Abstract: A low-profile and small-size valve to a shut off a flow of fluid in a pipeline includes a frame, a tube, a moving part, a lever, an elastic part, a latch, and a trigger. The tube is movable with the moving part. The lever is rotatable around an axis. The elastic part can push the lever to rotate after the trigger pushes the buckle away from the lever to unlatch the lever and allow rotation. During the rotation of the lever, the lever pulls on the moving part, and the moving part pulls on the tube together to disconnect the tube from the pipe. The valve improves the convenience and efficiency of shutting off a flow of fluid. A pipeline and an immersion cooling system is also disclosed.

Abstract: A touchpad module includes a base plate, a touch member and an elastic structure between the touch member and the base plate. The elastic structure includes a supporting frame and a swingable resilience piece. There are a first fixing point and a second fixing point between the swingable resilience piece and the base plate. The swingable resilience piece includes a first resilience arm and a second resilience arm. The first resilience arm is connected between the first fixing point and a first inner side of the supporting frame. The second resilience arm is connected between the second fixing point and a second inner side of the supporting frame. When an external force is exerted on a first end of the touch member, the first resilience arm is correspondingly swung toward the base plate by using the first fixed point as a fulcrum.

Abstract: A semiconductor package includes a first package having a first side and a second side opposing the first side. The first package comprises a first electronic component and a second electronic component arranged in a side-by-side manner on the second side. A second package is mounted on the first side of the first package. The second package comprises a radiative antenna element. A connector is disposed on the second side.

Abstract: A method, a processing device, and a system for object tracking are proposed. The method includes the following steps. Imaging capturing is performed on an actual scene by using a primary camera and at least one secondary camera to respectively generate a primary image and at least one secondary image. Image stacking is performed on the primary image and the at least one secondary image to generate a stacked image. Position information and depth information of each object in the stacked image are computed. Whether there exist same objects among the objects in the stacked images is determined based on the position information and the depth information of each of the objects.

Abstract: A gear switching control device of an internal derailleur includes a plurality of planet gear speed change systems; a gear switching control unit; a plurality of axial ratchet control rings for controlling action of a plurality of axial ratchets; a plurality of axial ratchets; and the plurality of axial ratchet control rings are serially connected by the same gear switching control unit; characteristic in that: a gear switching control unit comprising: a track sleeve, one end of the track sleeve is installed with force accept portion and another end thereof is installed with a linking rod which IS used to serially connected a plurality of axial ratchet control rings; each of the axial ratchet control rings is formed with a respective connecting holes; each axial ratchet control ring being installed a cam or cam-like device; various cam having different operating moving range.

Abstract: A method of camera processing including receiving a first image, determining one or more first automatic white balance (AWB) parameters for the first image, determining one or more second AWB parameters for a region-of-interest (ROI) of the first image, applying the one or more first AWB parameters to one or more of the first image or a second image, and adjusting the ROI of one or more of the first image or the second image based on the one or more second AWB parameters.

Abstract: A touchpad module includes a bracket, a touch member and a supporting plate. The supporting plate is arranged between the bracket and the touch member. When an end of the touch member is pressed down, the end of the touch member is swung relative to the bracket through the supporting plate. The supporting plate includes a plate body, at least one supporting part and a swingable part. The plate body, the at least one supporting part and the swingable part are integrally formed as a one-piece structure. The present invention further provides a computing device with the touchpad module.

Abstract: The present disclosure describes a method for the formation of gate stacks having two or more titanium-aluminum (TiAl) layers with different Al concentrations (e.g., different Al/Ti ratios). For example, a gate structure can include a first TiAl layer with a first Al/Ti ratio and a second TiAl layer with a second Al/Ti ratio greater than the first Al/Ti ratio of the first TiAl layer.

Abstract: A multi-point measurement of a scene captured in an image frame may be used to process the image frame, such as by applying white balance corrections to the image frame. In some examples, the image frame may be segmented into portions that are illuminated by different illumination sources. Different portions of the image frame may be white balanced differently based on the color temperature of the illumination source for the corresponding portion. Infrared measurements of multiple points in the scene may be used to determine a characteristic of the illumination source of different portions of the scene. For example, a picture that includes indoor and outdoor portions may be illuminated by at least two illumination sources that produce different infrared measurements values. White balancing may be applied differently to these two portions to correct for color temperature of the different sources.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a gate structure over a fin structure. The semiconductor structure also includes a source/drain structure in the fin structure and adjacent to the gate structure. The semiconductor structure also includes a first contact plug over the source/drain structure. The semiconductor structure also includes a first via plug over the first contact plug. The semiconductor structure also includes a dielectric layer surrounding the first via plug. The first via plug includes a first group IV element and the dielectric layer includes the first group IV element and a second group IV element.

Abstract: A touchpad module includes a base plate, a touch member and an elastic structure between the touch member and the base plate. The elastic structure includes a supporting frame and a swingable resilience piece. There are a first fixing point and a second fixing point between the swingable resilience piece and the base plate. The swingable resilience piece includes a first resilience arm and a second resilience arm. The first resilience arm is connected between the first fixing point and a first inner side of the supporting frame. The second resilience arm is connected between the second fixing point and a second inner side of the supporting frame. When an external force is exerted on a first end of the touch member, the first resilience arm is correspondingly swung toward the base plate by using the first fixed point as a fulcrum.

Abstract: A semiconductor package includes a bottom chip package having a first side and a second side opposing the first side. The bottom chip package comprises a first semiconductor chip and a second semiconductor chip arranged in a side-by-side manner on the second side. A top antenna package is mounted on the first side of the bottom chip package. The top antenna package comprises a radiative antenna element. A connector is disposed on the second side.

Abstract: A semiconductor package structure includes a substrate, a redistribution layer, a first semiconductor die, and a first capacitor. The substrate has a wiring structure. The redistribution layer is disposed over the substrate. The first semiconductor die is disposed over the redistribution layer. The first capacitor is disposed in the substrate and is electrically coupled to the first semiconductor die. The first capacitor includes a first capacitor substrate, a plurality of first capacitor cells, and a first through via. The first capacitor substrate has a first top surface and a first bottom surface. The first capacitor cells are disposed in the first capacitor substrate. The first through via is disposed in the first capacitor substrate and electrically couples the first capacitor cells to the wiring structure on the first top surface and the first bottom surface.

Abstract: An underwater ultrasonic device is provided. The underwater ultrasonic device comprises: a setting area, wherein the setting area comprises a plurality of setting intervals in sequence, and a plurality of ultrasonic devices arranged in order along the setting area respectively corresponding to the setting intervals, wherein each of the ultrasonic devices has a signal opening angle, and the signal opening angle is greater than the arc angle of the arc interval corresponding to the ultrasonic device.

Abstract: An atmospheric pressure water ion generating device is arranged in a triphase organic matter pyrolysis system which includes a steam generating device and a pyrolysis and carbonization reaction device. The water ion generating device includes a connecting pipe connected with the steam generating device, and having an interior that is penetrated, a heating tube having a first end connected with the connecting pipe and having an interior provided with an air channel, and a spraying head connected with a second end of the heating tube, and having an interior that is tapered. The air channel has a surface provided with an alloy catalyst layer. The spraying head is provided with a nozzle which is connected with the pyrolysis and carbonization reaction device.

Abstract: A semiconductor device includes a substrate, a semiconductor fin, a gate structure, and source/drain structures. The semiconductor fin extends upwardly from the substrate. The gate structure is across the semiconductor fin and includes a high-k dielectric layer over the semiconductor fin, a fluorine-containing work function layer over the high-k dielectric layer and comprising fluorine, a tungsten-containing layer over the fluorine-containing work function layer, and a metal gate electrode over the tungsten-containing layer. The source/drain structures are on the semiconductor fin and at opposite sides of the gate structure.

Abstract: The present disclosure provides a socket structure including a casing, a main body, a frame and a cover. The casing includes plural lateral walls, a bottom, an opening and an accommodation space. The opening is defined by the lateral walls. The accommodation space is defined by the lateral walls and the bottom and is in communication with the opening. The main body is disposed in the accommodation space and includes a circuit board and a connection port disposed on the circuit board. The frame includes at least one plate and a first extending portion. The plate surrounds the periphery of the opening. The first extending portion is extended from the plate and is connected to one of the lateral walls. The cover covers the opening and includes a through hole. The through hole is configured to allow a plug to pass through and connect to the connection port.

Abstract: An underwater ultrasonic device is disclosed. The underwater ultrasonic device comprises a body and an ultrasonic transducer. The ultrasonic transducer has a curved interface having a first side and an adjacent second side for transmitting and receiving a plurality of ultrasonic signals, and the first side has a first curve and the second side has a second curve, wherein the first curve and the second curve has different curvatures. Therefore, the underwater ultrasonic device can achieve the purpose of underwater wide-angle measurement with increased sensitivity and transmission capability.

Abstract: An electronic device is provided. The electronic device includes a housing, a first circuit board, and a first heat sink. The housing forms a receiving space. The first circuit board and the first heat sink are received in the receiving space along the gravity direction. One side of the first circuit board has at least one electronic element. The first heat sink has a first base board and at least first side board. The first base board is arranged adjacent to the first circuit board. The electronic element transferred heat to the first base board. The first side board connects to the first base board, and cooperatively forms a first heat dissipating channel along the gravity direction. The first side board is close to or contacts the housing, so that the heat of the electronic element can be transferred by heat conduction and heat convection to dissipate outside.

Abstract: A semiconductor package includes a base comprising a top surface and a bottom surface that is opposite to the top surface; a first semiconductor chip mounted on the top surface of the base in a flip-chip manner; a second semiconductor chip stacked on the first semiconductor chip and electrically coupled to the base by wire bonding; an in-package heat dissipating element comprising a dummy silicon die adhered onto the second semiconductor chip by using a high-thermal conductive die attach film; and a molding compound encapsulating the first semiconductor die, the second semiconductor die, and the in-package heat dissipating element.