Patents by Inventor Chien Hua Chen

Chien Hua Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10603911
    Abstract: A printhead includes a moldable substrate, and a number of printhead dies molded into the moldable substrate. The printhead dies include a number of printhead dies molded into the moldable substrate. The dies comprise a non-rectangular shape. A number of fluid slots are defined in the moldable substrate to fluidically coupled to the printhead dies to feed fluid to the printhead dies. The number of fluid slots is not equal to the number of printhead dies.
    Type: Grant
    Filed: October 12, 2015
    Date of Patent: March 31, 2020
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Silam J. Choy
  • Publication number: 20200094247
    Abstract: A device may include a substrate, a first fluid processing chip, a second fluid processing chip, a tapered channel, and a fluid actuator. The first fluid processing chip may be disposed on the substrate and may process a micro-volume of fluid. The second fluid processing chip may be disposed on the substrate and co-planar with the first fluid processing chip. The second fluid processing chip may process at least a portion of the micro-volume of fluid. The tapered channel may be disposed between the first and second fluid processing chips to transport the at least the portion of the micro-volume of fluid from the first fluid processing chip to the second fluid processing chip. The fluid actuator may be disposed proximate to the tapered channel and may control movement of the at least the portion of the micro-volume of fluid within the tapered channel.
    Type: Application
    Filed: April 21, 2017
    Publication date: March 26, 2020
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. CUMBIE, Viktor SHKOLNIKOV, Chien-Hua CHEN
  • Publication number: 20200094475
    Abstract: Examples include a process comprising forming a molded panel that includes a fluid ejection die molded in the molded panel. The molded panel is formed with a mold chase and a release liner. The mold chase has a fluid slot feature that aligns with fluid feed holes of the fluid ejection die. The mold chase and release liner is released from the molded panel such that the molded panel has a fluid slot formed therethrough corresponding to the fluid slot feature of the mold chase, and the fluid slot is fluidly connected to the fluid feed holes of the fluid ejection die.
    Type: Application
    Filed: May 1, 2017
    Publication date: March 26, 2020
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, Michael W Cumbie
  • Publication number: 20200083591
    Abstract: A semiconductor device package includes a glass carrier, a package body, a first circuit layer and a first antenna layer. The glass carrier has a first surface and a second surface opposite to the first surface. The package body is disposed on the first surface of the glass carrier. The package body has an interconnection structure penetrating the package body. The first circuit layer is disposed on the package body. The first circuit layer has a redistribution layer (RDL) electrically connected to the interconnection structure of the package body. The first antenna layer is disposed on the second surface of the glass carrier.
    Type: Application
    Filed: August 19, 2019
    Publication date: March 12, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Sheng-Chi HSIEH, Chen-Chao WANG, Teck-Chong LEE, Chien-Hua CHEN
  • Publication number: 20200075571
    Abstract: A semiconductor device package includes a carrier, an electronic component, a protection layer, a conductive layer and an integrated passive device (IPD). The electronic component is disposed on the carrier. The protection layer covers the carrier and the electronic component. The conductive layer is disposed on the protection layer and penetrates the protection layer to be electrically connected to the electronic component. The IPD is disposed on the conductive layer and electrically connected to the electronic component through the conductive layer.
    Type: Application
    Filed: September 4, 2019
    Publication date: March 5, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chien-Hua CHEN, Teck-Chong LEE
  • Publication number: 20200070160
    Abstract: An apparatus includes a polymer base layer having a surface. A die has a surface that is substantially coplanar with the surface of the polymer base layer. The die includes a fluidic actuator to control fluid flow across the surface of the die. A fluidic channel is coupled to the polymer base layer to provide a fluidic interconnect between the die and a fluidic input/output port.
    Type: Application
    Filed: April 21, 2017
    Publication date: March 5, 2020
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Viktor Shkolnikov
  • Patent number: 10576748
    Abstract: A fluid reservoir (101) includes a number of electrode pairs disposed within the fluid reservoir. Each of the electrode pairs includes a number of sensing electrodes (103), and a number of electrical traces (105) wherein the sensing electrodes are coupled to a respective one of the electrical traces. The fluid reservoir also includes a common electrode (104) electrically coupled to a voltage source (106). A number of properties of a fluid (110) within the fluid reservoir are detected by applying a voltage between the sensing electrodes in an electrode pair, and a level of the fluid within the fluid reservoir is detected by applying a voltage between the electrodes and the common electrode. A multiplexer (102) may be used to selectively couple the sensing electrodes (103) to a processing device (108). The fluid reservoir may be a printing fluid container.
    Type: Grant
    Filed: October 7, 2016
    Date of Patent: March 3, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Ning Ge, Chien-Hua Chen, Michael W. Cumbie
  • Publication number: 20200061992
    Abstract: A fluid ejection device includes a fluid ejection die to eject drops of fluid and a body to support the fluid ejection die, with the fluid ejection die including a fluid ejection chamber, a drop ejecting element within the fluid ejection chamber, and a fluid feed hole communicated with the fluid ejection chamber, and with the body including a fluid feed slot communicated with the fluid feed hole of the fluid ejection die. The fluid ejection device includes a micro-recirculation system to recirculate fluid within the fluid ejection die through the fluid ejection chamber, and a macro-recirculation system to recirculate fluid within the body through the fluid feed slot across the fluid feed hole of the fluid ejection die.
    Type: Application
    Filed: May 8, 2017
    Publication date: February 27, 2020
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, Michael W Cumbie, Si-lam J Choy
  • Patent number: 10557391
    Abstract: An incineration system includes an inlet channel supplying an inlet stream comprising a waste gas containing at least one volatile organic compound, a waste gas sensor measuring at least one property of the waste gas, an oxidizing gas supply controllably providing oxidizing gas to the inlet channel, an incinerator receiving the inlet stream from the inlet channel, an ignitor initiating combustion of the inlet stream in the reaction zone of the incinerator, and a controller receiving data from the waste gas sensor and controlling flow of oxidizing gas from the oxidizing gas supply into the inlet channel. The spiral heat exchanger defines a reaction zone, an incoming path from the inlet channels to the reaction zone, and an outgoing path from the reaction zone to an exhaust channel. The incoming path and the outgoing path extend in alternating concentric spirals with the incoming path being countercurrent to the outgoing path.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: February 11, 2020
    Assignee: ADVANCED COOLING TECHNOLOGIES, INC.
    Inventors: Chien-Hua Chen, Bradley Richard, Howard Pearlman, Joel Crawmer
  • Patent number: 10557798
    Abstract: A housing may include sidewalls and a base extending between and supported by the sidewalls. The base and the sidewalls form a cavity. The housing support they substrate. The substrate supports a surface enhanced luminescence stage between the substrate and the base.
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: February 11, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Devin A. Mourey
  • Patent number: 10559512
    Abstract: A method of molding a circuit may include depositing a first epoxy mold compound (EMC) over a cavity, upon the first EMC gelling over a predetermined period of time, depositing a second EMC over the first EMC, and depositing a circuit in at least one of the first and second epoxy mold compounds. A circuit package may include a packaging and a circuit device in the packaging, wherein the packaging comprises a first EMC with a first CTE and a second EMC with a second CTE higher than the first CTE, the second EMC being dispensed onto the first EMC after the first EMC is allowed to gel to a predetermined degree.
    Type: Grant
    Filed: November 16, 2015
    Date of Patent: February 11, 2020
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Stephen Farrar
  • Publication number: 20200038872
    Abstract: An apparatus includes a polymer base layer having a surface. A die that includes a fluid manipulation surface that is substantially coplanar with the surface of the polymer base layer. The die includes a control electrode to generate an electric field to perform microfluidic manipulation of fluid across the fluid manipulation surface of the die.
    Type: Application
    Filed: April 21, 2017
    Publication date: February 6, 2020
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Viktor SHKOLNIKOV, Chien-Hua CHEN
  • Publication number: 20200035654
    Abstract: A semiconductor package structure includes a plurality of transducer devices, a cap structure, at least one redistribution layer (RDL) and a protection material. The transducer devices are disposed side by side. Each of the transducer devices has at least one transducing region, and includes a die body and at least one transducing element. The die body has a first surface and a second surface opposite to the first surface. The transducing region is disposed adjacent to the first surface of the die body. The transducing element is disposed adjacent to the first surface of the die body and within the transducing region. The cap structure covers the transducing region of the transducer device to form an enclosed space. The redistribution layer (RDL) electrically connects the transducer devices. The protection material covers the transducer devices.
    Type: Application
    Filed: July 22, 2019
    Publication date: January 30, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chien-Hua CHEN, Cheng-Yuan KUNG
  • Publication number: 20200031126
    Abstract: A printhead includes a number of inkjet slivers molded into a moldable substrate. The overmolded inkjet slivers form at least one die. The printhead also includes a number of wire bonds electrically coupling the inkjet slivers to a side connector. The side connector electrically couples the inkjet slivers to a controller of a printing device.
    Type: Application
    Filed: October 7, 2019
    Publication date: January 30, 2020
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W Cumbie
  • Publication number: 20200023641
    Abstract: A method of forming a printbar module may include providing a printed circuit board (PCB) having a recess extending partially through the PCB and a dam surrounding the recess. An adhesive material may be applied to the recess and a printhead die sliver may be positioned in the recess. The printhead die sliver may be bonded with the PCB and the printhead die sliver and the PCB may be encapsulated with a molding compound. In response to encapsulating, a slot, extending through the PCB and the adhesive material may be formed, wherein the slot is in fluidic communication with fluid feed holes of the printhead die sliver to provide direct fluidic communication without fan-out.
    Type: Application
    Filed: August 15, 2019
    Publication date: January 23, 2020
    Inventors: Chien-Hua Chen, Michael W. Cumbie
  • Publication number: 20200003601
    Abstract: A fluid reservoir may include a number of metal traces along a wall of the fluid reservoir, and a number of fuse circuits along a length of the metal traces. Each of the fuse circuits may include a fuse along a length of a respective metal trace, and a number of parasitic resistive elements in parallel to the fuse. The parasitic resistive elements reduce current flow through the fuse in the presence of a fluid contained within the fluid reservoir.
    Type: Application
    Filed: February 23, 2017
    Publication date: January 2, 2020
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Ning GE, Chien-Hua Chen, Alexander Govyadinov
  • Publication number: 20190389220
    Abstract: A fluid ejection device may include a fluid ejection die embedded in a moldable material, and a number of heat exchangers thermally coupled to an ejection side of the fluid ejection die. Further, the fluid ejection device may include a number of cooling channels defined in the moldable material thermally coupled to the heat exchangers.
    Type: Application
    Filed: March 15, 2017
    Publication date: December 26, 2019
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, Michael W Cumbie, James R Przybyla
  • Publication number: 20190393297
    Abstract: A capacitor bank structure includes a plurality of capacitors, a protection material, a first dielectric layer and a plurality of first pillars. The capacitors are disposed side by side. Each of the capacitors has a first surface and a second surface opposite to the first surface, and includes a plurality of first electrodes and a plurality of second electrodes. The first electrodes are disposed adjacent to the first surface for external connection, and the second electrodes are disposed adjacent to the second surface for external connection. The protection material covers the capacitors, sidewalls of the first electrodes and sidewalls of the second electrodes, and has a first surface corresponding to the first surface of the capacitor and a second surface corresponding to the second surface of the capacitor. The first dielectric layer is disposed on the first surface of the protection material, and defines a plurality of openings to expose the first electrodes.
    Type: Application
    Filed: June 20, 2019
    Publication date: December 26, 2019
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Yuan KUNG, Chien-Hua CHEN, Teck-Chong LEE, Hung-Yi LIN, Pao-Nan LEE, Hsin Hsiang WANG, Min-Tzu HSU, Po-Hao CHEN
  • Patent number: 10500859
    Abstract: In some examples, a print cartridge comprises a printhead die that includes a die sliver molded into a molding. The die sliver includes a front surface exposed outside the molding to dispense fluid, and a back surface exposed outside the molding and flush with the molding to receive fluid. Edges of the die sliver contact the molding to form a joint between the die sliver and the molding.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: December 10, 2019
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie
  • Publication number: 20190366719
    Abstract: In an example, a method for making a fluid ejection apparatus may include forming a molding material over a fluid passage on a back surface of printhead die, embedding the printhead die in an encapsulant in a cavity in a printed circuit board such that at least one drop ejector of the printhead die is exposed at a front side of the printed circuit board, removing the encapsulant at a back side of the printed circuit board to expose the molding material, and removing the molding material to form a fluid feed slot through which fluid may flow to the fluid passage opening in the printhead die.
    Type: Application
    Filed: August 14, 2019
    Publication date: December 5, 2019
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Devin Alexander Mourey