Patents by Inventor Chih Chen

Chih Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250143644
    Abstract: A smart ring with a physiological feature detecting method is applied to a target object. The smart ring includes a pressure sensor and an operation processor. The pressure sensor is adapted to detect a pressure value of the target object applied for the smart ring. The operation processor is electrically connected with the pressure sensor, and adapted to compare the pressure value with a preset condition and determine a behavior of the target object according to a comparison result of the pressure value and the preset condition for generating a related operation command.
    Type: Application
    Filed: January 10, 2025
    Publication date: May 8, 2025
    Applicant: PixArt Imaging Inc.
    Inventors: Yung-Chang Lin, Jian-Cheng Liao, Chun-Chih Chen
  • Patent number: 12294028
    Abstract: A method of manufacturing a semiconductor device includes at least the following steps. A protrusion is formed in a substrate by an anisotropic etch process, wherein a sidewall of the protrusion is inclined. A recess is formed on the sidewall of the protrusion by an isotropic etch process, wherein during the isotropic etch process, a by-product covers a first portion of the sidewall of the protrusion while exposing a second portion of the sidewall of the protrusion, so that the recess is formed between the first portion and the second portion of the sidewall.
    Type: Grant
    Filed: October 25, 2023
    Date of Patent: May 6, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jiun-Ming Kuo, Hsin-Chih Chen, Che-Yuan Hsu, Kuo-Chin Liu, Han-Yu Tsai, You-Ting Lin, Jen-Hong Chang
  • Patent number: 12293988
    Abstract: A semiconductor package includes a semiconductor die and a redistribution structure. The semiconductor die is laterally surrounded by a molding compound, and the semiconductor die has a conductive pillar and a complex compound sheath sandwiched between the conductive pillar and the molding compound. The redistribution structure is electrically connected with the semiconductor die and comprises a first via portion at a first side of the redistribution structure and a second via portion at a second side of the redistribution structure, and a base angle of the second via portion is greater than a base angle of the first via portion.
    Type: Grant
    Filed: July 27, 2023
    Date of Patent: May 6, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Hung-Chun Cho
  • Publication number: 20250139934
    Abstract: In various examples, sensor data representative of an image of a field of view of a vehicle sensor may be received and the sensor data may be applied to a machine learning model. The machine learning model may compute a segmentation mask representative of portions of the image corresponding to lane markings of the driving surface of the vehicle. Analysis of the segmentation mask may be performed to determine lane marking types, and lane boundaries may be generated by performing curve fitting on the lane markings corresponding to each of the lane marking types. The data representative of the lane boundaries may then be sent to a component of the vehicle for use in navigating the vehicle through the driving surface.
    Type: Application
    Filed: December 30, 2024
    Publication date: May 1, 2025
    Inventors: Yifang Xu, Xin Liu, Chia-Chih Chen, Carolina Parada, Davide Onofrio, Minwoo Park, Mehdi Sajjadi Mohammadabadi, Vijay Chintalapudi, Ozan Tonkal, John Zedlewski, Pekka Janis, Jan Nikolaus Fritsch, Gordon Grigor, Zuoguan Wang, I-Kuei Chen, Miguel Sainz
  • Publication number: 20250141097
    Abstract: An antenna structure is capable of transceiving signals for a head-mounted wireless transmission display device including a display screen assembly. The antenna structure includes at least two body portions. Each of the body portions has at least a signal transceiving end. The body portions are respectively arranged at left and right sides of the display screen assembly. The signal transceiving ends of the body portions are extended outward from the left and right sides of the display screen assembly respectively. A first distance between the two signal transceiving ends is greater than a width of the display screen assembly.
    Type: Application
    Filed: December 27, 2024
    Publication date: May 1, 2025
    Applicant: HTC CORPORATION
    Inventors: Sheng Cherng LIN, Hsiao-Ling CHAN, Chen-Hao CHANG, Chien-Chih CHEN
  • Publication number: 20250140522
    Abstract: A process gas is flowed from an input metal gas line that is electrically grounded to an output metal gas line via a connecting tube which is electrically insulating. Couplings between the metal gas lines and the connecting tube are sealed with gas couplings. Each gas coupling includes a sealing gasket, and a clamp compressing the sealing gasket between an end of the respective metal gas line and a corresponding end of the connecting tube. The process gas is delivered to a semiconductor processing tool via the output metal gas line. At least one operation is performed at the semiconductor processing tool that utilizes both the process gas delivered to the process tool via the output metal gas line and an electrical voltage of at least 2 kilovolts. The connecting tube may be sapphire. The sealing gaskets may be polytetrafluoroethylene (PTFE) sealing gaskets.
    Type: Application
    Filed: October 26, 2023
    Publication date: May 1, 2025
    Inventors: Chun-Wei Cheng, Kai Fu Chuang, Yi-Ming Lin, Kuo-Chiang Chen, Chih-Chen Chao, Ting-Cheng Chen
  • Patent number: 12286084
    Abstract: A Car Door Inner Handle Base Repair Method is a technique used to repair the fracture and separation of the welding post between the car door inner handle base and the inner door panel body without the need to replace the entire car door inner panel assembly. This method involves creating an identical repair component by copying the car door inner handle base. The repair component includes multiple corresponding through-posts, aligned with the welding posts of the damaged inner door panel body and the damaged car door inner handle base. To execute the repair, the damaged inner door panel body is drilled with holes corresponding to the through-posts, and the repair component's multiple through-posts are inserted into the corresponding holes on the damaged inner door panel, securing the repair component in place using locking mechanisms.
    Type: Grant
    Filed: October 17, 2023
    Date of Patent: April 29, 2025
    Assignee: HUSHAN AUTOPARTS INC.
    Inventors: Ying-Chih Chen, Ching-Chiang Tsai, Chang-Sheng Su
  • Patent number: 12289893
    Abstract: A semiconductor device includes a first electrode layer, a ferroelectric layer, a first alignment layer and a second electrode layer. A material of the first alignment layer includes rare-earth metal oxide. The ferroelectric layer and the first alignment layer are disposed between the first electrode layer and the second electrode layer, and the first alignment layer is disposed between the ferroelectric layer and the first electrode layer.
    Type: Grant
    Filed: May 10, 2022
    Date of Patent: April 29, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Chieh Lu, Qing Shi, Bo-Feng Young, Yu-Chuan Shih, Sai-Hooi Yeong, Blanka Magyari-Kope, Ying-Chih Chen, Tzer-Min Shen, Yu-Ming Lin, Chung-Te Lin
  • Publication number: 20250133927
    Abstract: An electronic device includes a flexible substrate and a conductive wire structure. The conductive wire structure is disposed on the flexible substrate and includes a first segment, a second segment, a third segment, a fourth segment, a first joint portion, a second joint portion, a third joint portion and a fourth joint portion. A first opening is surrounded by the first segment, the second segment, the first joint portion and the second joint portion. A second opening is surrounded by the third segment, the fourth segment, the third joint portion and the fourth joint portion. Along a first direction, a ratio of a first width sum of widths of the first segment, the second segment, the third segment and the fourth segment to a second width sum of widths of the first joint portion and the third joint portion is in a range from 0.8 to 1.2.
    Type: Application
    Filed: January 2, 2025
    Publication date: April 24, 2025
    Applicant: InnoLux Corporation
    Inventors: Ya-Wen Lin, Chien-Chih Chen, Yen-Hsi Tu, Cheng-Wei Chang, Shu-Hui Yang
  • Publication number: 20250133812
    Abstract: A method of forming a semiconductor device includes forming a first dielectric layer over a front side of a wafer, the wafer having a plurality of dies at the front side of the wafer, the first dielectric layer having a first shrinkage ratio smaller than a first pre-determined threshold; curing the first dielectric layer at a first temperature, where after curing the first dielectric layer, a first distance between a highest point of an upper surface of the first dielectric layer and a lowest point of the upper surface of the first dielectric layer is smaller than a second pre-determined threshold; thinning the wafer from a backside of the wafer; and performing a dicing process to separate the plurality of dies into individual dies.
    Type: Application
    Filed: December 26, 2024
    Publication date: April 24, 2025
    Inventors: Meng-Che Tu, Wei-Chih Chen, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu
  • Patent number: 12283545
    Abstract: A package structure includes a semiconductor die and a first redistribution circuit structure. The first redistribution circuit structure is disposed on and electrically connected to the semiconductor die, and includes a first build-up layer. The first build-up layer includes a first metallization layer and a first dielectric layer laterally wrapping the first metallization layer, wherein at least a portion of the first metallization layer is protruded out of the first dielectric layer.
    Type: Grant
    Filed: August 1, 2023
    Date of Patent: April 22, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yung-Chi Chu, Hung-Jui Kuo, Yu-Hsiang Hu, Wei-Chih Chen
  • Patent number: 12278272
    Abstract: In some embodiments, the present disclosure relates to a method of forming a transistor device. The method includes forming a source contact over a substrate, forming a drain contact over the substrate, and forming a gate contact material over the substrate. The gate contact material is patterned to define a gate structure that wraps around the source contact along a continuous and unbroken path.
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: April 15, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Aurelien Gauthier Brun, Chun Lin Tsai, Jiun-Lei Jerry Yu, Po-Chih Chen, Yun-Hsiang Wang
  • Patent number: 12274987
    Abstract: A platelet filtration membrane and its application for preparing platelets rich plasma and separating platelets from blood samples are disclosed. The platelet filtration membrane comprises a coating layer and a porous substrate. The coating layer composition comprises a first copolymer having a plurality of amide groups and a second copolymer having a plurality of carboxylic acid groups, and the porous substrate comprises PE, PP, PS, PET, PTFE, PVDF, ceramic or rayon. The coating layer is on surfaces of the porous substrate to form the platelet filtration membrane.
    Type: Grant
    Filed: November 8, 2021
    Date of Patent: April 15, 2025
    Assignee: CHUNG YUAN CHRISTIAN UNIVERSITY
    Inventors: Yung Chang, Chih Chen Yeh
  • Publication number: 20250108430
    Abstract: An installation tool for a self-tapping rivet fastener contains: a body, a movable sleeve, a handle, a single-direction thrust bearing, a switcher, a drive rod, a transmission shaft, a cap, a locking element, and a screw nut. The body includes multiple ribs, two protrusions, two slots, a circular orifice, a stepped fringe, a positioning orifice, a threaded section, and a connection groove. The movable sleeve moves on the body. The handle includes a hollowly circular fitting portion. The switcher includes a coupling portion, a connection flange, a defining hole, and a fitting hole. The drive rod includes a shank, a positioning fringe, and a fixing portion. The transmission shaft includes a threaded orifice, a connecting portion, and a shoulder. The cap is hollow. The locking element includes a threaded extension, a driving portion, and a threaded aperture. The screw nut includes a screwing section and a receiving orifice.
    Type: Application
    Filed: October 1, 2023
    Publication date: April 3, 2025
    Inventor: Wei-Chih Chen
  • Publication number: 20250112548
    Abstract: A power converter and a power conversion method are provided and capable of bus capacitor voltage balance based on inherent inductor components of the power converter. Compared with the conventional approach that adds a balance circuit, the power converter and the power conversion method can reduce a size of overall circuit and improve a power density. In addition, two relays of the power converter are configured to switch switching states such that two inductors store or release energy, thereby transmitting electrical energy between two bus capacitors and two load capacitors. The power converter and the power conversion method are able to realize energy balance and hybrid power supply and satisfy various load requirements.
    Type: Application
    Filed: November 22, 2023
    Publication date: April 3, 2025
    Inventors: Hung-Chieh Lin, Yi-Ping Hsieh, Hsin-Chih Chen, Hung-Yu Huang, Jin-Zhong Huang
  • Publication number: 20250110526
    Abstract: Systems and methods are provided for a clock generator is configured to generate N clock signals evenly spaced by phase. A clock generator includes a poly phase filter configured to utilize a differential clock signal to generate N intermediate signals, the intermediate signals being spaced approximately 360/N degrees apart in phase. A phase error corrector is configured to receive the intermediate signals and to generate N clock output signals, where a phase error is a measure of a difference in phase between consecutive ones of the clock output signals from 360/N degrees, the phase error corrector being configured to reduce phase error among the clock output signals based on a feedback signal. A phase error detection circuit is configured to receive the clock output signals and to generate the feedback signal based on detected phase errors among the clock output signals.
    Type: Application
    Filed: December 13, 2024
    Publication date: April 3, 2025
    Inventor: Wei Chih Chen
  • Patent number: 12266148
    Abstract: In various examples, sensor data representative of an image of a field of view of a vehicle sensor may be received and the sensor data may be applied to a machine learning model. The machine learning model may compute a segmentation mask representative of portions of the image corresponding to lane markings of the driving surface of the vehicle. Analysis of the segmentation mask may be performed to determine lane marking types, and lane boundaries may be generated by performing curve fitting on the lane markings corresponding to each of the lane marking types. The data representative of the lane boundaries may then be sent to a component of the vehicle for use in navigating the vehicle through the driving surface.
    Type: Grant
    Filed: May 1, 2023
    Date of Patent: April 1, 2025
    Assignee: NVIDIA Corporation
    Inventors: Yifang Xu, Xin Liu, Chia-Chih Chen, Carolina Parada, Davide Onofrio, Minwoo Park, Mehdi Sajjadi Mohammadabadi, Vijay Chintalapudi, Ozan Tonkal, John Zedlewski, Pekka Janis, Jan Nikolaus Fritsch, Gordon Grigor, Zuoguan Wang, I-Kuei Chen, Miguel Sainz
  • Patent number: 12257746
    Abstract: A method of producing a container product comprises providing a mold including a first part and a second part. The mold is closed to define a cavity having a first area and a second area. A molten plastic composition including a polymer and a physical blowing agent is filled into the cavity. Then, the molten plastic composition in the cavity is cooled, such that the molten plastic composition in the first area is completely cooled and solidifies or a central portion of the first area has micro uncooled molten plastic composition. The second area has the plastic composition in the molten state. The first part of the mold is moved in the axial direction. The molten plastic composition in the second area forms a beehive foam after foaming and expansion. Then, the foamed container product in the mold is cooled to take shape and then removed after opening the mold.
    Type: Grant
    Filed: May 17, 2023
    Date of Patent: March 25, 2025
    Inventor: Chih-Chen Wang
  • Publication number: 20250092508
    Abstract: A physical vapor deposition (PVD) target for performing a PVD process is provided. The PVD target includes a backing plate and a target plate coupled to the backing plate. The target plate includes a sputtering source material and a dopant, with the proviso that the dopant is not impurities in the sputtering source material. The sputtering source material includes a diffusion barrier material.
    Type: Application
    Filed: November 27, 2024
    Publication date: March 20, 2025
    Inventors: Chia-Hsi WANG, Yen-Yu CHEN, Yi-Chih CHEN, Shih-Wei BIH
  • Publication number: 20250096059
    Abstract: A redistribution structure is made using filler-free insulating materials with high shrinkage rate. As a result, good planarity may be achieved without the need to perform a planarization of each insulating layer of the redistribution structure, thereby simplifying the formation of the redistribution structure.
    Type: Application
    Filed: December 2, 2024
    Publication date: March 20, 2025
    Inventors: Wei-Chih Chen, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo