Abstract: A multi-channel transient voltage suppressor includes a plurality of diode strings, a Zener diode and a diode array. The diode strings respectively have a plurality of input output terminals. The diode array includes a first bypass diode and a second bypass diode. The first bypass diode is coupled between a common bus and a ground terminal, and provides a forward turned-on path from the ground terminal to the common bus. The second bypass diode is coupled to the first bypass diode in parallel, and provides a reverse turned-on path from the common bus to the ground terminal. A current dissipation path is formed between each of the input output terminals and the ground terminal by the diode array.

Abstract: A transient voltage suppressing (TVS) integrated circuit includes an input output pin, a ground pin, a substrate, a first TVS die and a second TVS die. The substrate provides a common bus. The first TVS die is disposed on the substrate, and includes a first input output terminal and a first reference ground terminal. The second TVS die is disposed on the substrate and includes a second input output terminal and a second reference ground terminal. The second reference ground terminal is electrically coupled to the first reference ground terminal through the common bus, and the first input output terminal is coupled to the first input out pin, and the second input output terminal is coupled to a ground pin.

Abstract: Systems and methods are disclosed for transitioning a magnetic keyboard between retracted and extended states using a retractable keyboard hinge structure. An information handling system may include a housing having a first housing portion and a second housing portion rotatably coupled by the retractable keyboard hinge structure. The first housing portion may include a magnetic keyboard, and a sliding plate including a plurality of magnets that may be disposed underneath the magnetic keyboard. The retractable keyboard hinge structure may include a first hinge and a first cam. The first hinge and the first cam, when the first housing portion is rotated in relation to the second housing portion, may cause the sliding plate to move in a first linear direction. In response to the sliding plate moving, the plurality of magnets may cause the magnetic keyboard to move in a second linear direction perpendicular to the first linear direction.

Abstract: A light-emitting device includes a semiconductor stack including a first semiconductor layer, a second semiconductor layer formed on the first semiconductor layer, and an active layer formed therebetween, wherein the first semiconductor layer includes a surrounding exposed region not covered by the active layer, and the surrounding exposed region surrounds the active layer; a conductive layer formed on the second semiconductor layer, including a first conductive region extending toward and contacting the surrounding exposed region of the first semiconductor layer; an electrode layer formed on the first conductive region in the surrounding exposed region; an outside insulating layer covering a portion of the conductive layer and the electrode layer, and including a first opening exposing the other portion of the conductive layer; a bonding layer covering the outside insulating layer and electrically connecting to the other portion of the conductive layer through the first opening; and a conductive substrate, w

Abstract: A power supply module with enhanced heat dissipation effect includes a rack including an opening and an accommodating room connected to the opening, as well as at least one power supply including a fitting section inserted from the opening while positioned within the accommodating room, and a heat dissipation section extending toward the outside of the opening from the opening, in which the power supply is formed in the heat dissipation section with a plurality of heat dissipation holes, in such a way that air is capable of entering the power supply from an output end to form heat convection together with the dissipation holes, so as to form a heat dissipation effect with respect to the power supply.

Abstract: A method for reducing wiggling in a line includes forming a silicon patterning layer over a substrate and depositing a mask layer over the silicon patterning layer. The mask layer is patterned to form one or more openings therein. The mask layer is thinned and the one or more openings are widened, to provide a smaller height-to-width ratio. The pattern of the mask layer is then used to pattern the silicon patterning layer. The silicon patterning layer is used, in turn, to pattern a target layer where a metal line will be formed.

Abstract: The present disclosure provides a method of forming a light-emitting device comprising: providing a growth substrate having a front side and a rear side; forming a sacrificial layer on the front side of the growth substrate; forming a protective structure on the sacrificial layer; forming a light-emitting structure on the protective structure, wherein the light-emitting structure emits a first peak wavelength; providing a carrier; joining the carrier and the light-emitting structure; and transforming the sacrificial layer by irradiating a laser beam from the rear side to separate the growth substrate from the light-emitting structure, wherein the laser beam emits a second peak wavelength, and wherein the protective structure reflects the second peak wavelength away from the light-emitting structure.

Abstract: A liquid composition includes copper particles, an organic acid, and a solvent. The copper particle has a particle size of 0.5 ?m˜30 ?m which falls in a micron scale. The liquid composition performs reaction sintering by redox reactions taken place between the copper particles and an organic acid solution at a low temperature of 150° C. in order to produce a dense copper layer and improve the conventional micron-scale copper particles that requires a protective atmosphere for the high-temperature sintering before achieving the required densification. This liquid composition also prevents an excessive oxidation of the nano copper particles during the low-temperature sintering process and a failure of the dense sintering. Due to the agglomeration of nano copper particles, some areas have to be sintered first, so that the sintered products have a good uniformity of tissue and a low resistance below 0.04 ohm per square (?/?).

Abstract: Methods for patterning in a semiconductor process are described. A dummy layer is formed having a cut therein. A first sacrificial layer is formed over the dummy layer, and at least a portion of the first sacrificial layer is disposed in the cut. A second sacrificial layer is formed over the first sacrificial layer. The second sacrificial layer is patterned to have a first pattern. Using the first pattern of the second sacrificial layer, the first sacrificial layer is patterned to have the first pattern. The second sacrificial layer is removed. Thereafter, a second pattern in the first sacrificial layer is formed comprising altering a dimension of the first pattern of the first sacrificial layer. Using the second pattern of the first sacrificial layer, the dummy layer is patterned. Mask portions are formed along respective sidewalls of the patterned dummy layer. The mask portions are used to form a mask.

Abstract: A trocar set includes a handle portion, a first sleeve, a second sleeve, and a gasbag. The handle portion includes a grip, a connection part, and a first gas valve. The connection part extends from the grip and includes an assembling channel. The first gas valve is connected to the connection part and communicates with the assembling channel. An assembling end of the first sleeve is assembled to the connection portion. A sleeving end of the first sleeve is provided with a first opening. The second sleeve is retractably connected to the sleeving end of the first sleeve. A sleeve wall of the second sleeve is provided with a second opening. The gasbag is connected to an end of the second sleeve away from the sleeving end and corresponds to the second opening. The design of the retractable sleeves is benefit to perform operation.

Abstract: A light-emitting device includes a first semiconductor layer; a plurality of semiconductor pillars separated from each other and formed on the first semiconductor layer, the plurality of semiconductor pillars respectively includes a second semiconductor layer and an active layer; a first electrode covering one portion of the plurality of semiconductor pillars; and a second electrode covering another portion of the plurality of semiconductor pillars, wherein the plurality of semiconductor pillars under a covering region of the first electrode are separated from each other by a first space, the plurality of semiconductor pillars outside the covering region of the first electrode are separated from each other by a second space, and the first space is larger than the second space.

Abstract: An illumination assembly includes a substrate, a wiring structure, a reflecting layer and a plurality of light-emitting diodes. The wiring structure is formed on a part of the substrate, and includes a catalyst layer covering the part of the substrate, and a conducting layer formed on the catalyst layer. The reflecting layer is formed on another part of the substrate that is exposed from the wiring structure. The light-emitting diodes are disposed on the wiring structure and are electrically connected to the wiring structure.

Abstract: The present disclosure provides a method of forming a light-emitting device comprising: providing a growth substrate having a front side and a rear side; forming a sacrificial layer on the front side of the growth substrate; forming a protective structure on the sacrificial layer; forming a light-emitting structure on the protective structure, wherein the light-emitting structure emits a first peak wavelength; providing a carrier; joining the carrier and the light-emitting structure; and transforming the sacrificial layer by irradiating a laser beam from the rear side to separate the growth substrate from the light-emitting structure, wherein the laser beam emits a second peak wavelength, and wherein the protective structure reflects the second peak wavelength away from the light-emitting structure.

Abstract: Among other things, one or more interconnect structures and techniques for forming such interconnect structures within integrated circuits are provided. An interconnect structure comprises one or more kinked structures, such as metal structures or via structures, formed according to a kinked profile. For example, the interconnect structure comprises a first kinked structure having a first tapered portion and a second kinked structure having a second tapered portion. The first tapered portion and the second tapered portion are both situated at an interface between two layers. Current leakage at the interface is mitigated because a length of the interface corresponds to a distance between the first tapered portion and the second tapered portion that is relatively larger than if the first kinked structure and the second kinked structure were merely formed according to a non-tapered shape.

Abstract: In a pattern forming method, a stacked structure, including a bottom layer, a middle layer and a first mask layer, is formed. The middle layer includes a first cap layer, an intermediate layer and a second cap layer. The first mask layer is patterned by using a first resist pattern as an etching mask. The second cap layer is patterned by using the patterned first mask layer as an etching mask. A second mask layer is formed over the patterned second cap layer, and is patterned by using a second resist pattern as an etching mask. The second cap layer is patterned by using the patterned second mask layer as an etching mask. The intermediate layer and the first cap layer are patterned by using the patterned second cap layer as an etching mask. The bottom layer is patterned by using the patterned first cap layer as an etching mask.

Abstract: A light-emitting device includes a semiconductor stack including a first semiconductor layer, a second semiconductor layer and an active layer formed therebetween; a surrounding exposed region formed on peripheries of the semiconductor stack, exposing a surface of the first semiconductor layer; a conductive layer formed on the second semiconductor layer, including a first conductive region extending toward and contacting the surface of the first semiconductor layer in the surrounding exposed region; an electrode layer formed on the surrounding exposed region, surrounding the semiconductor stack, contacting the conductive layer and including an electrode pad not overlapping the semiconductor stack; an outside insulating layer covering a portion of the conductive layer and the electrode layer, including a first opening exposing the other portion of the conductive layer; a bonding layer covering the outside insulating layer and electrically connecting to the other portion of the conductive layer through the firs

Abstract: A method of tracking multiple objects implements 2D tracking operations on at least a first target object and a second target object residing in a preset area, and determines whether the first target object or the second target object is covered or obscured. If the first target object or the second target object is covered, 3D tracking operations are implemented on the first target object and the second target object, until the covered state no longer exists, to reduce workload of computer processing.

Abstract: Systems and methods for a keyboard backlight module are described. In some embodiments, a keyboard backlight module may include: a Light Guide Plate (LGP), a reflector coupled to the LGP, and a light bar at least partially sandwiched between the LGP and the reflector.

Abstract: A vehicle includes a main frame, a power unit, a power controlling unit, and a battery receiving module. The power unit, a power controlling unit, and a battery receiving module are disposed on the main frame respectively. The battery receiving module is disposed between the power unit and the power controlling unit along a front-rear direction of the vehicle.

Abstract: An embodiment method includes defining a first mandrel and a second mandrel over a hard mask layer. The method also includes depositing a spacer layer over and along sidewalls of the first mandrel and the second mandrel, and forming a sacrificial material over the spacer layer between the first mandrel and the second mandrel. The sacrificial material includes an inorganic oxide. The method further includes removing first horizontal portions of the spacer layer to expose the first mandrel and the second mandrel. Remaining portions of the spacer layer provide spacers on sidewalls of the first mandrel and the second mandrel. The method further includes removing the first mandrel and the second mandrel and patterning the hard mask layer using the spacers and the sacrificial material as an etch mask.