED DIE SLIVERS WITH EXPOSED FRONT AND BACK SURFACES
    Publication number: 20200180314
    Abstract: In some examples, a print cartridge comprises a printhead die that includes a die sliver molded into a molding. The die sliver includes a front surface exposed outside the molding to dispense fluid, and a back surface exposed outside the molding and flush with the molding to receive fluid. Edges of the die sliver contact the molding to form a joint between the die sliver and the molding.
    Type: Application
    Filed: December 5, 2019
    Publication date: June 11, 2020
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W Cumbie
  • FLUIDIC EJECTION DIES WITH ENCLOSED CROSS-CHANNELS
    Publication number: 20200164647
    Abstract: In one example in accordance with the present disclosure, a fluidic ejection device is described. The device includes a fluidic ejection die embedded in a moldable material. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages. The device also includes the moldable material which includes supply slots to deliver fluid to and from the fluidic ejection die. A carrier substrate of the device supports the fluidic ejection die and moldable material.
    Type: Application
    Filed: July 31, 2017
    Publication date: May 28, 2020
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Si-lam Choy, Michael W Cumbie, Chien-Hua Chen, Jeffrey R Pollard
  • DIE CONTACT FORMATIONS
    Publication number: 20200164645
    Abstract: Examples include a fluid die embedded in a molded panel. The fluid die includes a substrate, and the substrate includes a first surface. The molded panel surrounding sides of the fluid die such that the first surface is disposed below a top surface of the molded panel. A raised contact formation is disposed on the substrate to extend at least up to the top surface of the molded panel.
    Type: Application
    Filed: July 26, 2017
    Publication date: May 28, 2020
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Michael W Cumbie, Anthony Fuller, Chien-Hua Chen, Zhen Yi Li
  • Printheads and methods of fabricating a printhead
    Patent number: 10661567
    Abstract: Printheads and methods of fabricating printheads are disclosed. An example printhead includes a substrate and a printhead die disposed on a surface of the substrate, where a top surface of the printhead die projects a first distance from the surface of the substrate. The example printhead also includes a barrier at least partially surrounding the printhead die. A top surface of the barrier projects a second distance from the surface of the substrate, where the first distance is less than the second distance.
    Type: Grant
    Filed: October 26, 2015
    Date of Patent: May 26, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Chien-Hua Chen, Mark H. MacKenzie, Garrett E. Clark
  • Omniphobic Membranes and Application Thereof
    Publication number: 20200156006
    Abstract: The present invention provides an omniphobic membrane and application thereof. The omniphobic membrane comprises a porous substrate which has a pore size between 0.4 and 2 ?m, a top coat, and an interface layer between the porous substrate and the top coat, and the omniphobic membrane has a carbon/silicon ratio between 40 and 60, and a hierarchical re-entrant structure. Furthermore, both of a process for fabricating the omniphobic membrane and a method for desalination of a liquid by membrane distillation are provided in the present invention.
    Type: Application
    Filed: November 16, 2018
    Publication date: May 21, 2020
    Inventors: Kuo-Lun Tung, Allen Huang, Liang-Hsun Chen, Yi-Rui Chen, Chien-Hua Chen, Che-Chen Hsu, Feng-Yu Tsai
  • SERS SENSOR APPARATUS WITH PASSIVATION FILM
    Publication number: 20200158645
    Abstract: A method for forming a surface enhanced Raman spectroscopy (SERS) sensing apparatus may include providing a body having an internal microfluidic passage, the microfluidic passage having an interior surrounded by an interior surface, depositing a conformal inorganic passivation film onto the interior surface so as to continuously surround the interior by atomic layer deposition and positioning a SERS sensor in connection with the microfluidic passage after the depositing of the conformal inorganic film.
    Type: Application
    Filed: April 22, 2016
    Publication date: May 21, 2020
    Inventors: Zhizhang Chen, Chien-Hua Chen, James E Abbott
  • PRELOADED STORAGE CONTAINER AND PRINT HEAD TO DISPENSE FLUID
    Publication number: 20200147972
    Abstract: An apparatus includes a print head coupled to a substrate to dispense fluid from the substrate in response to a command. A reservoir coupled to the substrate transports the fluid to the print head. A preloaded storage container mounted on the reservoir stores the fluid and provides the fluid to the reservoir in response to pressure applied to the container.
    Type: Application
    Filed: August 28, 2017
    Publication date: May 14, 2020
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Jeffrey A. Nielsen, Michael W. Cumbie, Chien-Hua Chen
  • Fluid level sensor
    Patent number: 10647128
    Abstract: A method of forming a fluid level sensor includes coupling an array of heating elements and sensors to a first side of a substrate. A second side of the substrate is coupled to a carrier. The method also includes coupling an electrical interface to the carrier and electrically coupling the array to the electrical interface via a conductive wire. The method further includes overmolding the electrical interface, the first side of the substrate, and the conductive wire to form an overmolded fluid level sensor. The carrier may be coupled to the second side of the substrate and the electrical interface via a releasable adhesive and may be removed after overmolding the fluid level sensor.
    Type: Grant
    Filed: April 21, 2016
    Date of Patent: May 12, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Anthony D. Studer
  • CIRCUIT PACKAGE
    Publication number: 20200144148
    Abstract: In some examples, a circuit package includes a packaging, and a circuit device in the packaging, where the packaging comprises a first EMC having a first coefficient of thermal expansion (CTE), and a second EMC having a second CTE higher than the first CTE. The second EMC is on the first EMC that has gelled over time.
    Type: Application
    Filed: January 8, 2020
    Publication date: May 7, 2020
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Stephen Farrar
  • Encapsulating a Bonded Wire with Low Profile Encapsulation
    Publication number: 20200139705
    Abstract: Encapsulating a bonded wire with low profile encapsulation includes applying encapsulation over a bonded wire that is connected to a die on a first end and to a circuit component on a second end and truncating a shape of the encapsulation to form a truncated shape.
    Type: Application
    Filed: January 8, 2020
    Publication date: May 7, 2020
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Zhuqing Zhang
  • Microelectromechanical system (MEMS) devices
    Patent number: 10640369
    Abstract: One example provides a microelectromechanical systems (MEMS) device that includes a number of silicon die over-molded with an overmold material, a number of active areas formed on the silicon die, the active areas including at least one sensor to sense a number of attributes of a fluid introduced to the at least one sensor, and a fan-out layer coupled to the silicon die, the fan-out layer including a number of fluid channels formed therein that interface with active areas of the silicon die and allow the fluid to flow to the at least one sensor.
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: May 5, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Devin Alexander Mourey, Michael W. Cumbie, Si-lam J. Choy
  • MICROFLUIDIC CHIP
    Publication number: 20200129979
    Abstract: A microfluidic device is provided that includes a substrate and microfluidic sub-chips embedded in the substrate. An electric field is applied between an adjacent pair microfluidic sub-chips to move a fluid droplet from one of the adjacent pair of microfluidic sub-chips to another of the adjacent pair microfluidic sub-chips.
    Type: Application
    Filed: April 21, 2017
    Publication date: April 30, 2020
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Viktor SHKOLNIKOV, Michael W. CUMBIE, Chien-Hua CHEN
  • Printed circuit board fluid flow structure and method for making a printed circuit board fluid flow structure
    Patent number: 10632752
    Abstract: In one example, a fluid flow structure includes a micro device embedded in a printed circuit board (PCB). Fluid may flow to the micro device through a channel in the PCB and a PCB conductor is connected to a conductor on the embedded micro device.
    Type: Grant
    Filed: March 26, 2013
    Date of Patent: April 28, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie
  • Heat pipe—thermal storage medium based cool storage system
    Patent number: 10605541
    Abstract: A cool storage system comprising which includes a plurality of heat pipes. Each of the heat pipes has a lower evaporator section, a hybrid evaporator/condensing section, and an upper condensing section. The hybrid evaporator/condensing section positioned between the lower evaporator section and the upper condensing section. Each of the heat pipes contains a selected amount of a heat transfer fluid adapted to transfer heat from the lower evaporator section to the hybrid evaporator/condensing section and the upper condensing section through a vapor/condensation cycle, or the heat transfer fluid is vaporized in the hybrid evaporator and condensed in the upper evaporator section. A thermal storage medium is provided in thermal engagement with the hybrid evaporator/condensing section. A heat source is located in said lower evaporator section, and a cooling source, located in said upper condensing section.
    Type: Grant
    Filed: September 20, 2016
    Date of Patent: March 31, 2020
    Assignee: ADVANCED COOLING TECHNOLOGIES, INC.
    Inventors: Ying Zheng, Chien-Hua Chen, Howard Pearlman, Richard Bonner, III, William G. Anderson
  • Method of making a fluid structure having compression molded fluid channel
    Patent number: 10603916
    Abstract: A method of making a fluid channel in a printhead structure includes positioning a printhead die on a carrier; compression molding the die into a molded printhead structure; compression molding a first segment of a fluid channel into the molded printhead structure simultaneously with compression molding the die; and materially ablating a second segment of the fluid channel to couple the channel with a fluid feed hole in the die.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: March 31, 2020
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie