Patents by Inventor Chien Liu

Chien Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250017986
    Abstract: Spray-dried Compositions and Methods of Preparation Spray-dried compositions that may be used in food products, the methods of preparing the compositions and food products containing the compositions are described. The spray-dried composition contains 5 to 50 weight percent (wt. %) of a prebiotic. 10 to 65 wt. % of a probiotic, and 30 to 80 wt. % of a coating material. The prebiotic may be a polysaccharide, an oligosaccharide, a polyol, whey protein, and any combinations thereof. The probiotic may be Lacticaseibacillus, Lactobacillus, Lactiplantibacillus, Levilactobacillus, Ligilactobacillus, Limosilactobacillus, Bifidobacterium, Enterococcus, Streptococcus, Pediococcus, Leuconostoc, Bacillus, Escherichia, Saccharomyces, and any combinations thereof. The coating material may be a synthetic polymer, a natural polymer, and any combinations thereof. The spray-dried compositions are prepared by providing at least one solution containing the composition components and spray drying the at least one solution.
    Type: Application
    Filed: October 26, 2022
    Publication date: January 16, 2025
    Inventors: Sie Huey LEE, Wen Chien Desmond HENG, Siak Wei OW, Shao Quan LIU, Pui Shan CHOW, Pei Kun Richie TAY, Dai CHEN
  • Publication number: 20250019144
    Abstract: A holding device for a top-opening substrate container includes a holding assembly for pushing a substrate actuator disposed at a substrate to operate. The holding assembly includes a holding body and a pushing actuator. The pushing actuator includes a first guiding sloped surface for pressing against a second guiding sloped surface of an inner surface of a container door structure. The first guiding sloped surface causing corresponding pushing and displacement between the first guiding sloped surface and the second guiding sloped surface according to a supporting force of the container door structure. A pushing section is connected to the first guiding sloped surface, and capable of correspondingly pushing the substrate actuator to operate according to a level of the pushing and displacement of the first guiding sloped surface, such that the substrate actuator displaces substrates and stacks the substrates with another in layers.
    Type: Application
    Filed: December 1, 2023
    Publication date: January 16, 2025
    Inventors: MING-CHIEN CHIU, YUNG-CHIN PAN, CHENG-EN CHUNG, WEI-CHIEN LIU, TZU-NING HUANG, TZU-CHI CHAO, TZU-WEI HUANG, CHIA-LIANG LIU
  • Patent number: 12183608
    Abstract: A substrate container with enhanced flow field therein includes a box, at least one offset inflation mechanism and at least one gas diffusion mechanism. The offset inflation mechanism is disposed outside internal receiving space of the box. The offset inflation mechanism has a gaseous chamber extending in the same direction as a bottom panel. The gas diffusion mechanism includes a base, a partition wall and at least one diffusion member. The base masks an outlet of the gaseous chamber to form an auxiliary gaseous chamber. The partition wall extends perpendicularly to the bottom panel to form a vertical first gas channel in communication with the auxiliary gaseous chamber. The diffusion member and the partition wall together define a second gas channel. The partition wall has at least one gap whereby the first gas channel and the second gas channel are in communication with each other.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: December 31, 2024
    Assignee: GUDENG PRECISION INDUSTRIAL CO., LTD.
    Inventors: Ming-Chien Chiu, En-Nien Shen, Yung-Chin Pan, Chih-Ming Lin, Wei-Chien Liu, Cheng-En Chung, Po-Ting Lee, Jyun-Yan Jiang
  • Publication number: 20240372705
    Abstract: A method includes encrypting a first message that contains a first public key of a first peer, by using a second public key of a second peer; and decrypting a second message sent from the second peer by using a first private key paired with the first public key. The second message may be encrypted at the second peer by using the first public key, and may contain an encrypted data encrypted by the second peer using the second public key and hashed by using a secret key of the first peer. The first public key, the second public key, the first private key and the secret key may be physically unclonable function (PUF)-based keys.
    Type: Application
    Filed: July 17, 2024
    Publication date: November 7, 2024
    Inventor: MEI-CHIEN LIU
  • Publication number: 20240371951
    Abstract: Various embodiments of the present disclosure are directed towards a two-dimensional carrier gas (2DCG) semiconductor device comprising an ohmic source/drain electrode with a plurality of protrusions separated by gaps and protruding from a bottom surface of the ohmic source/drain electrode. The ohmic source/drain electrode overlies a semiconductor film, and the protrusions extend from the bottom surface into the semiconductor film. Further, the ohmic source/drain electrode is separated from another ohmic source/drain electrode that also overlies the semiconductor film. The semiconductor film comprises a channel layer and a barrier layer that are vertically stacked and directly contact at a heterojunction. The channel layer accommodates a 2DCG that extends along the heterojunction and is ohmically coupled to the ohmic source/drain electrode and the other ohmic source/drain electrode. A gate electrode overlies the semiconductor film between the ohmic source/drain electrode and the other source/drain electrode.
    Type: Application
    Filed: July 18, 2024
    Publication date: November 7, 2024
    Inventors: Shih-Chien Liu, Yao-Chung Chang, Chun Lin Tsai
  • Patent number: 12132088
    Abstract: Various embodiments of the present disclosure are directed towards a two-dimensional carrier gas (2DCG) semiconductor device comprising an ohmic source/drain electrode with a plurality of protrusions separated by gaps and protruding from a bottom surface of the ohmic source/drain electrode. The ohmic source/drain electrode overlies a semiconductor film, and the protrusions extend from the bottom surface into the semiconductor film. Further, the ohmic source/drain electrode is separated from another ohmic source/drain electrode that also overlies the semiconductor film. The semiconductor film comprises a channel layer and a barrier layer that are vertically stacked and directly contact at a heterojunction. The channel layer accommodates a 2DCG that extends along the heterojunction and is ohmically coupled to the ohmic source/drain electrode and the other ohmic source/drain electrode. A gate electrode overlies the semiconductor film between the ohmic source/drain electrode and the other source/drain electrode.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: October 29, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih-Chien Liu, Yao-Chung Chang, Chun Lin Tsai
  • Patent number: 12095904
    Abstract: A method includes encrypting a first message that contains a first public key of a first peer, by using a second public key of a second peer; and decrypting a second message sent from the second peer by using a first private key paired with the first public key. The second message may be encrypted at the second peer by using the first public key, and may contain an encrypted data encrypted by the second peer using the second public key and hashed by using a secret key of the first peer. The first public key, the second public key, the first private key and the secret key may be physically unclonable function (PUF)-based keys.
    Type: Grant
    Filed: December 7, 2022
    Date of Patent: September 17, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventor: Mei-Chien Liu
  • Patent number: 11987431
    Abstract: A top-opening substrate carrier comprises a container body, a door member and at least one latching mechanism. The latching mechanism includes a rotary drive member, a first driven cam, a second driven cam, a first connecting rod, a second connecting rod, two longitudinal latching arms and two lateral latching arms. The first driven cam and the second driven cam are disposed at two sides of the rotary drive member. When the rotary drive member is rotated by force, it links and activates the first connecting rod and the second connecting rod to synchronously drive the first driven cam and the second driven cam to rotate, thereby driving the two longitudinal latching arms and the two lateral latching arms to project towards locking holes of the container body and locked, or retract from the locking holes of the container body and unlocked.
    Type: Grant
    Filed: March 27, 2023
    Date of Patent: May 21, 2024
    Assignee: GUDENG PRECISION INDUSTRIAL CO., LTD.
    Inventors: Ming-Chien Chiu, Yung-Chin Pan, Cheng-En Chung, Chih-Ming Lin, Po-Ting Lee, Wei-Chien Liu, Tzu-Ning Huang
  • Publication number: 20240159552
    Abstract: Systems and methods for determining vehicle vocation are provided. The method involves operating at least one processor to: retrieve telematics data associated with a vehicle, the telematics data originating from a telematics device installed in the vehicle; process the telematics data to extract a plurality of feature datasets, the plurality of feature datasets including: a first dataset associated with distances traveled by the vehicle; a second dataset associated with stops completed by the vehicle; and a third dataset associated with round trips performed by the vehicle; apply a plurality of trained cluster models to the plurality of feature datasets to determine a plurality of vocation probabilities; and determine the vocation of the vehicle based on the plurality of vocation probabilities.
    Type: Application
    Filed: October 10, 2023
    Publication date: May 16, 2024
    Inventors: Chien An Liu, Natalie Joy Smith
  • Publication number: 20240161606
    Abstract: Disclosed herein are systems and methods for identifying and ranking traffic bottlenecks.
    Type: Application
    Filed: November 6, 2023
    Publication date: May 16, 2024
    Inventors: Yunfei Ma, Chien An Liu
  • Publication number: 20240034525
    Abstract: A top-opening substrate carrier comprises a container body, a door member and at least one latching mechanism. The latching mechanism includes a rotary drive member, a first driven cam, a second driven cam, a first connecting rod, a second connecting rod, two longitudinal latching arms and two lateral latching arms. The first driven cam and the second driven cam are disposed at two sides of the rotary drive member. When the rotary drive member is rotated by force, it links and activates the first connecting rod and the second connecting rod to synchronously drive the first driven cam and the second driven cam to rotate, thereby driving the two longitudinal latching arms and the two lateral latching arms to project towards locking holes of the container body and locked, or retract from the locking holes of the container body and unlocked.
    Type: Application
    Filed: March 27, 2023
    Publication date: February 1, 2024
    Inventors: MING-CHIEN CHIU, YUNG-CHIN PAN, CHENG-EN CHUNG, CHIH-MING LIN, PO-TING LEE, WEI-CHIEN LIU, TZU-NING HUANG
  • Patent number: 11862011
    Abstract: A traffic analysis system analyzes location data from a plurality of vehicles to determine journeys made by the vehicles. Vehicles may make one or more rest stops during a journey. The traffic analysis system compares rest periods to journey criteria to determine whether a rest period delineates the end of a journey, or whether a rest period is still within the journey. In this way, a plurality of trips can be chained together into a journey to provide more accurate analysis of traffic patterns.
    Type: Grant
    Filed: July 14, 2021
    Date of Patent: January 2, 2024
    Assignee: Geotab Inc.
    Inventors: Shweta Pravinchandra Shah, Daniel J. Lewis, Jean Pilon-Bignell, Pooria Poorsarvi Tehrani, Chien An Liu, Robert Bradley, Terence Michael Branch
  • Publication number: 20230386876
    Abstract: A door locking mechanism and semiconductor container using the same include door panel, cover, and locking module. The door panel has a first stop structure. The cover and the door panel define an accommodating space for receiving the locking module. The locking module includes rotating member, holding member, and elastic member. The elastic member is disposed on the holding member and has a second stop structure near the first stop structure. The elastic member is disposed between the holding and the rotating member. The elastic member is compressed when a force is applied to the holding member, and the second stop structure detaches from a limitation state with the first stop structure for allowing a rotating operation of the rotating member. The elastic member elastically restores when the force is removed, and the second stop structure returns to the limitation state for limiting the rotating operation.
    Type: Application
    Filed: April 12, 2023
    Publication date: November 30, 2023
    Inventors: MING-CHIEN CHIU, YUNG-CHIN PAN, CHENG-EN CHUNG, CHIH-MING LIN, PO-TING LEE, WEI-CHIEN LIU, TZU-NING HUANG
  • Patent number: 11830673
    Abstract: A method of preparing a soft carbon material for high-voltage supercapacitors includes: providing an initial soft carbon material characterized by: (A) a first carbon layer spacing greater than 0.345 nm but less than 0.360 nm; (B) a crystal plane (002) with a length (Lc) less than 6 nm; (C) a crystal plane (101) with a length (La) less than 6 nm; and (D) an intensity ratio (I(002)/I(101)) of the crystal plane (002) to the crystal plane (101) obtained by XRD analysis being less than 60; performing an alkaline activation on the initial soft carbon material with an alkaline activator to obtain a first processing carbon material; and performing an electrochemical activation on the first processing carbon material with an electrolyte to obtain the soft carbon material for the high-voltage supercapacitors.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: November 28, 2023
    Assignee: CPC CORPORATION, TAIWAN
    Inventors: Yan-Shi Chen, Gao-Shee Leu, Yu-Chien Liu, Chi-Chang Hu
  • Patent number: 11799012
    Abstract: A method for fabricating semiconductor device includes the steps of first forming a silicon layer on a substrate and then forming a metal silicon nitride layer on the silicon layer, in which the metal silicon nitride layer includes a bottom portion, a middle portion, and a top portion and a concentration of silicon in the top portion is greater than a concentration of silicon in the middle portion. Next, a conductive layer is formed on the metal silicon nitride layer and the conductive layer, the metal silicon nitride layer, and the silicon layer are patterned to form a gate structure.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: October 24, 2023
    Assignees: UNITED MICROELECTRONICS CORP., Fujian Jinhua Integrated Circuit Co., Ltd.
    Inventors: Chun-Chieh Chiu, Pin-Hong Chen, Yi-Wei Chen, Tsun-Min Cheng, Chih-Chien Liu, Tzu-Chieh Chen, Chih-Chieh Tsai, Kai-Jiun Chang, Yi-An Huang, Chia-Chen Wu, Tzu-Hao Liu
  • Publication number: 20230326890
    Abstract: Various embodiments of the present disclosure are directed towards a three-dimensional (3D) IC comprising semiconductor substrates with different bandgaps. The 3D IC chip comprises a first IC chip and a second IC chip overlying and bonded to the first IC chip. The first IC chip comprises a first semiconductor substrate with a first bandgap, and further comprises and a first device on and partially formed by the first semiconductor substrate. The second IC chip comprises a second semiconductor substrate with a second bandgap different than the first bandgap, and further comprises a second device on the second semiconductor substrate.
    Type: Application
    Filed: June 24, 2022
    Publication date: October 12, 2023
    Inventors: Yao-Chung Chang, Shih-Chien Liu, Chia-Jui Yu, Chun-Lin Tsai
  • Patent number: 11769400
    Abstract: A traffic analysis system analyzes location data from a plurality of vehicles to determine journeys made by the vehicles. Vehicles may make one or more rest stops during a journey. The traffic analysis system compares rest periods to journey criteria to determine whether a rest period delineates the end of a journey, or whether a rest period is still within the journey. In this way, a plurality of trips can be chained together into a journey to provide more accurate analysis of traffic patterns.
    Type: Grant
    Filed: October 31, 2022
    Date of Patent: September 26, 2023
    Assignee: Geotab Inc.
    Inventors: Shweta Pravinchandra Shah, Daniel J. Lewis, Jean Pilon-Bignell, Pooria Poorsarvi Tehrani, Chien An Liu, Robert Bradley, Terence Michael Branch
  • Publication number: 20230261083
    Abstract: A method of manufacturing a semiconductor device includes providing a substrate. A channel layer is formed on the substrate. A barrier layer is formed on the channel layer. A source and a drain are formed on the barrier layer. A recess is formed in the barrier layer, in which the recess has a bottom surface, and a portion of the barrier underneath the recess has a thickness. A first dielectric layer is formed to cover the bottom surface of the recess. A charge trapping layer is formed on the first dielectric layer. A first ferroelectric material layer is formed on the charge trapping layer. A second dielectric layer is formed on the first ferroelectric material layer. A second ferroelectric material layer is formed on the second dielectric layer. A gate is formed over the second ferroelectric material layer.
    Type: Application
    Filed: April 20, 2023
    Publication date: August 17, 2023
    Inventors: Edward Yi CHANG, Shih-Chien LIU, Chung-Kai HUANG, Chia-Hsun WU, Ping-Cheng HAN, Yueh-Chin LIN, Ting-En HSIEH
  • Patent number: 11670699
    Abstract: A semiconductor device includes a substrate, a channel layer, a barrier layer, a ferroelectric composite material layer, a gate, a source and a drain. The channel layer and the barrier layer having a recess are disposed on the substrate in sequence. The ferroelectric composite material layer including a first dielectric layer, a charge trapping layer, a first ferroelectric material layer, a second dielectric layer and a second ferroelectric material layer is disposed in the recess. The gate is disposed on the ferroelectric composite material layer. The source and the drain are disposed on the barrier layer.
    Type: Grant
    Filed: March 4, 2020
    Date of Patent: June 6, 2023
    Assignee: NATIONAL YANG MING CHIAO TUNG UNIVERSITY
    Inventors: Edward Yi Chang, Shih-Chien Liu, Chung-Kai Huang, Chia-Hsun Wu, Ping-Cheng Han, Yueh-Chin Lin, Ting-En Hsieh
  • Patent number: D1056358
    Type: Grant
    Filed: January 26, 2022
    Date of Patent: December 31, 2024
    Inventor: Chun-Chien Liu