Patents by Inventor Chih-Hao Lin

Chih-Hao Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190015241
    Abstract: An ostomy pouching device for the removal of biological waste from a patient. An embodiment of an ostomy pouching device includes an outer container housing an inner bag for receiving waste from a patient's bowel. The device includes a bowel connector to connect the bowel to the inner bag. The outer container includes an air exit aperture through which air may exit the container as it is displaced as the inner bag expands, and a gas tunnel for removing gas from the inner bag.
    Type: Application
    Filed: July 17, 2018
    Publication date: January 17, 2019
    Inventors: Chih-Hao Lin, Wan-Chen Shen, Wei-Ting Shih
  • Patent number: 10141476
    Abstract: A light emitting diode chip scale packaging structure is disclosed. The light emitting diode chip scale packaging structure comprises a light emitting diode chip and a lens. The lens covers the light emitting diode chip. A curve of an outer surface of the lens in a cross-section view substantially complies with a polynomial of: z=?i=0nai*yi, A center point of the curve corresponding to the light emitting diode chip is a zero point of y-z coordinate axes. z is a variable of vertical axis of the curve. y is a variable of horizontal axis of the curve. ai is a constant coefficient in a term of ith degree. 3<n?6.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: November 27, 2018
    Assignee: LEXTAR ELECTRONICS CORPORATION
    Inventors: Che-Hsuan Huang, Shu-Hsiu Chang, Hsin-Lun Su, Chih-Hao Lin, Tzong-Liang Tsai
  • Patent number: 10126852
    Abstract: A display device of the present invention includes a light source layer and a sensing unit layer. The light source layer has a display side and a sensing side at the backside of the display side. The light source layer includes a plurality of first light sources generating a first light, and a plurality of second light sources generating a second light. The first light at least partially emits toward the sensing side; the second light at least partially emits toward the display side. A second wavelength of the second light is different from a first wavelength of the first light. The sensing unit layer is disposed at the sensing side of the light source layer. In a sensing mode, the plurality of the first light sources is activated to generate and provide the first light for the sensing unit layer. In a displaying mode, the plurality of the second light sources is activated to generate the second light for displaying an image at the display side.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: November 13, 2018
    Assignee: AU OPTRONICS CORPORATION
    Inventors: Chih-Hao Lin, An-Thung Cho, Pin-Miao Liu, Tsung-Tien Wu
  • Publication number: 20180317816
    Abstract: A blood vessel scanning system and method are provided, which are adapted for user identification. The blood vessel scanning system is implemented for a head-mounted image viewing device. The blood vessel scanning method comprises the following steps: determining whether a user is authorized or not according to the blood vessel scanning image of the user; if the user is an authorized user, the blood vessel scanning system adjusts lens degree of the head-mounted image viewing device according to the pre-stored visual information of the user.
    Type: Application
    Filed: April 16, 2018
    Publication date: November 8, 2018
    Inventors: Chih-Hao LIN, Jhen-Yu You, Yi-Huan Liao, Chun Chang
  • Patent number: 10099331
    Abstract: A punching system adapted to punch a sheet metal includes a platform, a punching portion, a base portion and a turret device. The punching portion is disposed on the platform, and a first upper die is detachably installed in the punching portion. The base portion is disposed between the punching portion and the platform, and a first lower die is detachably installed in the base portion. The punching portion is adapted to move back and forth along a first direction relative to the platform. The turret device is adapted to move along a second direction relative to the platform, and the first direction is perpendicular to the second direction. A plurality of second upper dies and second lower dies are correspondingly installed on the turret device.
    Type: Grant
    Filed: November 23, 2016
    Date of Patent: October 16, 2018
    Assignee: Metal Industries Research & Development Centre
    Inventors: Pin-Jyun Chen, Hsin-Wei Chu, Chih-Hao Lin, Yu-Ting Lin
  • Publication number: 20180141177
    Abstract: A punching system adapted to punch a sheet metal includes a platform, a punching portion, a base portion and a turret device. The punching portion is disposed on the platform, and a first upper die is detachably installed in the punching portion. The base portion is disposed between the punching portion and the platform, and a first lower die is detachably installed in the base portion. The punching portion is adapted to move back and forth along a first direction relative to the platform. The turret device is adapted to move along a second direction relative to the platform, and the first direction is perpendicular to the second direction. A plurality of second upper dies and second lower dies are correspondingly installed on the turret device.
    Type: Application
    Filed: November 23, 2016
    Publication date: May 24, 2018
    Applicant: Metal Industries Research & Development Centre
    Inventors: Pin-Jyun Chen, Hsin-Wei Chu, Chih-Hao Lin, Yu-Ting Lin
  • Patent number: 9966413
    Abstract: A light-emitting diode (LED) module and a lamp using the same are provided. The LED module includes a substrate and several light-emitting packages. Each light-emitting package includes an optical wavelength conversion layer and a light-emitting diode having a first light-output surface, a bonding surface, and several second light-output surfaces. The bonding surface is opposite the first light-output surface and connected to the substrate. The second light-output surfaces are between the first light-output surface and the bonding surface. The optical wavelength conversion layer covers the first and second light-output surfaces. The distance between the bonding surface and the top surface of the optical wavelength conversion layer represents a light source thickness. The distance between two adjacent light-emitting packages represents a spacing of light sources. Specifically, the ratio of the spacing of light sources to the light source thickness is between 1 and 6.3.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: May 8, 2018
    Assignee: Lextar Electronics Corporation
    Inventors: Fang-Chang Hsueh, Yu-Min Lin, Chih-Hao Lin, Tzong-Liang Tsai
  • Publication number: 20180122809
    Abstract: A manufacturing method of a dynamic random access memory (DRAM) structure includes following steps. A substrate is provided, wherein the substrate includes a memory cell region and a peripheral circuit region. A DRAM is formed in the memory cell region and includes a capacitor contact coupled to a capacitor structure. A transistor structure with a metal gate structure is formed in the peripheral circuit region. The metal gate structure is formed by a manufacturing process using a dummy gate. The capacitor contact and the dummy gate are formed by the same conductive layer.
    Type: Application
    Filed: May 8, 2017
    Publication date: May 3, 2018
    Applicant: Winbond Electronics Corp.
    Inventor: Chih-Hao Lin
  • Publication number: 20180106994
    Abstract: A light-enhancement device includes a wavelength conversion member and a wavelength controlling element. The wavelength conversion member includes a light-transmissive substrate and wavelength conversion material which is disposed within the light-transmissive substrate for converting a portion of light with a first wavelength into another light with a second wavelength. The wavelength controlling element is disposed on a surface of the light-transmissive substrate for reflecting another portion of the light with the first wavelength into the light-transmissive substrate and enabling the portion of the light with the second wavelength to pass through the wavelength controlling element. A roughness of the surface of the light-transmissive substrate facing towards the wavelength controlling element is configured to be 0-1 ?m.
    Type: Application
    Filed: October 10, 2017
    Publication date: April 19, 2018
    Inventors: Chih-Hao LIN, Hui-Ru WU, Jo-Hsiang CHEN, Tzong-Liang TSAI
  • Publication number: 20180102459
    Abstract: A light emitting diode chip scale packaging structure and a direct type backlight module are disclosed. The light emitting diode chip scale packaging structure includes a light emitting diode chip, a wavelength converting layer, a diffusion structure and a lens. The wavelength converting layer is disposed on the light emitting diode chip and directly contacting the light emitting diode chip, and the wavelength converting layer includes phosphor powders. The diffusion structure covers the light emitting diode chip and the wavelength converting layer, a ratio of a height of the diffusion structure to a width of the diffusion structure is 1:2 to 5:4, and the lens covers the diffusion structure. An outer surface of the lens is a free-form surface, and a material of the lens is different from a material of the diffusion structure.
    Type: Application
    Filed: October 2, 2017
    Publication date: April 12, 2018
    Inventors: Che-Hsuan Huang, Hsin-Lun Su, Shu-Hsiu Chang, Chih-Hao Lin, Tzong-Liang Tsai
  • Patent number: 9907160
    Abstract: A design for printed circuit board with reduced susceptibility to common-mode noise includes a first substrate, a differential pair of signal lines with two differential transmission lines laid on the first substrate, a second substrate, a metal layer located between the first substrate and the second substrate, and a grounding layer The second substrate is located between the second substrate and the grounding layer, and a conductive structure is located in the second substrate and couples the metal layer to the grounding layer. A length of the metal layer is substantially equal to a length of each of the two differential transmission lines.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: February 27, 2018
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Chih-Hao Lin
  • Patent number: 9899454
    Abstract: The invention provides a manufacturing method of a pixel structure of an organic light-emitting diode display panel. First transparent anodes located in first pixel regions and fifth pixel regions, second transparent anodes located in second pixel regions and sixth pixel regions, and third transparent anodes located in third pixel regions and fourth pixel regions are formed on a substrate. A first organic light-emitting layer is formed inside the third pixel regions and the fourth pixel regions via a first fine metal mask. A second organic light-emitting layer is formed inside the fifth pixel regions, the sixth pixel regions, the first pixel regions, and the second pixel regions via a second fine metal mask. First cathodes, second cathodes, and third cathodes are formed on the substrate.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: February 20, 2018
    Assignee: Chunghwa Picture Tubes, Ltd.
    Inventors: Yi-Chun Sun, Chih-Hao Lin
  • Patent number: 9887200
    Abstract: A dynamic random access memory (DRAM) includes a substrate, isolation structures, buried word lines, bit lines, and capacitors. The substrate includes active areas configured into strips and arranged as an array. The isolation structures are disposed in trenches of the substrate. Each isolation structure is disposed between two adjacent active areas. The buried word lines are disposed in parallel in a first direction in the trenches. Each buried word line divides each active area arranged in the same column into a first contact region and a second contact region. The bit lines are disposed in parallel in a second direction on the substrate and across the buried word lines. A longitudinal direction of the active areas is non-orthogonal to the second direction. Each bit line is electrically connected with the first contact regions in the same row. The capacitors are electrically connected with the corresponding second contact regions respectively.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: February 6, 2018
    Assignee: Winbond Electronics Corp.
    Inventor: Chih-Hao Lin
  • Publication number: 20170358709
    Abstract: A light emitting diode chip scale packaging structure is disclosed. The light emitting diode chip scale packaging structure comprises a light emitting diode chip and a lens. The lens covers the light emitting diode chip. A curve of an outer surface of the lens in a cross-section view substantially complies with a polynomial of: z=?i=0nai*yi, A center point of the curve corresponding to the light emitting diode chip is a zero point of y-z coordinate axes. z is a variable of vertical axis of the curve. y is a variable of horizontal axis of the curve. ai is a constant coefficient in a term of ith degree. 3<n?6.
    Type: Application
    Filed: June 9, 2017
    Publication date: December 14, 2017
    Inventors: Che-Hsuan Huang, Shu-Hsiu Chang, Hsin-Lun Su, Chih-Hao Lin, Tzong-Liang Tsai
  • Patent number: 9812432
    Abstract: An LED chip package includes a substrate having a metal terminal (gold finger structure). A LED chip set is composed of a plurality of LED chips formed in one piece, and has a plurality of light-emitting areas which are separated from each other. The LED chip set is disposed on the substrate and electrically connected to the metal terminal.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: November 7, 2017
    Assignee: Lextar Electronics Corporation
    Inventors: Yi-Jyun Chen, Chih-Hao Lin
  • Publication number: 20170317147
    Abstract: The invention provides a manufacturing method of a pixel structure of an organic light-emitting diode display panel. First transparent anodes located in first pixel regions and fifth pixel regions, second transparent anodes located in second pixel regions and sixth pixel regions, and third transparent anodes located in third pixel regions and fourth pixel regions are formed on a substrate. A first organic light-emitting layer is formed inside the third pixel regions and the fourth pixel regions via a first fine metal mask. A second organic light-emitting layer is formed inside the fifth pixel regions, the sixth pixel regions, the first pixel regions, and the second pixel regions via a second fine metal mask. First cathodes, second cathodes, and third cathodes are formed on the substrate.
    Type: Application
    Filed: May 26, 2016
    Publication date: November 2, 2017
    Inventors: Yi-Chun Sun, Chih-Hao Lin
  • Publication number: 20170318666
    Abstract: A design for printed circuit board with reduced susceptibility to common-mode noise includes a first substrate, a differential pair of signal lines with two differential transmission lines laid on the first substrate, a second substrate, a metal layer located between the first substrate and the second substrate, and a grounding layer The second substrate is located between the second substrate and the grounding layer, and a conductive structure is located in the second substrate and couples the metal layer to the grounding layer. A length of the metal layer is substantially equal to a length of each of the two differential transmission lines.
    Type: Application
    Filed: May 17, 2016
    Publication date: November 2, 2017
    Inventor: CHIH-HAO LIN
  • Patent number: 9773958
    Abstract: An optical solid state prepolymer is provided, which includes a product formed by reacting 100 parts by weight of (a) epoxy resin and 0.1 to 30 parts by weight of (b) oligomeric silsesquioxane. The (a) epoxy resin includes (a1) linear siloxane epoxy resin and (a2) cyclic siloxane epoxy resin with a weight ratio of 1:1 to 5:1.
    Type: Grant
    Filed: February 4, 2016
    Date of Patent: September 26, 2017
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ying-Nan Chan, Shu-Chen Huang, Chih-Hao Lin, Wen-Bin Chen, Kai-Chi Chen
  • Patent number: 9732940
    Abstract: A lighting apparatus includes a wavelength converting apparatus. The wavelength converting apparatus includes a hollow tube and a wavelength converting material. The hollow tube has an accommodating chamber. The wavelength converting material is positioned in the accommodating chamber.
    Type: Grant
    Filed: July 22, 2014
    Date of Patent: August 15, 2017
    Assignee: LEXTAR ELECTRONICS CORPORATION
    Inventors: Kuang-Neng Yang, Kun-Hua Wu, Jo-Hsiang Chen, Tai-Hua Ho, Tzong-Liang Tsai, Chih-Hao Lin
  • Publication number: 20170199604
    Abstract: A display device of the present invention includes a light source layer and a sensing unit layer. The light source layer has a display side and a sensing side at the backside of the display side. The light source layer includes a plurality of first light sources generating a first light, and a plurality of second light sources generating a second light. The first light at least partially emits toward the sensing side; the second light at least partially emits toward the display side. A second wavelength of the second light is different from a first wavelength of the first light. The sensing unit layer is disposed at the sensing side of the light source layer. In a sensing mode, the plurality of the first light sources is activated to generate and provide the first light for the sensing unit layer. In a displaying mode, the plurality of the second light sources is activated to generate the second light for displaying an image at the display side.
    Type: Application
    Filed: August 31, 2016
    Publication date: July 13, 2017
    Inventors: Chih-Hao LIN, An-Thung CHO, Pin-Miao LIU, Tsung-Tien WU