Abstract: A microfluidic system includes, in an example, a substrate and at least two microfluidic devices embedded into the substrate, at least one of the microfluidic devices being different from a remaining number of microfluidic devices. A microfluidic apparatus includes at least two microfluidic devices embedded into a substrate, at least a first microfluidic device of the microfluidic devices being heterogenous to at least a second microfluidic device of the microfluidic devices and a microfluidic channel to fluidically couple the microfluidic devices to each other.

Abstract: A fluid testing device may include a fluid interaction element and a fluid chamber to contain a fluid to be sensed by the fluid interaction element. The fluid chamber may form a first gap through which fluid is to be wicked to a second gap that is opposite the fluid interaction element and less than the first gap.

Abstract: A printhead includes a number of inkjet slivers molded into a moldable substrate. The overmolded inkjet slivers form at least one die. The printhead also includes a number of wire bonds electrically coupling the inkjet slivers to a side connector. The side connector electrically couples the inkjet slivers to a controller of a printing device.

Abstract: In one example a liquid level sensor is described. The sensor includes a carrier and a liquid level sensing interface disposed on the carrier. The liquid level sensing interface includes a number of liquid level sensing devices disposed on an elongated strip. The number of liquid level sensing devices detect a liquid level in a liquid container. The liquid level sensing interface also includes a number of thermal isolation components formed on the elongated strip to thermally isolate adjacent liquid level sensing devices.

Abstract: In one example in accordance with the present disclosure a fluid property sensing device is described. The fluid property sensing device includes a substrate having a trench formed therein. The trench includes a bottom surface and opposite side surfaces. A first electrode is disposed on a first side surface of the trench and a second electrode is disposed on a second side surface of the trench. The first electrode and second electrode form a capacitor to measure a complex impedance of a fluid that fills a space between the first electrode and the second electrode. This complex impedance indicates a property of the fluid. A fluid level sensing die, having a number of fluid level sensing components disposed thereon, may be attached to the substrate, preferably in such a way that the fluid level sensing die is surrounded by the trench. In this way the surface area of the electrodes provided in the trench can be increased. The number of level sensing components may be thermal sensing components.

Abstract: In a three-dimensional printing method example, a build material, including an epoxy resin powder, is applied. A hardener liquid is selectively applied on at least a portion of the build material. The portion of the build material in contact with the hardener liquid is allowed to cure to form a layer of a 3D part. In another three-dimensional printing method example, a filler build material is applied. A liquid epoxy resin is selectively applied on at least a portion of the filler. A hardener liquid is selectively applied on the at least the portion of the filler. The portion of the filler in contact with the liquid epoxy resin and the hardener liquid is allowed to cure to form a layer of a 3D part.

Abstract: In one example in accordance with the present disclosure, a fluidic ejection die is described. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages.

Abstract: In one example, a fluid property sensor includes a proximal elongated circuit (EC), a distal EC, and an external interface. The proximal EC has multiple point sensors distributed along its length. The distal EC is extended in the direction of the length from a distal end of the proximal EC and is electrically coupled from the distal end of the proximal EC to a proximal end of the distal EC. The proximal and distal ECs share a common interface bus. The external interface is electrically coupled to a proximal end of the proximal EC. The proximal EC, the distal EC, and the external interface are packaged together to form the fluid property sensor.

Abstract: In one example, a fluid property sensor includes an electrical circuit assembly (ECA), an elongated circuit (EC), and an external interface. The EC is attached to the ECA and includes multiple point sensors distributed along a length of the EC. The external interface is electrically coupled to a proximal end of the EC. The EC and the external interface are packaged together with an encasement on both sides of the ECA to form the fluid property sensor.

Abstract: A method for forming a fluid flow structure may include positioning rows of micro devices in a mold, wherein each of the micro devices comprising a chamber layer in which an ejection chamber is formed and an orifice layer over the chamber layer in which an orifice is formed. The method may further include molding an amorphous body to encapsulate the rows of the micro devices such that the amorphous body forms fluid channels such that each of the rows is fluidically coupled to a different one of the fluid channels.

Abstract: In an embodiment, a fluid flow structure includes a micro device embedded in a molding. A fluid feed hole is formed through the micro device, and a saw defined fluid channel is cut through the molding to fluidically couple the fluid feed hole with the channel.

Abstract: A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a circuit layer, a first package body, a first antenna and an electronic component. The circuit layer has a first surface and a second surface opposite to the first surface. The first package body is disposed on the first surface of the circuit layer. The first antenna penetrates the first package body and is electrically connected to the circuit layer. The electronic component is disposed on the second surface of the circuit layer.

Abstract: A semiconductor package structure includes a substrate, a die electrically connected to the substrate, and a first encapsulant. The die has a front surface and a back surface opposite to the front surface. The first encapsulant is disposed between the substrate and the front surface of the die. The first encapsulant contacts the front surface of the die and the substrate.

Abstract: A fluid ejection device includes a fluid ejection die to eject drops of fluid and a body to support the fluid ejection die, with the fluid ejection die including a fluid ejection chamber, a drop ejecting element within the fluid ejection chamber, and a fluid feed hole communicated with the fluid ejection chamber, and with the body including a fluid feed slot communicated with the fluid feed hole of the fluid ejection die. The fluid ejection device includes a micro-recirculation system to recirculate fluid within the fluid ejection die through the fluid ejection chamber, and a macro-recirculation system to recirculate fluid within the body through the fluid feed slot across the fluid feed hole of the fluid ejection die.

Abstract: Encapsulating a bonded wire with low profile encapsulation includes applying encapsulation over a bonded wire that is connected to a die on a first end and to a circuit component on a second end and truncating a shape of the encapsulation to form a truncated shape.

Abstract: A test tube preparation device uses a labeling device to include a linking module to link a positioning unit, and the positioning unit can be used to place a tube body and finely adjust a position of the tube body relative to the label generating module of the surface treating device to complete the label generation, label conveyance, tube labeling and tube delivery, and provide a preparation device for effectively integrating the label and applying to the tube body before and after the labeling of the tube body, so as to improve the quality of the generation of the tube body and the label. Further, the present invention further provides a test tube preparation method.

Abstract: The present invention provides an omniphobic membrane and application thereof. The omniphobic membrane comprises a porous substrate which has a pore size between 0.4 and 2 ?m, a top coat, and an interface layer between the porous substrate and the top coat, and the omniphobic membrane has a carbon/silicon ratio between 40 and 60, and a hierarchical re-entrant structure. Furthermore, both of a process for fabricating the omniphobic membrane and a method for desalination of a liquid by membrane distillation are provided in the present invention.

Abstract: A fluid dispenser may include fluid dispensing dies in an end-to-end staggered arrangement, a non-fluid dispensing die electronic device and a molding covering the fluid dispensing dies and the electronic device.

Abstract: A semiconductor device package includes a substrate, a first patterned conductive layer, a second patterned conductive layer, a dielectric layer, a third patterned conductive layer and a connector. The substrate has a top surface. The first patterned conductive layer is on the top surface of the substrate. The second patterned conductive layer contacts the first patterned conductive layer. The second patterned conductive layer includes a first portion, a second portion and a third portion. The second portion is connected between the first portion and the third portion. The dielectric layer is on the top surface of the substrate. The dielectric layer covers the first patterned conductive layer and surrounds the second portion and the third portion of the second patterned conductive layer. The first portion of the second patterned conductive layer is disposed on the dielectric layer.

Abstract: In example implementations, a method is provided, which may include providing a carrier, applying a thermal release tape over the carrier, attaching a print head die, a drive integrated circuit (IC) and an interposer on the thermal release tape, wherein the print head die comprises ink feed holes formed in a back surface of the print head die, encapsulating the print head die, the drive IC and the interposer with an epoxy molded compound (EMC), removing the carrier and the thermal release tape, and forming a slot over an area of the EMC that covers the ink feed holes, wherein the ink feed holes are to be fluidically coupled to the slot.