Abstract: A compound of formula (I) or a pharmaceutically acceptable salt thereof is provided. In formula (I), Ar is indazole, 5-isoquinoline, 6-isoquinoline, or their N-oxide. X is —C(?Z)—, wherein Z is N—CN, NH, NR4, NCOR4, NCONR4R5, NCO-aryl, S, or O. Y and J are independently H, alkyl, aryl, aminoalkyl, —NH2, —CN, —OH, —O-alkyl, —O-aryl, —COOH, —COOR4, —CONHR4, —CONHCH2-aryl, —CONR4CH2-aryl, —NHCOR4, halogen, halogened alkyl, -alkyl-OR4, -alkyl-ONO2, alkyl-ONO2, —OCOOR4, —O(C?O)-aryl, —CHR4OH, —CH2OH, —CH2O(C?O)-aryl, —CH2O(C?O)—R4, —CHR4O(C?O)-aryl, —CHR4O(C?O)—R4, unsaturated carboxylic ester, substituted alkynyl, —NHSO2R4, —SO2R4, —SO2NHR4, or —SO2NR4R5, or Y and J bond together to form a carbocylic or aromatic ring, wherein R4 and R5 are independently H, substituted C1-C6 alkyl, substituted aryl, cycloalkyl, alkylaryl, -alkyl-NR6R7, —S(O)0-2-(alkyl-NR6R7).

Abstract: A keyswitch structure includes a base, a keycap, a first support, a second support, and a connection structure. The keycap moves up and down relative to the base through the first support and the second support. The connection structure is disposed on the base and includes a vertical-motion limiting part and a horizontal-motion limiting part. The first support includes a rod-shaped connection portion and is connected to the connection structure through the rod-shaped connection portion. The vertical-motion limiting part prevents the rod-shaped connection portion from vertically moving. The horizontal-motion limiting part limits the horizontal movement of the rod-shaped connection portion. The vertical-motion limiting part and the horizontal-motion limiting part are separated in the rotation axis of the rod-shaped connection portion.

Abstract: A luminous keyswitch includes a keycap having a light-transparent portion, a baseplate, an up-down mechanism with two ends respectively moveably connected to the keycap and the baseplate, a function sheet disposed on or under the baseplate, and a light source disposed on the function sheet within a vertical projection of the keycap and connected by a copper wire to provide a light illuminating the light-transparent portion. The function sheet includes a flexible upper circuit layer having a first contact point, a flexible spacer layer having a hole, and a flexible lower circuit layer having a second copper contact point, a third copper contact point, a first copper wire connected to the second copper contact point, and a second copper wire connected to the third copper contact point. When the keycap is pressed, the first contact point passes through the hole to electrically connect the second and third copper contact points.

Abstract: A semiconductor structure including a substrate, a first dielectric layer, a first conductive layer, a positioning part, two spacers, and a second conductive layer is provided. The substrate has a first trench. The first dielectric layer is disposed on a surface of the first trench. The first conductive layer is filled in the first trench and located on the first dielectric layer. The positioning part is disposed on the substrate and has a first opening. The first opening exposes the first trench. The spacers are disposed on two sidewalls of the first opening and expose the first conductive layer. The second conductive layer is filled in the first opening and electrically connected to the first conductive layer. The semiconductor structure can prevent the generation of leakage current while maintaining a high breakdown voltage.

Abstract: The present disclosure illustrates a method of flipping screen image of an electric screen device. The electronic screen device is applicable to a POS system, and includes a mounting base member, a base, a rotation unit configured to movably assemble the mounting base member with the top of the base, and an electronic circuit system disposed inside the mounting base member. A built-in program of the electronic circuit system is activated to sense the electronic screen by a trigger manner or a time counting manner, and the built-in program receives a sensing signal from the sensor to determine whether the electronic screen is flipped, determining whether the window image shown on screen image of the electronic screen matches with a flip direction of the electronic screen, and if not, the window image shown on the display screen is flipped and the application program operated in the window image is activated.

Abstract: A polishing pad is provided. The polishing pad includes a base layer, a top layer, and multiple grooves. The top layer is located over the base layer and has a polishing surface and a bottom surface opposite to each other. The bottom surface is connected to the base layer. The grooves are formed on the bottom surface of the top layer.

Abstract: A method includes polishing a wafer on a polishing pad, performing conditioning on the polishing pad using a disk of a pad conditioner, and conducting a heat-exchange media into the disk. The heat-exchange media conducted into the disk has a temperature different from a temperature of the polishing pad.

Abstract: A method for ex vivo treating blood or plasma is provided. The method includes (a) ex vivo contacting a blood or plasma with an enzyme composition to react the enzyme composition with the blood or plasma, wherein the enzyme composition is capable of eliminating electronegative low-density lipoprotein from the blood or plasma by the activity of the enzyme composition, and the enzyme composition is selected from a group consisting of: a first enzyme for eliminating a glycan residue of an electronegative low-density lipoprotein (LDL); a second enzyme for eliminating ceramide carried by a electronegative low-density lipoprotein (LDL); and a combination thereof; and (b) terminating contact between the blood or plasma and the enzyme composition to terminate the reaction of the enzyme composition with the blood or plasma.

Abstract: A semiconductor structure including a substrate, a first dielectric layer, a first conductive layer, a positioning part, two spacers, and a second conductive layer is provided. The substrate has a first trench. The first dielectric layer is disposed on a surface of the first trench. The first conductive layer is filled in the first trench and located on the first dielectric layer. The positioning part is disposed on the substrate and has a first opening. The first opening exposes the first trench. The spacers are disposed on two sidewalls of the first opening and expose the first conductive layer. The second conductive layer is filled in the first opening and electrically connected to the first conductive layer. The semiconductor structure can prevent the generation of leakage current while maintaining a high breakdown voltage.

Abstract: A slurry dispensing unit for a chemical mechanical polishing (CMP) apparatus is provided. The slurry dispensing unit includes a nozzle, a mixer, a first fluid source, and a second fluid source. The nozzle is configured to dispense a slurry. The mixer is disposed upstream of the nozzle. The first fluid source is connected to the mixer through a first pipe and configured to provide a first fluid including a first component of the slurry. The second fluid source is connected to the mixer through a second pipe and configured to provide a second fluid including a second component of the slurry, wherein the second component is different from the first component.

Abstract: A polishing pad is provided. The polishing pad includes a base layer, a top layer, and multiple grooves. The top layer is located over the base layer and has a polishing surface and a bottom surface opposite to each other. The bottom surface is connected to the base layer. The grooves are formed on the bottom surface of the top layer.

Abstract: A keyswitch structure includes a base, a keycap, a first support, a second support, and a connection structure. The keycap moves up and down relative to the base through the first support and the second support. The connection structure is disposed on the base and includes a vertical-motion limiting part and a horizontal-motion limiting part. The first support includes a rod-shaped connection portion and is connected to the connection structure through the rod-shaped connection portion. The vertical-motion limiting part prevents the rod-shaped connection portion from vertically moving. The horizontal-motion limiting part limits the horizontal movement of the rod-shaped connection portion. The vertical-motion limiting part and the horizontal-motion limiting part are separated in the rotation axis of the rod-shaped connection portion.

Abstract: In an embodiment, a method includes: performing a self-limiting process to modify a top surface of a wafer; after the self-limiting process completes, removing the modified top surface from the wafer; and repeating the performing the self-limiting process and the removing the modified top surface from the wafer until a thickness of the wafer is decreased to a predetermined thickness.

Abstract: A storage system and a data transferring method thereof are provided. The storage system includes at least one drawer storage device, a backplane board and a processing unit. Each of the drawer storage devices accommodates at least one storage device, and has a first connecting interface. The backplane board has a second connecting interface. The backplane board and each of the drawer storage devices are connected with each other through a transmission line. The first connecting interface and the second connecting interface are connected or isolated with each other. The processing unit detects a connection status between the first connecting interface and the second connecting interface, and determines to transfer data through at least one of the transmission line and a connection between the first connecting interface and the second connecting interface according to the connection status.

Abstract: A method for performing a CMP process is provided. The method includes performing the CMP process. The method further includes during the CMP process detecting a motion of a carrier head about a rotation axis beside a polishing pad. The method also includes producing a control signal corresponding to a detected result of the motion. In addition, the method includes prohibiting the rotation of the carrier head about a rotation axis by a driving motor which is controlled by the control signal. And, the method includes selecting a point of time at which the CMP process is terminated after the control signal is substantially the same as a threshold value.

Abstract: An aluminum-ion battery is provided. The aluminum-ion battery includes a positive electrode, a separator, a negative electrode, and an electrolyte composition. The negative electrode is separated from the positive electrode by a separator. The electrolyte composition is disposed between the positive electrode and the negative electrode. The electrolyte composition includes an aluminum halide, a solvent and a compound of Formula (I) wherein R1 is C1-8 alkyl group or C1-8 fluoroalkyl group; and n is 2, 3, 4, or 5. The sum of the aluminum halide and the solvent is 100 parts by weight. The compound of Formula (I) has a weight that is equal to or greater than 0.5 parts by weight and less than 5 parts by weight.

Abstract: An inductor-less local oscillator (LO) signal generation apparatus configured to generate one or more output signals which reduce a frequency pulling effect. The LO signal generation apparatus includes a multi-phase signal generation circuit, a phase signal generation circuit and one or more output circuits. The multi-phase signal generation circuit receives an input clock signal having a first frequency to generate a multi-phase clock signal. The multi-phase clock signal includes a plurality of clock signals each having the first frequency and different phases. The phase signal generation circuit is coupled to the multi-phase signal generation circuit to receive the multi-phase clock signal and output a plurality of phase signals indicating the phases of the clock signals. The one or more output circuits output the one or more output signals according to the clock signals and the phase signals without receiving feedback of any of the one or more output signals.

Abstract: A wafer polishing apparatus is described herein. The wafer polishing apparatus includes a polish module configured to apply air pressure to a first surface of a wafer while performing a polishing process on a second surface of the wafer. In some implementations, the polish module is further configured to perform a cleaning process and/or a drying process on the second surface of the wafer, such that the same wafer polishing apparatus is configured to perform the polishing process, the cleaning process, and/or the drying process. In some implementations, the polishing module is further configured to air seal edges of the wafer during the polishing process, the cleaning process, and/or the drying process.

Abstract: According to an embodiment, a toolbox includes a housing, one or more drawers received in the housing, and a handle extending from the housing. The handle comprises a pair of spaced grasping surfaces connected by a central grasping surface, the spaced grasping surface and the central grasping surface each spaced from the housing. According to another embodiment, a toolbox includes a housing and one or more drawers slidably received in the housing. The one or more drawers each comprise an integral latch, and the housing comprises an integral latch receptacle. Closing the drawer of the toolbox with a first amount of force does not engage the integral latch with the latch receptacle, while closing the drawer of the toolbox with a second amount of force automatically engages the integral latch with the latch receptacle, securing the one or more drawers within the housing.

Abstract: A wireless power transmission device includes a main body and a transmitter coil plate. The transmitter coil plate is disposed within the main body. The transmitter coil plate includes a coil plate body, a first transmitter coil structure, and a second transmitter coil structure. The first transmitter coil structure is disposed on a top surface of the coil plate body, and swirled along a first direction. The second transmitter coil structure is disposed on a bottom surface of the coil plate body, and swirled along a second direction. When the transmitter coil plate is magnetized, the magnetic flux generated by the transmitter coil plate is increased. Consequently, the wireless charging efficiency is enhanced.