Abstract: The present disclosure provides a semiconductor structure, including a capacitor. The capacitor includes a first electrode and a second electrode respectively electrically connected to a first conductor and a second conductor; and a first dielectric layer between the first electrode and the second electrode. In some embodiments, the first dielectric layer contacts with a sidewall surface of the first conductor. The semiconductor structure further includes a second dielectric layer over and adjacent to the capacitor. A method of forming the semiconductor package is also provided.

Abstract: A method for cleaning debris and contamination from an etching apparatus is provided. The etching apparatus includes a process chamber, a source of radio frequency power, an electrostatic chuck within the process chamber, a chuck electrode, and a source of DC power connected to the chuck electrode. The method of cleaning includes placing a substrate on a surface of the electrostatic chuck, applying a plasma to the substrate, thereby creating a positively charged surface on the surface of the substrate, applying a negative voltage or a radio frequency pulse to the electrode chuck, thereby making debris particles and/or contaminants from the surface of the electrostatic chuck negatively charged and causing them to attach to the positively charged surface of the substrate, and removing the substrate from the etching apparatus thereby removing the debris particles and/or contaminants from the etching apparatus.

Abstract: The present disclosure provides a semiconductor structure, including a capacitor. The capacitor includes a first electrode and a second electrode respectively electrically connected to a first conductor and a second conductor; and a first dielectric layer between the first electrode and the second electrode. In some embodiments, the first dielectric layer contacts with a sidewall surface of the first conductor. The semiconductor structure further includes a second dielectric layer over and adjacent to the capacitor. A method of forming the semiconductor package is also provided.

Abstract: A side by side image detection method and an electronic apparatus using the same are provided. The side by side image detection method includes the following steps. A first image with a first image size is obtained. A second image with a second image size that conforms to a side-by-side image format is detected within the first image by using a convolutional neural network model.

Abstract: An augmented reality (AR) system and an operation method thereof are provided. The AR system includes a target device and an AR device. The AR device captures the target device to generate a picture. The target device provides a digital content to the AR device. The AR device tracks the target device in the picture for an AR application. During the AR application, the AR device overlays the digital content on the target device in the picture.

Abstract: The present disclosure provides an artificial leather structure, comprising a woven layer, a porous elastomer layer disposed on the woven layer and a nonwoven layer disposed on the porous elastomer layer. The porous elastomer layer is adhered to the woven layer and the nonwoven layer.

Abstract: A method for cleaning debris and contamination from an etching apparatus is provided. The etching apparatus includes a process chamber, a source of radio frequency power, an electrostatic chuck within the process chamber, a chuck electrode, and a source of DC power connected to the chuck electrode. The method of cleaning includes placing a substrate on a surface of the electrostatic chuck, applying a plasma to the substrate, thereby creating a positively charged surface on the surface of the substrate, applying a negative voltage or a radio frequency pulse to the electrode chuck, thereby making debris particles and/or contaminants from the surface of the electrostatic chuck negatively charged and causing them to attach to the positively charged surface of the substrate, and removing the substrate from the etching apparatus thereby removing the debris particles and/or contaminants from the etching apparatus.

Abstract: A lamp, a lamp system, a method for assembling lamp system, and a method for disassembling lamp system are described. The lamp includes a frame, a light guide plate, at least one light source and a connecting mechanism. The frame includes two side covers opposite to each other, and an accommodating space is formed between the side covers. The light guide plate is disposed in the accommodating space. The light source is disposed in at least one of the side covers and is disposed adjacent to a light incident surface of the light guide plate. The connecting mechanism is disposed in the frame. The connecting mechanism includes an engaging member and an adjusting member. The engaging member is slidably disposed in an inner space of one of the side covers.

Abstract: A self-driven power generation module and a manufacturing method thereof are provided. The self-driven power generation module includes an upper structure, a lower structure, and a charge accumulation layer. The upper structure includes a first encapsulating layer, a first supporting layer, and a first electrode layer. The first supporting layer contacts the first encapsulating layer. The first electrode layer contacts the first supporting layer. The lower structure is spaced apart from the upper structure. The lower structure includes a second encapsulating layer, a second supporting layer, a second electrode layer, a third supporting layer, and a third electrode layer. The third supporting layer is disposed on the second encapsulating layer and spaced apart from the second supporting layer. The third electrode layer is disposed on the third supporting layer. The charge accumulation layer is disposed between the upper structure and the lower structure.

Abstract: A probe card device includes a probe head including a plurality of pins, wherein each of the pins includes a body, a first metal layer formed on the body, and a second metal layer covering the first metal layer; a multi-layered flexible board electrically connected to the pins; a support plate, the multi-layered flexible board disposed on a first surface of the support plate; and a circuit board electrically connected to the multi-layered flexible board.

Abstract: A substrate separation system configured to remove a substrate from a carrier is provided. The substrate separation system includes a stage, an upper fixing portion, a suction portion, a cutting portion and a blowing portion. The stage is configured to carry the carrier. The upper fixing portion is disposed above the stage so as to be movable up and down. The suction portion is disposed above the stage so as to be movable up and down, and has a hollow portion to accommodate the upper fixing portion. The cutting portion is disposed on one side of the stage. The blowing portion is disposed on another side of the stage, and is configured to provide a blowing force to a position between the substrate and the carrier.

Abstract: A substrate separation system configured to remove a substrate from a carrier is provided. The substrate separation system includes a stage, an upper fixing portion, a suction portion, a cutting portion and a blowing portion. The stage is configured to carry the carrier. The upper fixing portion is disposed above the stage so as to be movable up and down. The suction portion is disposed above the stage so as to be movable up and down, and has a hollow portion to accommodate the upper fixing portion. The cutting portion is disposed on one side of the stage. The blowing portion is disposed on another side of the stage, and is configured to provide a blowing force to a position between the substrate and the carrier.

Abstract: A probe card device includes a probe head including a plurality of pins, wherein each of the pins includes a body, a first metal layer formed on the body, and a second metal layer covering the first metal layer; a multi-layered flexible board electrically connected to the pins; a support plate, the multi-layered flexible board disposed on a first surface of the support plate; and a circuit board electrically connected to the multi-layered flexible board.

Abstract: A light source module includes a substrate, a reflective assembly and a plurality of point light sources. The reflective assembly is disposed above the substrate and has a plurality of first partition plates disposed along a first direction, a plurality of second partition plates disposed along a second direction and a plurality of reflective structures. The first and second partition plates cross with each other to form a plurality of reflective holes. An upper surface of the substrate is partially exposed to the reflective holes. The reflective structures are disposed in the reflective holes respectively. The first partition plates, the second partition plates and the reflective structures are integrally formed. The point light sources are disposed above the substrate, located in the reflective holes respectively, and located below the reflective structures respectively. Thus, the light source module can significantly reduce the light mixing distance.

Abstract: A probe card device includes a plurality of pins; a thin film substrate including a plurality of first thin film connecting points and a plurality of second thin film connecting points, wherein at least one of the first thin film connecting points is electrically connected to at least one the second thin film connecting points, and a pitch of any two adjacent ones of the first film connecting points is less than a pitch of any two adjacent ones of the second film connecting points; and a circuit board including a plurality of first circuit board connecting points, wherein at least one of the second thin film connecting points is electrically connected to at least one of the first circuit board connecting points. The probe card device can enhance a layout function and a support function at the same time.

Abstract: A light source module includes a substrate, a reflective assembly and a plurality of point light sources. The reflective assembly is disposed above the substrate and has a plurality of first partition plates disposed along a first direction, a plurality of second partition plates disposed along a second direction and a plurality of reflective structures. The first and second partition plates are staggered with each other to form a plurality of reflective holes. An upper surface of the substrate is partially exposed to the reflective holes. The reflective structures are disposed in the reflective holes respectively. The first partition plates, the second partition plates and the reflective structures are integrally formed. The point light sources are disposed above the substrate, located in the reflective holes respectively, and located below the reflective structures respectively. Thus, the light source module can significantly reduce the light mixing distance.

Abstract: A probe card device includes a plurality of pins; a thin film substrate including a plurality of first thin film connecting points and a plurality of second thin film connecting points, wherein at least one of the first thin film connecting points is electrically connected to at least one the second thin film connecting points, and a pitch of any two adjacent ones of the first film connecting points is less than a pitch of any two adjacent ones of the second film connecting points; and a circuit board including a plurality of first circuit board connecting points, wherein at least one of the second thin film connecting points is electrically connected to at least one of the first circuit board connecting points. The probe card device can enhance a layout function and a support function at the same time.

Abstract: A device for integrating a position, an attitude, and a wireless transmission is disclosed. The device includes an electrical connection substrate, a processor unit, a wireless communication module, and a set of sensors. The wireless communication module is electrically coupled to the processor unit via the electrical connection substrate. The set of sensors is electrically coupled to the processor unit. The processor unit and the wireless communication module are packaged as a monolithic package structure on the electrical connection substrate. The device for integrating the position, the attitude, and the wireless transmission can be manufactured as a miniaturization device. Accordingly, the present invention can be applied to a wearable device and applied to a game in which an absolute positioning is required.

Abstract: The present invention provides a time adjusting method and system for a time piece (such as a wristwatch), which utilizes a motion sensor disposed on the wristwatch to detect a hand gesture made by a user in the front of the wristwatch. In such a manner, adjusting the position of an indicator on the wristwatch is realized, and thereby carrying out the time adjustment.

Abstract: A metal structure manufacture method for a multi-layer substrate comprises coating a photoresist layer on a first dielectric layer; proceeding a photolithography process to the photoresist layer to define a specific position for a first metal layer; removing the photoresist layer at the specific position; and forming the first metal layer at the specific position, wherein a base area of the first metal layer is larger than a top area thereof, and wherein the embedded base and the main body are formed in a same process and are monolithic formed. Said manufacturing method can be employed to manufacture a pad or a metal line of the flexible multi-layer substrate, and the manufactured metal structure cannot easily be delaminated or separated from the contacted dielectric layer.