Abstract: Semiconductor device and the manufacturing method thereof are disclosed. An exemplary semiconductor device comprises a dielectric layer formed over a conductive feature; a semiconductor stack formed over the dielectric layer, wherein the semiconductor stack including semiconductor layers stacked up and separated from each other; a first metal gate structure and a second metal gate structure formed over a channel region of the semiconductor stack, wherein the first metal gate structure and the second metal gate structure wrap each of the semiconductor layers of the semiconductor stack; and a first epitaxial feature disposed between the first metal gate structure and the second metal gate structure over a first source/drain region of the semiconductor stack, wherein the first epitaxial feature extends through the dielectric layer and contacts the conductive feature.

Abstract: Semiconductor devices and methods of forming the same are provided. In one embodiment, a semiconductor device includes an active region including a channel region and a source/drain region and extending along a first direction, and a source/drain contact structure over the source/drain region. The source/drain contact structure includes a base portion extending lengthwise along a second direction perpendicular to the first direction, and a via portion over the base portion. The via portion tapers away from the base portion.

Abstract: A structure has stacks of semiconductor layers over a substrate and adjacent a dielectric feature. A gate dielectric is formed wrapping around each layer and the dielectric feature. A first layer of first gate electrode material is deposited over the gate dielectric and the dielectric feature. The first layer on the dielectric feature is recessed to a first height below a top surface of the dielectric feature. A second layer of the first gate electrode material is deposited over the first layer. The first gate electrode material in a first region of the substrate is removed to expose a portion of the gate dielectric in the first region, while the first gate electrode material in a second region of the substrate is preserved. A second gate electrode material is deposited over the exposed portion of the gate dielectric and over a remaining portion of the first gate electrode material.

Abstract: A method includes forming a plurality of fin structures extending along a first direction. The method includes forming a dummy fin structure disposed between two adjacent fin structures. The dummy fin structure also extends along the first direction and includes a deformable layer. The method includes recessing portions of each fin structure. The method includes forming source/drain structures over the recessed fin structures. The method includes deforming the deformable layer of the dummy fin structure to apply either a tensile stress or a compressive stress on the source/drain structures coupled to each of the two adjacent fin structures.

Abstract: A semiconductor device includes nanostructures extending in a first direction above a substrate and spaced apart in a second direction perpendicular to the first direction, a gate dielectric layer wrapping around each of the nanostructures, a first p-type work function metal layer between the adjacent nanostructures, a second p-type work function metal layer in contact with opposite sidewalls of the first p-type work function metal layer and opposite sidewalls of the gate dielectric layer, and an n-type work function metal layer covering the second p-type work function metal layer. The second p-type work function metal layer comprises a main layer and a cap layer over the main layer, wherein the cap layer has a material different from a material of the main layer.

Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure includes a semiconductor substrate having a first region and a second region; a first fin active region of a first semiconductor material disposed within the first region, oriented in a first direction, wherein the first fin active region has a <100> crystalline direction along the first direction; and a second fin active region of a second semiconductor material disposed within the second region and oriented in the first direction, wherein the second fin active region has a <110> crystalline direction along the first direction.

Abstract: Semiconductor structures and methods of forming the same are provided. A semiconductor structure according to one embodiment includes first nanostructures, a first gate structure wrapping around each of the first nanostructures and disposed over an isolation structure, and a backside gate contact disposed below the first nanostructures and adjacent to the isolation structure. A bottom surface of the first gate structure is in direct contact with the backside gate contact.

Abstract: An integrated circuit includes a transistor having a plurality of semiconductor nanostructures arranged in a stack and corresponding to channel regions of the transistor. The transistor includes a source/drain region in contact with the channel regions. The transistor includes a silicide that extends downward along a side of the source/drain region.

Abstract: Methods and devices that include a multigate device having a channel layer disposed between a source feature and a drain feature, a metal gate that surrounds the channel layer, and a first air gap spacer interposing the metal gate and the source feature and a second air gap spacer interposing the metal gate and the drain feature. A backside contact extends to the source feature. A power line metallization layer is connected to the backside contact.

Abstract: The present disclosure provides a method of forming a semiconductor device including an nFET structure and a pFET structure where each of the nFET and pFET structures include a semiconductor substrate and a gate trench. The method includes depositing an interfacial layer in each gate trench, depositing a first ferroelectric layer over the interfacial layer, removing the first ferroelectric layer from the nFET structure, depositing a metal oxide layer in each gate trench, depositing a second ferroelectric layer over the metal oxide layer, removing the second ferroelectric layer from the pFET structure, and depositing a gate electrode in each gate trench.

Abstract: An integrated circuit includes a first nanosheet transistor and a second nanosheet transistor on a substrate. The first and second nanosheet each include gate electrodes. A gate isolation structure extends from a backside of the substrate between the gate electrodes. The gate isolation structure physically and electrically isolates the first and second gate electrodes from each other.

Abstract: A semiconductor structure includes a source/drain (S/D) feature; one or more channel semiconductor layers connected to the S/D feature; a gate structure engaging the one or more channel semiconductor layers; a first silicide feature at a frontside of the S/D feature; a second silicide feature at a backside of the S/D feature; and a dielectric liner layer at the backside of the S/D feature, below the second silicide feature, and spaced away from the second silicide feature by a first gap. A backside power rail is included.

Abstract: A semiconductor structure and the manufacturing method thereof are disclosed. An exemplary method includes receiving a workpiece including a dielectric layer and a contact via extending through the dielectric layer, selectively forming a metal feature on a top surface of the contact via, forming a barrier layer over the metal feature and the dielectric layer, wherein the contact via is spaced apart from the barrier layer, and, forming a metal fill layer over the barrier layer. The metal feature is formed of a first material and the barrier layer is formed of a second material different from the first material.

Abstract: A method includes providing a structure having source/drain electrodes and a first dielectric layer over the source/drain electrodes; forming a first etch mask covering a first area of the first dielectric layer; performing a first etching process to the first dielectric layer, resulting in first trenches over the source/drain electrodes; filling the first trenches with a second dielectric layer that has a different material than the first dielectric layer; removing the first etch mask; performing a second etching process including isotropic etching to the first area of the first dielectric layer, resulting in a second trench above a first one of the source/drain electrodes; depositing a metal layer into at least the second trench; and performing a chemical mechanical planarization (CMP) process to the metal layer.

Abstract: A semiconductor device structure and a formation method are provided. The method includes forming a first fin structure and a second fin structure over a substrate. The method also includes forming a first metal gate stack wrapped around and extending across the first fin structure and the second fin structure. The method further includes forming a second metal gate stack wrapped around and extending across the first fin structure and the second fin structure. In addition, the method includes forming a protective structure extending into the first gate stack and forming a dielectric structure extending into the protective structure and the second metal gate stack. A portion of the protective structure is between the dielectric structure and the metal gate stack.

Abstract: Methods and devices that provide for a fin structure and a dielectric fin structure. A gate structure is formed over the fin structure and the hybrid fin structure. A plurality of dielectric layers is adjacent the gate structure and over the hybrid fin structure between the gate structure and a contact element over the dielectric fin structure. The plurality of dielectric layers includes an air gap, formed by removal of a dummy spacer layer.

Abstract: A semiconductor structure includes a stack of semiconductor layers disposed over a substrate, a metal gate stack having a top portion disposed over the stack of semiconductor layers and a bottom portion interleaved with the stack of semiconductor layers, an inner spacer disposed on sidewalls of the bottom portion of the metal gate stack, an air gap extending in the inner spacer, and an epitaxial source/drain (S/D) feature disposed over the inner spacer and adjacent to the metal gate stack.

Abstract: A method includes forming first semiconductive sheets over a substrate and arranged in a vertical direction, and second semiconductive sheets over the substrate and arranged in the vertical direction, wherein a number of the second semiconductive sheets is different than a number of the first semiconductive sheets; forming first source/drain regions on either side of each of the first semiconductive sheets, and second source/drain regions on either side of each of the second semiconductive sheets; forming a first gate around each of the first semiconductive sheets, and a second gate around each of the second semiconductive sheets.

Abstract: A semiconductor device includes first channel members, a first gate structure wrapping around each of the first channel members, a first epitaxial feature abutting the first channel members, second channel members, a second gate structure wrapping around each of the second channel members, a second epitaxial feature abutting the second channel members, and an isolation feature has a first portion laterally stacked between the first and second gate structures and a second portion laterally stacked between the first and second epitaxial features. A width of the first portion of the isolation feature is larger than a width of the second portion of the isolation feature.

Abstract: A method for forming transistors includes forming a stack of alternating first semiconductor layers and second semiconductor layers on a substrate and forming nanostructure channels and interposers by forming a source/drain opening in a first device region of the substrate. The source/drain opening extending through the first and second semiconductor layers. The method includes, after the forming a source/drain opening, increasing tensile strain of the nanostructure channels, and, after the increasing tensile strain, forming a source/drain in the source/drain opening.