Abstract: The present invention relates to a multicomponent-alloy material layer and a method of manufacturing the multicomponent-alloy material layer and a capacitor structure of a semiconductor device comprising the multicomponent-alloy material layer. The multicomponent-alloy material layer has four to six metal elements and has specific two kinds of metal components, and the two kinds of metal components have a specific content ratio, such that without a thermal annealing treatment, the multicomponent-alloy material layer has a specific work function for an application in the capacitor structure of the semiconductor device.

Abstract: A semiconductor package structure having a frontside redistribution layer, a stacking structure disposed over the frontside redistribution layer and having a first semiconductor die and a second semiconductor die over the first semiconductor die. A backside redistribution layer is disposed over the stacking structure, a first intellectual property (IP) core is disposed in the stacking structure and electrically coupled to the frontside redistribution layer through a first routing channel. A second IP core is disposed in the stacking structure and is electrically coupled to the backside redistribution layer through a second routing channel, wherein the second routing channel is different from the first routing channel and electrically insulated from the frontside redistribution layer.

Abstract: An interconnect structure for a redistribution layer includes an intermediate via land pad; a cluster of upper conductive vias abutting the intermediate via land pad and electrically coupling the intermediate via land pad to an upper via land pad; and an array of lower conductive vias electrically coupling the intermediate via land pad with a lower circuit pad. The array of lower conductive vias is arranged within a horseshoe-shaped via array region extending along a perimeter of the intermediate via land pad. The array of lower conductive vias arranged within the horseshoe-shaped via array region does not overlap with the cluster of upper conductive vias.

Abstract: In one example in accordance with the present disclosure, an example computing device is disclosed. The example computing device includes a housing. The example computing device also includes a rotatable antenna disposed within the housing. The rotatable antenna is to rotate such that a direction of radiation is maintained in a single direction as the housing is to rotate.

Abstract: A package-on-package includes a first package and a second package on the first package. The first package includes a bottom substrate and a top substrate space apart from the bottom substrate such that the bottom substrate and the top substrate define a gap therebetween. A logic die and an IC device are mounted on the bottom substrate in a side-by-side configuration. The logic die has a thickness not less than 125 micrometer. Copper cored solder balls are disposed between around the logic die and the IC device to electrically connect the bottom substrate with the top substrate. A sealing resin is filled into the gap between the bottom substrate and the top substrate and seals the logic die, the IC device, and the copper cored solder balls in the gap.

Abstract: An apparatus for avoiding disposition of the clutch of the vehicle speed change device includes a first buffer clutch and a second buffer clutch being located on a clutching cam guide track; the clutching cam guide track being serially arranged with a spring seat and a compressible spring; each of the first buffer clutch and the second buffer clutch including a respective clutching cam set; each of the two clutching cam sets having a respective clutching guide track; the clutching guide track of the first buffer clutch having a parking position for receiving a shift fork; and a protecting ring being installed on the clutching cam set of the first buffer clutch; the protecting ring having a hooking opening capable of receiving the shift fork which shifts to the parking position.

Abstract: A low-profile and small-size valve to a shut off a flow of fluid in a pipeline includes a frame, a tube, a moving part, a lever, an elastic part, a latch, and a trigger. The tube is movable with the moving part. The lever is rotatable around an axis. The elastic part can push the lever to rotate after the trigger pushes the buckle away from the lever to unlatch the lever and allow rotation. During the rotation of the lever, the lever pulls on the moving part, and the moving part pulls on the tube together to disconnect the tube from the pipe. The valve improves the convenience and efficiency of shutting off a flow of fluid. A pipeline and an immersion cooling system is also disclosed.

Abstract: One embodiment of the present disclosure provides a semiconductor package including a bottom chip package having a first side and a second side opposing the first side, and a top antenna package mounted on the first side of the bottom chip package. The bottom chip package further includes a semiconductor chip. The semiconductor chip may include a RFIC chip. The top antenna package has at least one radiative antenna element.

Abstract: An active interactive navigation system includes a display device, a target object image capturing device, a user image capturing device, and a processing device. The target object image capturing device captures a dynamic object image. The user image capturing device obtains a user image. The processing device recognizes and selects a service user from the user image and captures a facial feature of the service user. If the facial feature matches facial feature points, the processing device detects a line of sight of the service user and accordingly recognizes a target object watched by the service user, generates face position three-dimensional coordinates corresponding to the service user, position three-dimensional coordinates corresponding to the target object, and depth and width information, accordingly calculates a cross-point position where the line of sight passes through the display device, and display virtual information of the target object on the cross-point position of the display device.

Abstract: This disclosure provides systems, methods, and devices for image processing that support enhanced white balancing operations. In a first aspect, a method of image processing includes receiving first image data from an image sensor; determining to adjust a white balancing operation from a first white balance point to a second white balance point; determining a first intermediate white balance point based on the first white balance point, the second white balance point, and a white balance reference line; receiving second image data from the image sensor; and applying white balancing to the second image data based on the first intermediate white balance point. Other aspects and features are also claimed and described.

Abstract: A semiconductor package structure includes a frontside redistribution layer, a stacking structure, a backside redistribution layer, a first intellectual property (IP) core, and a second IP core. The stacking structure is disposed over the frontside redistribution layer and comprises a first semiconductor die and a second semiconductor die over the first semiconductor die. The backside redistribution layer is disposed over the stacking structure. The first IP core is disposed in the stacking structure and is electrically coupled to the frontside redistribution layer through a first routing channel. The second IP core is disposed in the stacking structure and is electrically coupled to the backside redistribution layer through a second routing channel, wherein the second routing channel is separated from the first routing channel and electrically insulated from the frontside redistribution layer.

Abstract: A semiconductor package including a base comprising an upper surface and a lower surface that is opposite to the upper surface; a radio-frequency (RF) module embedded near the upper surface of the base; an integrated circuit (IC) die mounted on the lower surface of the base in a flip-chip manner so that a backside of the IC die is available for heat dissipation; a plurality of conductive structures disposed on the lower surface of the base and arranged around the IC die; and a metal thermal interface layer comprising a backside metal layer that is in contact with the backside of the IC die, and a solder paste conformally printed on the backside metal layer.

Abstract: A fulldome display framework with a movable assembly adapted to dispose a plurality of display screens or projection screens to constitute a fulldome display includes a fixed frame engaged with a base surface and a movable frame disposed on the base surface and being movable relative to the fixed frame between an assembling position and a disassembling position along a predetermined route. The fulldome display is constituted when the movable frame is located at the assembling position to match with the fixed frame. In this way, after an LED fulldome display structure is installed on the present invention for example, the movable frame could be pulled out relative to the fixed frame along the predetermined route when a circuit board of a part of the fulldome display requires to be repaired, providing a certain working area for a repair worker to carry out repair and maintenance.

Abstract: The present invention is a vehicle positioning system and a vehicle positioning method for a container yard. The system includes a cloud server and a gate checking device. The gate checking device is communicatively connected to the cloud server, and senses a first vehicle to generate a first gate sensing signal and a second gate sensing signal. The cloud server receives and fuses the first gate sensing signal and the second gate sensing signal to generate first vehicle identity information and first vehicle positioning information. Since the present invention generates the first vehicle identity information and the first vehicle positioning information by fusing at least two sensing signals, the present invention can improve positioning accuracy and reliability by adopting a positioning technology combining multiple factors. Further, there is no need to install a transmitter or a receiver on the vehicle, improving a success rate to install the present invention.

Abstract: A device for camera processing is configured to receive a preview image, and determine if the preview image is a high dynamic range (HDR) scene based on brightness values of pixels of the preview image. The device may further determine to use a single frame image capture technique based on a determination that the preview image is not an HDR scene, and determine to use one of a plurality of HDR image capture techniques based on a determination that the preview image is an HDR scene, and further based on motion detected in the preview image. The device may then generate an output image using one or more images captured using the single frame image capture technique or one of the plurality of HDR image capture techniques.

Abstract: The present disclosure provides a socket structure including a casing, a main body, a frame and a cover. The casing includes plural lateral walls, a bottom, an opening and an accommodation space. The opening is defined by the lateral walls. The accommodation space is defined by the lateral walls and the bottom and is in communication with the opening. The main body is disposed in the accommodation space and includes a circuit board and a connection port disposed on the circuit board. The frame includes at least one plate and a first extending portion. The plate surrounds the periphery of the opening. The first extending portion is extended from the plate and is connected to one of the lateral walls. The cover covers the opening and includes a through hole. The through hole is configured to allow a plug to pass through and connect to the connection port.

Abstract: A structure of a three-phase motor is provided. The structure of the three-phase motor includes a stator, a rotor, first-phase windings, second-phase windings, and third-phase windings. In one embodiment, the stator has fifteen winding groove bodies, and the rotor has seven magnetic element pairs. In another embodiment, the stator has twenty-one winding groove bodies, and the rotor has ten magnetic element pairs. The first-phase windings are disposed in first winding groove bodies, and the first winding groove bodies are disposed adjacent to each other. The second-phase windings are disposed in second winding groove bodies, and the second winding groove bodies are disposed adjacent to each other. The third-phase windings are disposed in third winding groove bodies, and the third winding groove bodies are disposed adjacent to each other.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a gate structure over a substrate. The semiconductor structure also includes source/drain structures on opposite sides of the gate structure. The semiconductor structure also includes a dielectric layer over the gate structure and the source/drain structures. The semiconductor structure also includes a via plug passing through the dielectric layer and including a first group IV element. The dielectric layer includes a second group IV element, a first compound, and a second compound, and the second compound includes elements in the first compound and the first group IV element.

Abstract: A heat dissipation case includes a case body, a carrying frame configured to be slidably mounted on the case body, a shutter rotationally mounted on the case body, and a number of levers rotationally mounted on the case body. One end of the levers resists against the shutter. The carrying frame is configured to resist against the other end of the levers, so that the end of the levers resisting against the shutter drives the shutter to rotate and open toward the carrying frame.

Abstract: An electronic device is provided. The electronic device includes a housing, a first circuit board, and a first heat sink. The housing forms a receiving space. The first circuit board and the first heat sink are received in the receiving space along the gravity direction. One side of the first circuit board has at least one electronic element. The first heat sink has a first base board and at least first side board. The first base board is arranged adjacent to the first circuit board. The electronic element transferred heat to the first base board. The first side board connects to the first base board, and cooperatively forms a first heat dissipating channel along the gravity direction. The first side board is close to or contacts the housing, so that the heat of the electronic element can be transferred by heat conduction and heat convection to dissipate outside.