Patents by Inventor Chih-Kuang Yang

Chih-Kuang Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11221351
    Abstract: A probe card device includes a probe head including a plurality of pins, wherein each of the pins includes a body, a first metal layer formed on the body, and a second metal layer covering the first metal layer; a multi-layered flexible board electrically connected to the pins; a support plate, the multi-layered flexible board disposed on a first surface of the support plate; and a circuit board electrically connected to the multi-layered flexible board.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: January 11, 2022
    Assignee: PRINCO CORP.
    Inventors: Chih-kuang Yang, Yeong-yan Guu, Chun-hsiung Chou
  • Patent number: 10622332
    Abstract: A substrate separation system configured to remove a substrate from a carrier is provided. The substrate separation system includes a stage, an upper fixing portion, a suction portion, a cutting portion and a blowing portion. The stage is configured to carry the carrier. The upper fixing portion is disposed above the stage so as to be movable up and down. The suction portion is disposed above the stage so as to be movable up and down, and has a hollow portion to accommodate the upper fixing portion. The cutting portion is disposed on one side of the stage. The blowing portion is disposed on another side of the stage, and is configured to provide a blowing force to a position between the substrate and the carrier.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: April 14, 2020
    Assignee: PRINCO CORP.
    Inventors: Chun-Hsiung Chou, Chin-Huang Huang, Chih-Kuang Yang
  • Publication number: 20200103441
    Abstract: A probe card device includes a probe head including a plurality of pins, wherein each of the pins includes a body, a first metal layer formed on the body, and a second metal layer covering the first metal layer; a multi-layered flexible board electrically connected to the pins; a support plate, the multi-layered flexible board disposed on a first surface of the support plate; and a circuit board electrically connected to the multi-layered flexible board.
    Type: Application
    Filed: July 11, 2019
    Publication date: April 2, 2020
    Inventors: CHIH-KUANG YANG, YEONG-YAN GUU, CHUN-HSIUNG CHOU
  • Publication number: 20200105716
    Abstract: A substrate separation system configured to remove a substrate from a carrier is provided. The substrate separation system includes a stage, an upper fixing portion, a suction portion, a cutting portion and a blowing portion. The stage is configured to carry the carrier. The upper fixing portion is disposed above the stage so as to be movable up and down. The suction portion is disposed above the stage so as to be movable up and down, and has a hollow portion to accommodate the upper fixing portion. The cutting portion is disposed on one side of the stage. The blowing portion is disposed on another side of the stage, and is configured to provide a blowing force to a position between the substrate and the carrier.
    Type: Application
    Filed: July 15, 2019
    Publication date: April 2, 2020
    Inventors: CHUN-HSIUNG CHOU, CHIN-HUANG HUANG, CHIH-KUANG YANG
  • Patent number: 10534219
    Abstract: A light source module includes a substrate, a reflective assembly and a plurality of point light sources. The reflective assembly is disposed above the substrate and has a plurality of first partition plates disposed along a first direction, a plurality of second partition plates disposed along a second direction and a plurality of reflective structures. The first and second partition plates cross with each other to form a plurality of reflective holes. An upper surface of the substrate is partially exposed to the reflective holes. The reflective structures are disposed in the reflective holes respectively. The first partition plates, the second partition plates and the reflective structures are integrally formed. The point light sources are disposed above the substrate, located in the reflective holes respectively, and located below the reflective structures respectively. Thus, the light source module can significantly reduce the light mixing distance.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: January 14, 2020
    Assignee: Coretronic Corporation
    Inventors: Yu-Ching Lee, Chih-Kuang Yang, Yi-Hsun Lee, Han-Yuan Liu, Ping-Yeng Chen
  • Patent number: 10451654
    Abstract: A probe card device includes a plurality of pins; a thin film substrate including a plurality of first thin film connecting points and a plurality of second thin film connecting points, wherein at least one of the first thin film connecting points is electrically connected to at least one the second thin film connecting points, and a pitch of any two adjacent ones of the first film connecting points is less than a pitch of any two adjacent ones of the second film connecting points; and a circuit board including a plurality of first circuit board connecting points, wherein at least one of the second thin film connecting points is electrically connected to at least one of the first circuit board connecting points. The probe card device can enhance a layout function and a support function at the same time.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: October 22, 2019
    Assignees: PRINCO CORP., TEK CROWN TECHNOLOGY CO., LTD.
    Inventors: Chih-kuang Yang, Yeong-yan Guu, Mou-I Lee
  • Publication number: 20190004371
    Abstract: A light source module includes a substrate, a reflective assembly and a plurality of point light sources. The reflective assembly is disposed above the substrate and has a plurality of first partition plates disposed along a first direction, a plurality of second partition plates disposed along a second direction and a plurality of reflective structures. The first and second partition plates are staggered with each other to form a plurality of reflective holes. An upper surface of the substrate is partially exposed to the reflective holes. The reflective structures are disposed in the reflective holes respectively. The first partition plates, the second partition plates and the reflective structures are integrally formed. The point light sources are disposed above the substrate, located in the reflective holes respectively, and located below the reflective structures respectively. Thus, the light source module can significantly reduce the light mixing distance.
    Type: Application
    Filed: June 12, 2018
    Publication date: January 3, 2019
    Inventors: Yu-Ching Lee, Chih-Kuang Yang, Yi-Hsun Lee, Han-Yuan Liu, Ping-Yeng Chen
  • Publication number: 20170343582
    Abstract: A probe card device includes a plurality of pins; a thin film substrate including a plurality of first thin film connecting points and a plurality of second thin film connecting points, wherein at least one of the first thin film connecting points is electrically connected to at least one the second thin film connecting points, and a pitch of any two adjacent ones of the first film connecting points is less than a pitch of any two adjacent ones of the second film connecting points; and a circuit board including a plurality of first circuit board connecting points, wherein at least one of the second thin film connecting points is electrically connected to at least one of the first circuit board connecting points. The probe card device can enhance a layout function and a support function at the same time.
    Type: Application
    Filed: May 26, 2017
    Publication date: November 30, 2017
    Inventors: Chih-kuang YANG, Yeong-yan GUU, MOU-I LEE
  • Publication number: 20170060268
    Abstract: A device for integrating a position, an attitude, and a wireless transmission is disclosed. The device includes an electrical connection substrate, a processor unit, a wireless communication module, and a set of sensors. The wireless communication module is electrically coupled to the processor unit via the electrical connection substrate. The set of sensors is electrically coupled to the processor unit. The processor unit and the wireless communication module are packaged as a monolithic package structure on the electrical connection substrate. The device for integrating the position, the attitude, and the wireless transmission can be manufactured as a miniaturization device. Accordingly, the present invention can be applied to a wearable device and applied to a game in which an absolute positioning is required.
    Type: Application
    Filed: August 17, 2016
    Publication date: March 2, 2017
    Applicant: PRINCO CORP.
    Inventors: Chen-Ping Chiu, Chih-Kuang Yang, Cheng-Yi Chang
  • Patent number: 9501153
    Abstract: The present invention provides a time adjusting method and system for a time piece (such as a wristwatch), which utilizes a motion sensor disposed on the wristwatch to detect a hand gesture made by a user in the front of the wristwatch. In such a manner, adjusting the position of an indicator on the wristwatch is realized, and thereby carrying out the time adjustment.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: November 22, 2016
    Assignee: PRINCO MIDDLE EAST FZE
    Inventor: Chih-kuang Yang
  • Patent number: 9398704
    Abstract: A metal structure manufacture method for a multi-layer substrate comprises coating a photoresist layer on a first dielectric layer; proceeding a photolithography process to the photoresist layer to define a specific position for a first metal layer; removing the photoresist layer at the specific position; and forming the first metal layer at the specific position, wherein a base area of the first metal layer is larger than a top area thereof, and wherein the embedded base and the main body are formed in a same process and are monolithic formed. Said manufacturing method can be employed to manufacture a pad or a metal line of the flexible multi-layer substrate, and the manufactured metal structure cannot easily be delaminated or separated from the contacted dielectric layer.
    Type: Grant
    Filed: July 4, 2012
    Date of Patent: July 19, 2016
    Assignee: PRINCO MIDDLE EAST FZE
    Inventor: Chih-kuang Yang
  • Patent number: 9379089
    Abstract: Disclosed is a core module, comprising: a package substrate, having a plurality of pads; a first component, connected to the pads of the package substrate corresponding to the first component with a plurality of first joint parts; a second component, connected to the pads of the package substrate corresponding to the first component with a plurality of second joint parts; and a third component, connected to the pads of the package substrate corresponding to the third component with a plurality of third joint parts, wherein the first component is positioned above the second component relative to the lower package substrate, and the first component, the second component and the third component are all electrically connected via the package substrate, and a main molding material is molding the first component, the second component and the third component.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: June 28, 2016
    Assignee: PRINCO MIDDLE EAST FZE
    Inventors: Chih-kuang Yang, Cheng-yi Chang, Yeong-yan Guu, Gan-how Shaue
  • Patent number: 9362199
    Abstract: Disclosed is a chip thermal dissipation structure, employed in an electronic device comprising a first chip having a first chip face and a first chip back, comprising chip molding material, covering a lateral of the first chip; a first case, contacting the first chip back; a packaging substrate, connecting with the first chip face via first bumps; and a print circuit board, having a first surface and a second surface and connecting with the packaging substrate via solders. The chip thermal dissipation structure further comprises a second case, contacting the second surface. The thermal energy generated by the first chip is conducted toward the first case via the first chip back and toward the second case via the first chip face, the first bumps, the packaging substrate, the solders and the print circuit board.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: June 7, 2016
    Assignee: PRINCO MIDDLE EAST FZE
    Inventor: Chih-kuang Yang
  • Publication number: 20160126110
    Abstract: A method for manufacturing a three-dimensional integrated circuit is disclosed. The method includes: providing a substrate; forming at least one metal layer and at least one dielectric layer on the substrate; forming a plurality of electrical connection points on the metal layer; dicing to generate a plurality package units, each of the package units adhered to a diced substrate; reversing each of the package units and connecting each of the reversed package units to a surface of a wiring substrate to form an integrated substrate; and removing the diced substrate of each of the reversed package units. The present disclosure can improve an assembling process.
    Type: Application
    Filed: October 29, 2015
    Publication date: May 5, 2016
    Inventor: Chih-kuang YANG
  • Publication number: 20160091864
    Abstract: The present invention provides a wristwatch structure with physical hands and a method for offering a communication function to a wristwatch, which uses remaining room in a traditional wristwatch (such as a mechanical watch and a quartz watch) to dispose an electronic module. By way of wireless transmission, the electronic module is utilized to receive wireless signals transmitted from a device (such as a smart phone) near a wristwatch user, and to provide a prompt message (such as vibration or an audio sound) based on the wireless signals. The present invention gives a new function to the traditional wristwatch, and is also capable of solving the problem of prompt function not working in large-scale cell phone.
    Type: Application
    Filed: September 14, 2015
    Publication date: March 31, 2016
    Applicant: Princo Middle East FZE
    Inventors: Chih-Kuang Yang, Cheng-Yi Chang, Chi-Pin Kuo
  • Patent number: 9256209
    Abstract: The present invention provides a wristwatch structure, an electronic core for a wristwatch, and a method for manufacturing the wristwatch. The wristwatch structure comprises: a dial; an indicator designed with the dial; an electric driving component connected to the indicator, for driving the indicator and actuating it; and an electronic core having an integrated circuit unit packaged therein, the electronic core also having a plurality of two-dimensional joints distributed on an external surface thereof, wherein the electric driving component is electrically connected to the integrated circuit unit of the electronic core via one set of joints among the two-dimensional joints. The present invention can improve compatibility for various designs, thereby shortening the product development cycle.
    Type: Grant
    Filed: February 24, 2014
    Date of Patent: February 9, 2016
    Assignee: PRINCO MIDDLE EAST FZE
    Inventors: Chih-Kuang Yang, Yeong-yan Guu, Cheng-yi Chang, Gan-how Shaue
  • Patent number: 9223296
    Abstract: The present invention provides a wristwatch structure, an electronic crown for wristwatch, and a wristwatch having a display. The wristwatch structure comprises an electric driving component; an electronic core having a plurality of two-dimensional joints; and an electronic crown comprising a rotating portion and a fixed detecting portion, the detecting portion detecting electronic signals according to a rotation of the rotating portion; wherein the detecting portion of the electronic crown exports the electronic signals to the electronic core via one of the joints, and the electric driving component is electrically connected to one set of joints among the two-dimensional joints. The present invention can improve compatibility for various designs, thereby shortening product development cycle. Also, the present invention is suitable for developing a product with appearance similar to a mechanical watch.
    Type: Grant
    Filed: February 24, 2014
    Date of Patent: December 29, 2015
    Assignee: PRINCO MIDDLE EAST FZE
    Inventors: Chih-kuang Yang, Yeong-yan Guu, Cheng-yi Chang, Gan-how Shaue
  • Publication number: 20150361249
    Abstract: A barrier structure is disclosed. The barrier structure is utilized for covering at least a part of an object for protecting the object from gas and water in an external environment and includes a solid layer and a liquid layer. The solid layer has a first surface and a second surface. The first surface directly contacts the external environment. The solid layer is penetrable by at least one type of gas. The liquid layer contacts the second surface. An interface is formed between the second surface of the solid layer and the liquid layer. The barrier structure has ductility, flexibility, and bendability to cover the object, protect the object from the external environment, and provide the required barrier characteristic against the water or the gas.
    Type: Application
    Filed: January 18, 2013
    Publication date: December 17, 2015
    Inventors: Ta-Jo LIU, Chih-kuang YANG
  • Publication number: 20150323906
    Abstract: Disclosed are a timepiece and a power saving method of a timepiece. The timepiece includes a display, a setting module, a sensor and a controller. The display is utilized for displaying a time pattern. The setting module is utilized for setting a normal display mode and a first power saving mode. The sensor is utilized for sensing an operation of a user for transmitting a signal. The controller is utilized for switching the display between the normal display mode and the first power saving mode according to the setting of the setting module and the signal of the sensor. The display changes the time pattern when the timepiece is switched between the normal display mode and the first power saving mode. The present invention can decrease the power consumption for extending the usage time of the timepiece.
    Type: Application
    Filed: March 27, 2015
    Publication date: November 12, 2015
    Inventors: Chih-kuang YANG, Cheng-yi CHANG
  • Patent number: 9182443
    Abstract: Disclosed are a testing device and a testing method thereof. The testing device includes a frame, a flexible multi-layer substrate and at least one electrical testing point. The frame is positioned corresponding to a chip. At least one electrical connecting point is formed on a surface of the chip. The flexible multi-layer substrate is fixed in the frame. The electrical testing point is corresponding to the electrical connecting point and formed on an upper surface of the flexible multi-layer substrate for contacting the electrical connecting point and performing an electrical test to the chip. Furthermore, the electrical connecting point or the electrical testing point is a bump.
    Type: Grant
    Filed: November 13, 2013
    Date of Patent: November 10, 2015
    Assignee: PRINCO MIDDLE EAST FZE
    Inventors: Gan-how Shaue, Chih-kuang Yang