Patents by Inventor Chih-Chieh (Steve) Wang

Chih-Chieh (Steve) Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220175423
    Abstract: A low-profile offset-type spinal fusion device includes a first screw, a connection base, a nut and a compression part. The first screw has an external thread and a flange. The connection base includes a penetration part and a connection part disposed no higher than the penetration part, and can sleeve the first screw through a first hole of the penetration part to contact the flange with opposite ends of the first screw protruding out of the first hole. The nut, used to engage the first screw, has a bottom surface to contact against the penetration part. When the first screw is installed by penetrating the first hole, the nut and the flange are located to opposite ends of the first hole. The compression part is to screw into a cavity of the connection part for depressing a connecting bar tightly in the cavity.
    Type: Application
    Filed: August 31, 2021
    Publication date: June 9, 2022
    Inventors: HSIN-HSIN SHEN, PEI-I TSAI, CHIH-CHIEH HUANG, KUO-YI YANG, YI-HUNG WEN, WEI-LUN FAN, FANG-JIE JANG, SHIH-PING LIN
  • Publication number: 20220175432
    Abstract: A bone screw includes an external screw thread, an internal supporter structure and a porous layer. The internal supporter structure is inside the external screw thread. The internal supporter structure includes a screw thread supporter or a polygonal wall supporter. The porous layer is on a surface of the internal supporter structure. Therefore, the bone screw has an increased strength and also provides postoperative healing effect.
    Type: Application
    Filed: December 4, 2020
    Publication date: June 9, 2022
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsin-Hsin SHEN, Pei-I TSAI, Kuo-Yi YANG, Fang-Jie JANG, An-Li CHEN, Shih-Ping LIN, Chih-Chieh HUANG, Yi-Hung WEN, Wei-Lun FAN, Shin-I HUANG
  • Publication number: 20220178990
    Abstract: A testing equipment includes a testing platform and a component carrying device including a carrying arm, a vacuum suction unit, a working bottom cover and a fluid transmission assembly. The carrying arm lifts and carries a device under test (DUT) onto the testing platform. The vacuum suction unit removably sucks to the DUT. The working bottom cover includes a cover body and an elastic airtight ring. The cover body is connected to the carrying arm, and the elastic airtight ring is fixedly disposed on the cover body for hermetically covering the DUT, so that a liquid filling space is collectively formed by the cover body and the DUT. The fluid transmission assembly extends into the liquid filling space for continuously passing a working liquid to the DUT and withdrawing the working liquid back away from the liquid filling space for thermally exchanging with the DUT.
    Type: Application
    Filed: January 21, 2021
    Publication date: June 9, 2022
    Inventors: Chih-Chieh LIAO, Chih-Feng CHENG, Yu-Min SUN
  • Publication number: 20220176306
    Abstract: A planar separation component for gas chromatograph includes a substrate made of aluminum, a porous anodic aluminum oxide separation member, and a cover unit. The substrate has a planar body, and a first flow channel having a first inlet and a first outlet. The separation member is formed on the substrate, and has a channel-defining wall defining the first flow channel and a plurality of nanosized pores in spatial communication with the first flow channel. The cover unit is bonded to the planar body for covering the first flow channel. Methods for manufacturing the planar separation component and separating a mixture containing compounds different in boiling point using the planar separation component are also disclosed.
    Type: Application
    Filed: July 1, 2021
    Publication date: June 9, 2022
    Applicant: National Taiwan Normal University
    Inventors: Chia-Jung LU, Chih-Chieh Fan
  • Patent number: 11351037
    Abstract: The disclosure relates to a vertebral body implant including a flexible main body and at least one pedicle screw joint. The flexible main body is an integrally formed single piece having at least one joint-accommodating hole and at least one opening connected to the at least one joint-accommodating hole. The pedicle screw joint is an integrally formed single piece movably accommodated in the at least one joint-accommodating hole.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: June 7, 2022
    Assignees: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, NATIONAL TAIWAN UNIVERSITY HOSPITAL
    Inventors: Fang-Jie Jang, Pei-I Tsai, De-Yau Lin, An-Li Chen, Fon-Yih Tsuang, Chih-Chieh Huang, Hsin-Hsin Shen
  • Patent number: 11354595
    Abstract: Original data for machine learning training can be received. The original data can be divided into baseline data and difference data. The baseline data and the difference data can be stored in different memory devices of the memory hierarchy associated with a computer, wherein the baseline data is stored in a first memory device having faster access speed than a second memory device in which the difference data is stored. The baseline data and the difference data can be loaded from the different memory devices. The original data can be reconstructed from the baseline data and the difference data. The reconstructed original data can be fed to a machine learning model to train the machine learning model.
    Type: Grant
    Filed: April 1, 2020
    Date of Patent: June 7, 2022
    Assignee: International Business Machines Corporation
    Inventors: Eun Kyung Lee, Guojing Cong, Chih-Chieh Yang
  • Patent number: 11348920
    Abstract: A semiconductor device includes a first source/drain structure, a channel layer, a second source/drain structure, a gate structure and an epitaxial layer. The channel layer is above the first source/drain structure. The second source/drain structure is above the channel layer. The gate structure is on opposite first and second sidewalls of the channel layer when viewed in a first cross-section taken along a first direction. The gate structure is also on a third sidewall of the channel layer but absent from a fourth sidewall of the channel layer when viewed in a second cross-section taken along a second direction different from the first direction. The epitaxial layer is on the fourth sidewall of the channel layer when viewed in the second cross-section and forming a P-N junction with the channel layer.
    Type: Grant
    Filed: October 8, 2020
    Date of Patent: May 31, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hung-Li Chiang, Szu-Wei Huang, Chih-Chieh Yeh, Yee-Chia Yeo
  • Patent number: 11340288
    Abstract: A testing equipment includes a testing platform and a component carrying device including a carrying arm, a vacuum suction unit, a working bottom cover and a fluid transmission assembly. The carrying arm lifts and carries a device under test (DUT) onto the testing platform. The vacuum suction unit removably sucks to the DUT. The working bottom cover includes a cover body and an elastic airtight ring. The cover body is connected to the carrying arm, and the elastic airtight ring is fixedly disposed on the cover body for hermetically covering the DUT, so that a liquid filling space is collectively formed by the cover body and the DUT. The fluid transmission assembly extends into the liquid filling space for continuously passing a working liquid to the DUT and withdrawing the working liquid back away from the liquid filling space for thermally exchanging with the DUT.
    Type: Grant
    Filed: January 21, 2021
    Date of Patent: May 24, 2022
    Assignees: GLOBAL UNICHIP CORPORATION, TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chih-Chieh Liao, Chih-Feng Cheng, Yu-Min Sun
  • Publication number: 20220153624
    Abstract: A casting structure allowing inlayed inner and outer member to be viewed includes: at least one inner member, formed as a three-dimensional shape; an outer member, formed with an inlaying space for allowing the inner member to be combined and inlayed therein, wherein the outer member is a three-dimensional shape formed through a material capable being viewed through; and a filling material member, made of a material capable of being viewed through and filled at an outer side of the outer member inlayed with the inner member so as to form a casting member; wherein, with the inner member being inlayed in the outer member, the filling material member is able to enclose and to be processed with a casting operation for forming the casting member capable of being viewed through.
    Type: Application
    Filed: April 1, 2021
    Publication date: May 19, 2022
    Inventor: Chih-Chieh LIN
  • Publication number: 20220157209
    Abstract: An object forming structure includes: at least two first original images, respectively provided with different vectors, and extended for forming at least two first original image three-dimensional shapes; at least one intersect fixed point, extended with at least one intersect direction through the intersect fixed point, wherein at least two second image three-dimensional shapes are formed through the first original image three-dimensional shapes being extended; and at least two third image three-dimensional shapes, stacked with the at least two second image three-dimensional shapes, wherein a Boolean function is utilized for confirming a selected desired zone for forming a new object formation; wherein, the new object formation formed via the third image three-dimensional shapes is obtained through a combination of intersect or union or equalize the different vectors, the first original image three-dimensional shapes are presented via the corresponding vectors for presenting different shapes in other angles.
    Type: Application
    Filed: April 1, 2021
    Publication date: May 19, 2022
    Inventor: Chih-Chieh LIN
  • Patent number: 11324899
    Abstract: A nebulizer with orientation independent operation is provided. The nebulizer includes an outer tube, an inner tube provided in the outer tube, and a mesh structure disposed above an end of the outer tube. A first channel, a main channel, and a second channel are formed between the outer tube and the inner tube. When in use, capillary force is created in the main channel, such that a liquid contained in the inner tube can be transported sequentially through the second channel, the main channel, and the first channel to the mesh structure. The liquid is nebulized and dispersed into the air through vibrations of the mesh structure actuated by an annular vibration source.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: May 10, 2022
    Assignee: National Taiwan University
    Inventors: Chih-Chieh Chen, Sheng-Hsiu Huang, Chih-Wei Lin, Yu-Mei Kuo, Wei-Ren Ke
  • Publication number: 20220136724
    Abstract: A testing apparatus including a base and a preheating unit arranged on the base is provided. The preheating unit includes a gas generator, a blocking mechanism and a heating device. The gas generator is configured to discharge air toward the base to form an air wall. The blocking mechanism is located above the air wall and forms a heat preservation space with the air wall. The heating device is arranged in the heat preservation space.
    Type: Application
    Filed: December 10, 2020
    Publication date: May 5, 2022
    Applicants: Global Unichip Corporation, Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Chieh Liao, Yu-Min Sun, Chih-Feng Cheng
  • Publication number: 20220136816
    Abstract: An inspecting device including a carrier, multiple telescopic probes, a locking component and a conductive structure is provided. The carrier has a through hole and a ground pad corresponding to the through hole. The through hole penetrates from the first surface to the second surface of the carrier, and the ground pad is disposed on the second surface. The telescopic probes are disposed in parallel on the first surface of the carrier. The locking component passes through the through hole and is disposed between two adjacent telescopic probes of the multiple telescopic probes. The locking component includes a screw. A head of the screw has a first pitch and a second pitch, and a density of the first pitch is different from a density of the second pitch. The conductive structure is partially embedded in the locking component, and the conductive structure, the locking component and the ground pad are electrically connected.
    Type: Application
    Filed: December 13, 2020
    Publication date: May 5, 2022
    Applicants: Global Unichip Corporation, Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Chieh Liao, Yu-Min Sun, Chih-Feng Cheng
  • Patent number: 11322470
    Abstract: A semiconductor package includes an interconnect structure having a first surface and a second surface opposite to the first surface, an insulating layer contacting the second surface of the interconnect structure wherein the insulating layer has a third surface facing the second surface of the interconnect structure and a fourth surface opposite to the third surface, at least one optical chip over the fourth surface of the insulating layer and electrically coupled to the interconnect structure, and a molding compound over the first surface of the interconnect structure.
    Type: Grant
    Filed: May 20, 2020
    Date of Patent: May 3, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chuei-Tang Wang, Chih-Chieh Chang, Yu-Kuang Liao, Hsing-Kuo Hsia, Chih-Yuan Chang, Jeng-Shien Hsieh, Chen-Hua Yu
  • Publication number: 20220130839
    Abstract: A method for fabricating buried word line of a dynamic random access memory (DRAM) includes the steps of: forming a trench in a substrate; forming a first conductive layer in the trench; forming a second conductive layer on the first conductive layer, in which the second conductive layer above the substrate and the second conductive layer below the substrate comprise different thickness; and forming a third conductive layer on the second conductive layer to fill the trench.
    Type: Application
    Filed: January 6, 2022
    Publication date: April 28, 2022
    Applicants: UNITED MICROELECTRONICS CORP., Fujian Jinhua Integrated Circuit Co., Ltd.
    Inventors: Pin-Hong Chen, Yi-Wei Chen, Tzu-Chieh Chen, Chih-Chieh Tsai, Chia-Chen Wu, Kai-Jiun Chang, Yi-An Huang, Tsun-Min Cheng
  • Publication number: 20220120812
    Abstract: The present invention discloses an isolation circuit having test mechanism. An isolation circuit component performs signal transmission when a signal that a control terminal receives has an enabling state and performs signal isolation when the signal has a disabling state. The test circuit includes a multiplexer and a control circuit. Under a shifting operation state in a test mode, the control circuit controls the multiplexer to select an operation input terminal to receive and output an isolation control signal having the enabling state to the control input terminal. Under a capturing operation state in the test mode, the control circuit controls the multiplexer to select a test input terminal to receive and output the test signal to the control input terminal. The control circuit further determines whether the isolation circuit performs signal transmission or signal isolation according to the signals at the data input terminal and the data output terminal.
    Type: Application
    Filed: October 14, 2021
    Publication date: April 21, 2022
    Inventors: KUO-KAI LIU, CHIH-CHIEH CHENG, PEI-YING HSUEH
  • Patent number: 11309385
    Abstract: Transistor structures and methods of forming transistor structures are provided. The transistor structures include alternating layers of a first epitaxial material and a second epitaxial material. In some embodiments, one of the first epitaxial material and the second epitaxial material may be removed for one of an n-type or p-type transistor. A bottommost layer of the first epitaxial material and the second epitaxial material maybe be removed, and sidewalls of one of the first epitaxial material and the second epitaxial material may be indented or recessed.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: April 19, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Yi Peng, Hung-Li Chiang, Yu-Lin Yang, Chih Chieh Yeh, Yee-Chia Yeo, Chi-Wen Liu
  • Publication number: 20220115086
    Abstract: Altering protein-ligand structures by generating molecular trajectory data for a protein-ligand structure, determining a molecular level binding affinity according to the molecular trajectory data, determining an atom level binding affinity for a first atom of the protein-ligand structure according to the molecular trajectory data, determining a correlation between the atom level and the molecular level binding affinities, and altering the protein-ligand structure according to the correlation.
    Type: Application
    Filed: October 8, 2020
    Publication date: April 14, 2022
    Inventors: Giacomo Domeniconi, Leili Zhang, Guojing Cong, Chih-Chieh Yang, Ruhong Zhou
  • Publication number: 20220113199
    Abstract: The present disclosure provides embodiments of semiconductor devices. In one embodiment, the semiconductor device includes a dielectric layer and a fin-shaped structure disposed over the dielectric layer. The fin-shaped structure includes a first p-type doped region, a second p-type doped region, and a third p-type doped region, and a first n-type doped region, a second n-type doped region, and a third n-type doped region interleaving the first p-type doped region, the second p-type doped region, and the third p-type doped region. The first p-type doped region, the third p-type doped region and the third n-type doped region are electrically coupled to a first potential. The second p-type doped region, the first p-type doped region and the second p-type doped region are electrically coupled to a second potential different from the first potential.
    Type: Application
    Filed: October 13, 2020
    Publication date: April 14, 2022
    Inventors: Zi-Ang Su, Ming-Shuan Li, Shu-Hua Wu, Chih Chieh Yeh, Chih-Hung Wang, Wen-Hsing Hsieh
  • Publication number: 20220102537
    Abstract: The present disclosure provides embodiments of bipolar junction transistor (BJT) structures. A BJT according to the present disclosure includes a first epitaxial feature disposed over a well region, a second epitaxial feature disposed over the well region, a vertical stack of channel members each extending lengthwise between the first epitaxial feature and the second epitaxial feature, a gate structure wrapping around each of the vertical stack of channel members, a first electrode coupled to the well region, an emitter electrode disposed over and coupled to the first epitaxial feature, and a second electrode disposed over and coupled to the second epitaxial feature.
    Type: Application
    Filed: September 30, 2020
    Publication date: March 31, 2022
    Inventors: Zi-Ang Su, Ming-Shuan Li, Chih Chieh Yeh