Patents by Inventor Chih-Hao Lin

Chih-Hao Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170179349
    Abstract: An optical solid state prepolymer is provided, which includes a product formed by reacting 100 parts by weight of (a) epoxy resin and 0.1 to 30 parts by weight of (b) oligomeric silsesquioxane. The (a) epoxy resin includes (a1) linear siloxane epoxy resin and (a2) cyclic siloxane epoxy resin with a weight ratio of 1:1 to 5:1.
    Type: Application
    Filed: February 4, 2016
    Publication date: June 22, 2017
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ying-Nan CHAN, Shu-Chen HUANG, Chih-Hao LIN, Wen-Bin CHEN, Kai-Chi CHEN
  • Patent number: 9666556
    Abstract: An integrated circuit (IC) package includes a first substrate; a second substrate disposed over the first substrate; a plurality of connectors disposed between the first and second substrates such to electrically couple the first and second substrate; a constraint layer disposed over the first and second substrates such that a cavity is formed between the constraint layer and the first substrate; and a molding material disposed within the cavity and extending through the constraint layer. The constraint layer has a top surface and an opposing bottom surface and the molding material extends from the top surface to the bottom surface of the constraint layer.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: May 30, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Chih Liu, Chien-Kuo Chang, Chi-Yang Yu, Jing Ruei Lu, Chih-Hao Lin
  • Patent number: 9660747
    Abstract: A media signal broadcasting method, a media signal broadcasting system, a host device and a peripheral device are provided. The media signal broadcasting method is provided. The media signal broadcasting method includes the following steps. A host device and a peripheral device are provided. A first radio signal is received by the peripheral device. The first radio signal is converted to be a second radio signal by the peripheral device. The second radio signal is transmitted to the host device by the peripheral device. The second radio signal is received and is converted to be a media signal by the host device. A third radio signal is received and converted to be the media signal by the host device. The media signal converted from the third radio signal or the second radio signal is played by the host device.
    Type: Grant
    Filed: August 29, 2013
    Date of Patent: May 23, 2017
    Assignee: HTC CORPORATION
    Inventors: Chih-Hao Lin, Fu-An Chu, Chien-Yen Li
  • Patent number: 9659914
    Abstract: A light-emitting diode chip package is provided. The light-emitting diode chip package includes a substrate; a light-emitting diode chip set (LED chip set) disposed over the substrate, wherein the LED chip set is formed by a plurality of light-emitting diode chips (LED chips) in one piece; and at least two electrodes disposed over the substrate and electrically connected to the LED chip set.
    Type: Grant
    Filed: August 5, 2015
    Date of Patent: May 23, 2017
    Assignee: Lextar Electronics Corporation
    Inventors: Yi-Jyun Chen, Chih-Hao Lin, Hsin-Lun Su, Fang-Chang Hsueh
  • Publication number: 20170129729
    Abstract: The present invention provides a synchronous servo feeding system for punching machine and the method for operating the same. According to the present invention, a servo feeding device is provided on one side of a punching machine for guiding a material strip into the punching machine for processing. In addition, a servo pulling device is provided on the other side of the punching machine for conveying a finished strip from the punching machine. Besides, a central servo control system is provided for controlling the servo feeding device and the servo pulling device. Thereby, the material strip can be fed and pulled synchronously.
    Type: Application
    Filed: December 22, 2015
    Publication date: May 11, 2017
    Inventors: Pin-Jyun Chen, Hsin-Wei Chu, Chih-Hao Lin, Yu-Ting Lin
  • Publication number: 20170125423
    Abstract: A dynamic random access memory (DRAM) includes a substrate, isolation structures, buried word lines, bit lines, and capacitors. The substrate includes active areas configured into strips and arranged as an array. The isolation structures are disposed in trenches of the substrate. Each isolation structure is disposed between two adjacent active areas. The buried word lines are disposed in parallel in a first direction in the trenches. Each buried word line divides each active area arranged in the same column into a first contact region and a second contact region. The bit lines are disposed in parallel in a second direction on the substrate and across the buried word lines. A longitudinal direction of the active areas is non-orthogonal to the second direction. Each bit line is electrically connected with the first contact regions in the same row. The capacitors are electrically connected with the corresponding second contact regions respectively.
    Type: Application
    Filed: August 26, 2016
    Publication date: May 4, 2017
    Applicant: Winbond Electronics Corp.
    Inventor: Chih-Hao Lin
  • Publication number: 20170124373
    Abstract: A photo-sensing unit including a first electrode, a first insulation layer, a photo-sensing structure and a second electrode is provided. The first insulation layer covers the first electrode and has an opening exposing the first electrode. The photo-sensing structure is located on the first electrode and disposed in the opening of the first insulation layer. The photo-sensing structure includes a first photo-sensing layer and a second photo-sensing layer stacked with each other. A material of the first photo-sensing layer is SixGeyOz. A material of the second photo-sensing layer is SivOw. The second electrode covers the photo-sensing structure. A photo-sensing apparatus including the photo-sensing unit and a fabricating method of a photo-sensing unit are also provided.
    Type: Application
    Filed: August 8, 2016
    Publication date: May 4, 2017
    Inventors: Yi-Huan LIAO, Chih-Hao LIN, Jhen-Yu YOU, Jhen-Fu CHO, Chun CHANG, An-Thung CHO
  • Patent number: 9617411
    Abstract: An organic-inorganic hybrid resin, a molding composition, and a photoelectric device employing the same are disclosed. The organic-inorganic hybrid resin is a reaction product of a composition, wherein the composition includes: 0.1-10 parts by weight of reactant (a), and 100 parts by weight of reactant (b). In particular, the reactant (a) is a silsesquioxane prepolymer with metal oxide clusters, and the metal oxide cluster includes Ti, Zr, Zn, or a combination thereof. The reactant (b) includes an epoxy resin.
    Type: Grant
    Filed: January 14, 2015
    Date of Patent: April 11, 2017
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ying-Nan Chan, Shu-Chen Huang, Wen-Bin Chen, Kai-Chi Chen, Chih-Hao Lin, Hsun-Tien Li
  • Publication number: 20170084586
    Abstract: An LED chip package includes a substrate having a metal terminal (gold finger structure). A LED chip set is composed of a plurality of LED chips formed in one piece, and has a plurality of light-emitting areas which are separated from each other. The LED chip set is disposed on the substrate and electrically connected to the metal terminal.
    Type: Application
    Filed: May 23, 2016
    Publication date: March 23, 2017
    Inventors: Yi-Jyun CHEN, Chih-Hao LIN
  • Publication number: 20170069809
    Abstract: A light-emitting diode package is provided. The light-emitting diode package includes a lead-frame, a reflective cup and a die. The lead-frame is made of a silver-free material. The reflective cup has the cavity. The die is disposed on the lead-frame in a face-down orientation, and is further electrically connected to the lead-frame and located within the cavity.
    Type: Application
    Filed: August 3, 2016
    Publication date: March 9, 2017
    Inventors: Jo-Shung Chen, Chih-Hao Lin, Tzong-Liang Tsai
  • Publication number: 20170062334
    Abstract: The present disclosure relates to a semiconductor device. A fuse layer is arranged within a first dielectric layer. A bond pad is arranged on the first dielectric layer. A second dielectric layer is arranged along sidewall and upper surfaces of the bond pad. A passivation layer is arranged over the first and second dielectric layers, and the passivation layer having a bond pad opening overlying the bond pad and a fuse opening overlying the fuse layer. The bond pad has a bottom surface that is co-planar with a bottom surface of the passivation layer.
    Type: Application
    Filed: November 14, 2016
    Publication date: March 2, 2017
    Inventors: Tai-I Yang, Chun-Yi Yang, Chih-Hao Lin, Hong-Seng Shue, Ruei-Hung Jang
  • Patent number: 9540488
    Abstract: A siloxane resin and photoelectric device employing the same are provided. The siloxane resin composition includes (a) 45-87 parts by weight of a first siloxane compound represented by Formula (I), wherein each R1 is independently C1-3 alkyl group, and n is an integer from 2 to 15; (b) 5-35 parts by weight of a second siloxane compound represented by Formula (II), wherein each R2 and R3 are independently C1-3 alkyl group; each R4 is independently C1-3 alkyl group, or epoxy group; x?1, y?2, and x/y is from about 0.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: January 10, 2017
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chih-Hao Lin, Wen-Bin Chen, Ying-Nan Chan, Shu-Chen Huang, Kai-Chi Chen
  • Publication number: 20160379955
    Abstract: An integrated circuit (IC) package includes a first substrate; a second substrate disposed over the first substrate; a plurality of connectors disposed between the first and second substrates such to electrically couple the first and second substrate; a constraint layer disposed over the first and second substrates such that a cavity is formed between the constraint layer and the first substrate; and a molding material disposed within the cavity and extending through the constraint layer. The constraint layer has a top surface and an opposing bottom surface and the molding material extends from the top surface to the bottom surface of the constraint layer.
    Type: Application
    Filed: June 29, 2015
    Publication date: December 29, 2016
    Inventors: Yu-Chih Liu, Chien-Kuo Chang, Chi-Yang Yu, Jing Ruei Lu, Chih-Hao Lin
  • Publication number: 20160365493
    Abstract: A light-emitting diode device includes a shell with a recess, wherein the shell does not contain metal oxide. A plurality of lead frames extends from the bottom of the recess to the outside of the shell. At least an UV light-emitting diode (LED) chip is disposed on the bottom of the recess and is electrically connected to the lead frames, wherein the UV LED chip has a wavelength range of 200 nm-400 nm. In addition, an encapsulation adhesive fills the recess to cover the UV LED chip.
    Type: Application
    Filed: February 25, 2016
    Publication date: December 15, 2016
    Inventors: Hsin-Lun SU, Chih-Hao LIN, Fang-Chang HSUEH, Tzong-Liang TSAI, Yi-Jyun CHEN
  • Patent number: 9509197
    Abstract: The manufacturing apparatus for a stator core has a servo pressing device, a mold, a punch assembly, a first cylinder, a second cylinder and a third cylinder. The mold is mounted on the servo pressing device and has an upper seat and a lower seat. The punch assembly is mounted in the upper seat. The first cylinder, the second cylinder and the third cylinder are mounted on the mold. The stator laminations are respectively punched by the punch assembly of the manufacturing apparatus, and are automatically stacked in the mold. The groups of stator laminations stacked in the recess are respectively pushed by the second cylinder and respectively pressed by the third cylinder. The stator laminations are automatically stacked and pressed in the mold without manpower. Therefore, the manufacturing apparatus of stator core can save manpower and reduce the equipment cost.
    Type: Grant
    Filed: November 28, 2014
    Date of Patent: November 29, 2016
    Assignee: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
    Inventors: Chih-Hao Lin, Pin-Jyun Chen, Yu-Ting Lin, Ho-Chung Fu
  • Patent number: 9496221
    Abstract: The present disclosure relates to a method of fabricating a semiconductor device. A semiconductor device includes a bond pad and a fuse layer. The bond pad includes a coating on an upper surface. A dielectric layer is formed over the bond pad and the fuse layer. A passivation layer is formed over the dielectric layer. An etch is performed to form a bond pad opening and a fuse opening. The etch is performed using only a single mask. The fuse opening defines a fuse window. The upper surface of the bond pad is exposed by substantially removing the coating from the entire upper surface.
    Type: Grant
    Filed: June 25, 2012
    Date of Patent: November 15, 2016
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tai-I Yang, Marcus Yang, Chih-Hao Lin, Hong-Seng Shue, Ruei-Hung Jang
  • Publication number: 20160322420
    Abstract: A light-emitting diode (LED) module and a lamp using the same are provided. The LED module includes a substrate and several light-emitting packages. Each light-emitting package includes an optical wavelength conversion layer and a light-emitting diode having a first light-output surface, a bonding surface, and several second light-output surfaces. The bonding surface is opposite the first light-output surface and connected to the substrate. The second light-output surfaces are between the first light-output surface and the bonding surface. The optical wavelength conversion layer covers the first and second light-output surfaces. The distance between the bonding surface and the top surface of the optical wavelength conversion layer represents a light source thickness. The distance between two adjacent light-emitting packages represents a spacing of light sources. Specifically, the ratio of the spacing of light sources to the light source thickness is between 1 and 6.3.
    Type: Application
    Filed: April 1, 2016
    Publication date: November 3, 2016
    Inventors: Fang-Chang Hsueh, Yu-Min Lin, Chih-Hao Lin, Tzong-Liang Tsai
  • Publication number: 20160300821
    Abstract: A light-emitting diode chip package is provided. The light-emitting diode chip package includes a substrate; a light-emitting diode chip set (LED chip set) disposed over the substrate, wherein the LED chip set is formed by a plurality of light-emitting diode chips (LED chips) in one piece; and at least two electrodes disposed over the substrate and electrically connected to the LED chip set.
    Type: Application
    Filed: June 17, 2016
    Publication date: October 13, 2016
    Inventors: Yi-Jyun Chen, Chih-Hao Lin, Hsin-Lun Su, Fang-Chang Hsueh
  • Publication number: 20160247787
    Abstract: A light-emitting diode chip package is provided. The light-emitting diode chip package includes a substrate; a light-emitting diode chip set (LED chip set) disposed over the substrate, wherein the LED chip set is formed by a plurality of light-emitting diode chips (LED chips) in one piece; and at least two electrodes disposed over the substrate and electrically connected to the LED chip set.
    Type: Application
    Filed: August 5, 2015
    Publication date: August 25, 2016
    Inventors: Yi-Jyun Chen, Chih-Hao Lin, Hsin-Lun Su, Fang-Chang Hsueh
  • Publication number: 20160118870
    Abstract: The manufacturing apparatus for a stator core has a servo pressing device, a mold, a punch assembly, a first cylinder, a second cylinder and a third cylinder. The mold is mounted on the servo pressing device and has an upper seat and a lower seat. The punch assembly is mounted in the upper seat. The first cylinder, the second cylinder and the third cylinder are mounted on the mold. The stator laminations are respectively punched by the punch assembly of the manufacturing apparatus, and are automatically stacked in the mold. The groups of stator laminations stacked in the recess are respectively pushed by the second cylinder and respectively pressed by the third cylinder. The stator laminations are automatically stacked and pressed in the mold without manpower. Therefore, the manufacturing apparatus of stator core can save manpower and reduce the equipment cost.
    Type: Application
    Filed: November 28, 2014
    Publication date: April 28, 2016
    Inventors: Chih-Hao LIN, Pin-Jyun CHEN, Yu-Ting LIN, Ho-Chung FU