Abstract: A handle structure includes a holding member, a press member, and a hook. The holding member includes a holding portion and a space formed in the holding portion. The press member includes a press portion and a plurality of adjustment holes. The press portion is movably disposed in the space. The adjustment holes are disposed on the other end of the press member opposite to the press portion. The hook includes a clasp portion and at least one fastening hole. The fastening hole is adjustably positioned corresponding to any of the adjustment holes, and the clasp portion is movable along with the movement of the press portion, wherein the clasp portion protrudes out of the holding member. The hook moves by pressing the press portion.

Abstract: The present disclosure relates to an integrated circuit device and an associated method of formation. The integrated circuit device includes a substrate, and a conductive metal interconnect line arranged within a dielectric material disposed over the substrate. An interfacial layer is in contact with an upper surface of the conductive metal interconnect line. An upper dielectric layer is arranged over the interfacial layer. A middle dielectric layer is arranged between the upper dielectric layer and the interfacial layer.

Abstract: Among other things, one or more techniques for creating an array model for analog device modeling are provided. In an embodiment, the array model represents a mean value or a standard deviation value of an analog device characteristic for an analog device based on a physical location of the analog device within a circuit layout, where the physical location is identified using a physical set of coordinates. The physical set of coordinates maps to an array set of coordinates of the array model. In this manner, a mean value and a standard deviation value are obtainable from the array model using the array set of coordinates. The mean value and the standard deviation value are usable to model the analog device, and thus a circuit within which the analog device is used, to obtain a more accurate or realistic prediction of operation or behavior, for example.

Abstract: Among other things, one or more systems and techniques for transition time evaluation of a circuit are provided herein. In some embodiments, a comparator is configured to receive a circuit signal from the circuit. The circuit signal is evaluated by the comparator based upon one or more control voltages to create one or more voltage waveforms. In some embodiments, the one or more voltage waveforms have substantially similar slopes. A time converter, such as a time-to-current converter or a time-to-digital converter, is used to evaluate the one or more output waveforms to determine a transition time, such as a rise time or a fall time, of the circuit. In some embodiments, the one or more output waveforms are used to reconstruct a transition waveform representing a waveform of the circuit signal.

Abstract: An embodiment is a semiconductor device, comprising: a substrate; a plurality of fin structures disposed on the substrate; a plurality of first strained materials disposed on each of the plurality of the fin structures; a plurality of cap layers individually formed on each of the plurality of first strained materials, wherein at least two cap layers are connected to each other; a second strained material disposed on the at least two cap layers which are connected to each other.

Abstract: A circuit for measuring the gain of an operational amplifier is provided. The circuit comprises a first operational amplifier, a first resistive device and a second resistive device. The first operational amplifier has an original gain and includes a first input terminal and a second input terminal. The first resistive device is coupled between the first input terminal and the second input terminal of the first operational amplifier. The second resistive device is coupled to the second input terminal of the first operational amplifier. The first resistive device and the second resistive device are configured to reduce a predetermined amount of gain from the original gain of the first operational amplifier.

Abstract: A light guide plate with multi-directional structures includes a main body, a plurality of first microstructures and a plurality of second microstructures. The main body includes a light-incident surface, a light-emitting surface and a reflecting surface. The light-incident surface connects the light-emitting surface and the reflecting surface. The first, microstructures are disposed on the light-emitting surface or the reflecting surface and arranged along a first extending direction The second microstructures are disposed on the light-emitting surface or the reflecting surface and arranged along a second extending direction. The second microstructures and the first microstructures are disposed on the same plane and intersect with each other. Each of the second microstructures is a single stripe pattern, and has a width which becomes gradually smaller from one end of the second microstructure near the light-incident surface to the other end of the second microstructure away from the light-incident surface.

Abstract: Integrated circuit devices and method of forming them. The devices include a dielectric barrier layer formed over a copper-containing metal interconnect structure. The dielectric barrier layer inhibits electro-migration of Cu. The dielectric barrier layer includes a metal-containing layer that forms an interface with the interconnect structure. Incorporating metal within the interfacial layer improves adhesion of the dielectric barrier layer to copper lines and the like and provides superior electro-migration resistance over the operating lifetime of the devices.

Abstract: A backlight module and a liquid crystal display are described. The backlight module includes a light guide plate, a light source and a prism sheet. The light guide plate includes a light-emitting surface, a light-incident surface and an axis. The light-incident surface is connected to the light-emitting surface. The axis is normal to the light-incident surface. The light source emits light towards the light-incident surface. The prism sheet is disposed on the light guide plate and includes a first optical surface and a plurality of prism structures which are disposed on the first optical surface. Each of the prism structures has a first surface and a second surface. The first surface and the second surface are connected to form a ridge. The ridge is vertical to the light-incident surface, or an angle included between the ridge and the axis is smaller than or equal to 20 degrees.

Abstract: A light guide plate with multi-directional structures includes a main body, a plurality of first microstructures and a plurality of second microstructures. The main body includes a light-incident surface, a light-emitting surface and a reflecting surface. The light-incident surface connects the light-emitting surface and the reflecting surface. The first microstructures are disposed on the light-emitting surface or the reflecting surface and arranged along a first extending direction. The second microstructures are disposed on the light-emitting surface or the reflecting surface and arranged along a second extending direction. The second microstructures and the first microstructures are disposed on the same plane and intersect with each other. Each of the second microstructures is a single stripe pattern, and has a width which becomes gradually smaller from one end of the second microstructure near the light-incident surface to the other end of the second microstructure away from the light-incident surface.

Abstract: A box structure for a data storage device is assembled in a chassis having a connector. The box structure includes a frame module, a holder, a stop assembly, and an operation handle. The frame module is provided for accommodating the data storage device. The holder is assembled on one side of the frame module. A damper is disposed between the holder and the frame module, the damper enables the holder to move along the frame module. A stop assembly is disposed at one end of the frame module. The stop assembly includes a stopper and a movable block in contact with the stopper, and the movable block is movable to release the stopper. The operation handle is pivotally connected to the frame module and is rotatable to form an open angle to push the movable block to move.

Abstract: A method of density-controlled floorplan design for integrated circuits having a plurality of blocks includes positioning decoupling capacitor (DCAP) cells at least partially around a pattern density sensitive block. The method also includes changing at least a portion of a pattern density insensitive block adjacent to the pattern density sensitive block according to at least one pattern density rule.

Abstract: Packaging methods, material dispensing methods and apparatuses, and automatic measurement systems are disclosed. In one embodiment, a method of packaging semiconductor devices includes coupling a second die to a top surface of a first die, dispensing a first amount of underfill material between the first die and the second die, and capturing an image of the underfill material. Based on the image captured, a second amount or no additional amount of underfill material is dispensed between the first die and the second die.

Abstract: A switching method for an electronic device having sensing regions is mentioned. The switching method is configured to detect signals received by the electronic device, so as to switch the states of the electronic device. The switching method comprises receiving a first signal at a first moment and receiving a second signal at a second moment, wherein the first signal is generated by touching a first sensing region and the second signal is generated by touching a second sensing region; measuring a triggering duration and determining whether the triggering duration is consistent with a predetermined duration, when the first signal and the second signal are inputted simultaneously; switching the electronic device from a first state to a second state, if the triggering duration is consistent with the predetermined duration; and maintaining the electronic device in the first state, if the triggering duration is not consistent with the predetermined duration.

Abstract: A touch display device is disclosed, which comprises: a display; a touch panel disposed on the display; and a protective layer disposed on the touch panel, wherein at least one of the high refractive layer is disposed between the protective layer and the touch panel, and the high refractive layer has a refractive index greater than 1.5 and less than 2.0.

Abstract: An installation structure of countertop faucet includes a base having an insertion section extending through a mounting hole formed in a counter to engage a locking nut to be secured. The insertion section has a top end forming a receiving bore of which a circumferential wall forming two positioning holes communicating with the receiving bore. Each positioning hole receives therein a releasing module. The bottom of the base forms two water inlet passages communicating with the receiving bore and receiving stop valves therein and coupled to couplers for connection with water inlet tubes. A faucet has a joint section received in the receiving bore and having water guide tubes fit into the water inlet passages. The joint section forms two receiving apertures receiving therein positioning modules respectively engageable with the positioning holes to fix the faucet and being released by the releasing module to detach the faucet from the base.

Abstract: A method of density-controlled floorplan design for integrated circuits having a plurality of blocks includes positioning decoupling capacitor (DCAP) cells at least partially around a pattern density sensitive block. The method also includes changing at least a portion of a pattern density insensitive block adjacent to the pattern density sensitive block according to at least one pattern density rule.

Abstract: A circuit for measuring a bandwidth of an amplifier includes a switch-capacitor circuit and a controller. The switch-capacitor circuit is coupled to an output and an input of the amplifier. The switch-capacitor circuit is switchable between a sampling mode and an amplification mode. The controller is coupled to the switch-capacitor circuit and the output of the amplifier. The controller is configured to switch the switch-capacitor circuit between the sampling mode and the amplification mode, control the amplification mode to have various durations, and determine the bandwidth of the amplifier based on the various durations of the amplification mode and corresponding voltages at the output of the amplifier.

Abstract: A circuit for measuring the gain of an operational amplifier is provided. The circuit comprises a first operational amplifier, a first resistive device and a second resistive device. The first operational amplifier has an original gain and includes a first input terminal and a second input terminal. The first resistive device is coupled between the first input terminal and the second input terminal of the first operational amplifier. The second resistive device is coupled to the second input terminal of the first operational amplifier. The first resistive device and the second resistive device are configured to reduce a predetermined amount of gain from the original gain of the first operational amplifier.

Abstract: A method of determining an effective capacitance of a ring oscillator free of short current. The method comprises determining a frequency of an oscillator signal communicated from a ring oscillator to an inverter via a first communication path. The first communication path has connectivity to a first voltage source, a ground path and the inverter. The first communication path is divided into a second communication path and a third communication path. The method further comprises determining a voltage line current. The method additionally comprises determining an effective capacitance of the ring oscillator based on a first voltage of the first voltage source, the voltage line current and the frequency of the oscillator signal communicated to the inverter along the third communication path.