Abstract: A multi frequency ranges vehicle antenna able to transmit and receive over multiple frequencies including v2x includes a dielectric substrate, a first antenna, and second and third antennas. The first to third antennas are in parallel, vertically mounted, and are connected to the dielectric substrate. The first antenna is positioned between the second and third antennas. The first antenna is a 5G wideband antenna able to communicate in 2G, 3G, 4G, and 5G frequency bands, and the working frequency bands of the second and third antennas, which can work at the same time, are compatible with WiFi 6E and V2X frequency bands.

Abstract: A multi frequency ranges vehicle antenna able to transmit and receive over multiple frequencies including v2x includes a dielectric substrate, a first antenna, and second and third antennas. The first to third antennas are in parallel, vertically mounted, and are connected to the dielectric substrate. The first antenna is positioned between the second and third antennas. The first antenna is a 5G wideband antenna able to communicate in 2G, 3G, 4G, and 5G frequency bands, and the working frequency bands of the second and third antennas, which can work at the same time, are compatible with WiFi 6E and V2X frequency bands.

Abstract: An electronic device assembly is provided, including an electronic device body and a detachable lens module. The electronic device body has a housing and a first joining unit, wherein the first joining unit is disposed on the housing. The detachable lens module is detachably assembled onto the housing and has a second joining unit, wherein the first joining unit is joined to the second joining unit to electrically connect the detachable lens module to the electronic device body.

Abstract: A resin composition is provided. The resin composition includes the following constituents: (A) an epoxy resin; (B) an amino group-containing hardener; and (C) a compound of formula (I), wherein, R11 to R16 and A1 to A2 in formula (I) are as defined in the specification, and the amount of the compound (C) of formula (I) is about 10 parts by weight to about 85 parts by weight per 100 parts by weight of the epoxy resin (A).

Abstract: A wheeled vehicle includes a vehicle body, a vibration absorbing element, an auxiliary arm, a wheel, and a driving member. The vehicle body includes a fixing plate. The housing connected to the fixing plate. The vibration absorbing element includes a first end and a second end. The first end is fixed to the housing. The auxiliary arm includes a connecting end and a free end. The connecting end is connected to the housing. The free end is configured to swing relative to the connecting end. The free end is fixed to the second end. The wheel includes an axle, and the axle is rotationally connected to the free end. The driving member is fixed to the housing and configured to drive the wheel.

Abstract: A resin composition is provided. The resin composition comprises the following constituents: (A) epoxy resin; (B) a compound of formula (I), in formula (I), R1 and R2 are independently —H, —CH3, or —C(CH3); and (C) an optional filler.

Abstract: An antenna structure includes a frame portion and a feeding portion. The frame portion is provided with a first gap and a second gap. The first gap and the second gap penetrate and divide the frame portion into a first radiating portion, a second radiating portion, and a third radiating portion. The feeding portion is arranged on the first radiating portion adjacent to the second gap. One end of the feeding portion is electrically coupled to the first radiating portion, and the other end of the feeding portion is electrically coupled to a feeding point to feed current to the first radiating portion. The second radiating portion and/or the third radiating portion is provided with a side slot. A radiation frequency band of the second radiating portion and/or the third radiating portion where the side slot is located is adjusted by adjusting the length of the side slot.

Abstract: An electronic device assembly is provided, including an electronic device body and a detachable lens module. The electronic device body has a housing and a first joining unit, wherein the first joining unit is disposed on the housing. The detachable lens module is detachably assembled onto the housing and has a second joining unit, wherein the first joining unit is joined to the second joining unit to electrically connect the detachable lens module to the electronic device body.

Abstract: A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): wherein m, n, l, R1, and R2 are as defined in the specification.

Abstract: An electronic device assembly is provided, including an electronic device body and a detachable lens module. The electronic device body has a housing and a first joining unit, wherein the first joining unit is disposed on the housing. The detachable lens module is detachably assembled onto the housing and has a second joining unit, wherein the first joining unit is joined to the second joining unit to electrically connect the detachable lens module to the electronic device body.

Abstract: An antenna structure includes a housing, a first feed source, a second feed source, and a resonance circuit. The housing includes a first and a second radiator spaced to each other and grounded. The first feed source feeds current into the first radiator to activate a first mode, a second mode, and a third mode to generate radiation signals in a first frequency band, a second frequency band, and a third frequency band. The second feed source feeds current into the second radiator to activate a fourth mode to generate radiation signals in a fourth frequency band. The resonance circuit adjusts a radiation frequency band of the second radiator according to an impedance of the resonance circuit. The first radiator adjusts the third mode according to the radiation frequency band of the second radiator. A wireless communication device employing the antenna structure is also provided.

Abstract: A high thermal conductivity prepreg is provided. The high thermal conductivity prepreg includes a high thermal conductivity reinforcing material and a dielectric material layer formed on the surface of the high thermal conductivity reinforcing material, wherein the high thermal conductivity reinforcing material is prepared by a process which includes the following steps: (a) providing a precursor aqueous solution, the precursor aqueous solution includes a precursor selected from the group of organic salts, inorganic salts, and combinations thereof; (b) subjecting the precursor aqueous solution to a hydrolysis reaction to form an intermediate product aqueous solution; (c) subjecting the intermediate product aqueous solution to a condensation polymerization reaction to form a pretreatment solution; (d) impregnating a reinforcing material with the pretreatment solution; and (e) oven-drying the impregnated reinforcing material to obtain the high thermal conductivity reinforcing material.

Abstract: An antenna structure includes a frame portion and a feeding portion. The frame portion is provided with a first gap and a second gap. The first gap and the second gap penetrate and divide the frame portion into a first radiating portion, a second radiating portion, and a third radiating portion. The feeding portion is arranged on the first radiating portion adjacent to the second gap. One end of the feeding portion is electrically coupled to the first radiating portion, and the other end of the feeding portion is electrically coupled to a feeding point to feed current to the first radiating portion. The second radiating portion and/or the third radiating portion is provided with a side slot. A radiation frequency band of the second radiating portion and/or the third radiating portion where the side slot is located is adjusted by adjusting the length of the side slot.

Abstract: An electronic device assembly is provided, including an electronic device body and a detachable lens module. The electronic device body has a housing and a first joining unit, wherein the first joining unit is disposed on the housing. The detachable lens module is detachably assembled onto the housing and has a second joining unit, wherein the first joining unit is joined to the second joining unit to electrically connect the detachable lens module to the electronic device body.

Abstract: A resin composition comprising the following constituents: (A) a polyphenylene ether resin with unsaturated end groups; (B) a constituent with a maleimide structure; (C) a first initiator, which has a first one-minute half-life temperature; and (D) a second initiator, which has a second one-minute half-life temperature, wherein the first one-minute half-life temperature is 20° C. to 50° C. higher than the second one-minute half-life temperature, and the first one-minute half-life temperature is 170° C. to 220° C.

Abstract: A resin composition is provided. The resin composition comprises the following constituents: (A) an epoxy resin, which has at least two epoxy functional groups per molecule; (B) a reactive flame retardant with (a DOPO functional group) in structure; and (C) a non-reactive phosphorus-containing flame retardant, which is compatible with the other constituents of the resin composition.

Abstract: A resin composition is provided. The resin composition comprises the following components: (A) epoxy resin; (B) a cross-linking agent; (C) bismaleimide resin (BMI) represented by the following formula (I): wherein R1 is an organic group; and (D) a resin represented by the following formula (II): wherein n is an integer of 1 to 10.

Abstract: An illumination device includes a supporting base, and a light-emitting element inserted in the supporting base. The light-emitting element includes a substrate having a supporting surface and a side surface, a light-emitting chip disposed on the supporting surface, and a first wavelength conversion layer covering the light-emitting chip and only a portion of the supporting surface without covering the side surface.

Abstract: A thermal-curable resin composition is provided. The thermal-curable resin composition comprises: (A) a thermal-curable resin component, which comprises: (a1) bismaleimide resin; (a2) cyanate ester resin; and (a3) epoxy resin, wherein the cyanate ester resin (a2) and the epoxy resin (a3) are respectively in an amount ranging from 50 parts by weight to 150 parts by weight and from 24 parts by weight to 51 parts by weight per 100 parts by weight of the bismaleimide resin (a1); and (B) a filler, wherein the filler (B) is in an amount ranging from 40 parts by weight to 55 parts by weight per 100 parts by weight of the dry weight of the resin composition; and wherein the resin composition has a dynamic viscosity of not higher than 800 Pa·s after being brought into a semi-cured state (B-stage), and the resin composition has a dissipation factor (Df) of not higher than 0.006 at 10 GHz after being cured completely.

Abstract: A resin composition comprising the following constituents: (A) a polyphenylene ether resin with unsaturated end groups; (B) a constituent with a maleimide structure; (C) a first initiator, which has a first one-minute half-life temperature; and (D) a second initiator, which has a second one-minute half-life temperature, wherein the first one-minute half-life temperature is 20° C. to 50° C. higher than the second one-minute half-life temperature, and the first one-minute half-life temperature is 170° C. to 220° C.