Abstract: An antenna structure includes a side frame, a first feed portion, a second feed portion, and a first ground portion. The side frame defines a first gap and a second gap. The side frame is divided into a first radiating portion by the first gap and the second gap. When the first feed portion supplies current, the current flows through a first resonance section and is grounded through the first ground portion to activate a first operating mode and a second operating mode. When the first feed portion supplies current, the current flows through a second resonance section and is grounded through the second feed portion to activate a third operating mode. When the second feed portion supplies current, the current flows through the second resonance section and the first resonance section, and is grounded through the first ground portion to activate a fourth operating mode.

Abstract: An antenna structure includes a housing and a feeding source. The housing forms a radiating portion, a first coupling portion, and a second coupling portion. The first coupling portion and the second coupling portion are grounded. The feeding source is electrically connected to the radiating portion for feeding current to the radiating portion and divides the radiating portion into a first radiating section and a second radiating section. When the feeding source supplies current, the current flows through the first radiating section and is coupled to the first coupling portion to activate a first operation mode and a second operation mode. When the feeding source supplies current, the current flows through the second radiating section and is coupled to the second coupling portion to activate a third operation mode and a fourth operation mode.

Abstract: A high thermal conductivity prepreg is provided. The high thermal conductivity prepreg includes a high thermal conductivity reinforcing material and a dielectric material layer formed on the surface of the high thermal conductivity reinforcing material, wherein the high thermal conductivity reinforcing material is prepared by a process which includes the following steps: (a) providing a precursor aqueous solution, the precursor aqueous solution includes a precursor selected from the group of organic salts, inorganic salts, and combinations thereof; (b) subjecting the precursor aqueous solution to a hydrolysis reaction to form an intermediate product aqueous solution; (c) subjecting the intermediate product aqueous solution to a condensation polymerization reaction to form a pretreatment solution; (d) impregnating a reinforcing material with the pretreatment solution; and (e) oven-drying the impregnated reinforcing material to obtain the high thermal conductivity reinforcing material.

Abstract: An illumination device includes a supporting base, and a light-emitting element inserted in the supporting base. The light-emitting element includes a substrate having a supporting surface and a side surface, a light-emitting chip disposed on the supporting surface, and a first wavelength conversion layer covering the light-emitting chip and only a portion of the supporting surface without covering the side surface.

Abstract: A thermal-curable resin composition is provided. The thermal-curable resin composition comprises: (A) a thermal-curable resin component, which comprises: (a1) bismaleimide resin; (a2) cyanate ester resin; and (a3) epoxy resin, wherein the cyanate ester resin (a2) and the epoxy resin (a3) are respectively in an amount ranging from 50 parts by weight to 150 parts by weight and from 24 parts by weight to 51 parts by weight per 100 parts by weight of the bismaleimide resin (a1); and (B) a filler, wherein the filler (B) is in an amount ranging from 40 parts by weight to 55 parts by weight per 100 parts by weight of the dry weight of the resin composition; and wherein the resin composition has a dynamic viscosity of not higher than 800 Pa·s after being brought into a semi-cured state (B-stage), and the resin composition has a dissipation factor (Df) of not higher than 0.006 at 10 GHz after being cured completely.

Abstract: A resin composition is provided. The resin composition comprises an epoxy resin (A) and a first hardener (B) of the following formula (I): wherein Ar, R and n are as defined in the specification, and the molar ratio of the epoxy group of the epoxy resin to the active functional group of the first hardener ranges from about 1:0.4 to about 1:1.6.

Abstract: A resin composition is provided. The resin composition comprises the following constituents: (A) epoxy resin; (B) a compound of formula (I), in formula (I), R1 and R2 are independently —H, —CH3, or —C(CH3); and (C) an optional filler.

Abstract: An illumination device includes a supporting base, and a light-emitting element inserted in the supporting base. The light-emitting element includes a substrate having a supporting surface and a side surface, a light-emitting chip disposed on the supporting surface, and a first wavelength conversion layer covering the light-emitting chip and only a portion of the supporting surface without covering the side surface.

Abstract: An antenna structure includes a side frame, a first feed portion, a second feed portion, and a first ground portion. The side frame defines a first gap and a second gap. The side frame is divided into a first radiating portion by the first gap and the second gap. When the first feed portion supplies current, the current flows through a first resonance section and is grounded through the first ground portion to activate a first operating mode and a second operating mode. When the first feed portion supplies current, the current flows through a second resonance section and is grounded through the second feed portion to activate a third operating mode. When the second feed portion supplies current, the current flows through the second resonance section and the first resonance section, and is grounded through the first ground portion to activate a fourth operating mode.

Abstract: A resin composition is provided. The resin composition includes the following constituents: (A) an epoxy resin; (B) an amino group-containing hardener; and (C) a compound of formula (I), wherein, R11 to R16 and A1 to A2 in formula (I) are as defined in the specification, and the amount of the compound (C) of formula (I) is about 10 parts by weight to about 85 parts by weight per 100 parts by weight of the epoxy resin (A).

Abstract: A resin composition is provided. The resin composition comprises the following constituents: (A) an epoxy resin, which has at least two epoxy functional groups per molecule; (B) a reactive flame retardant with (a DOPO functional group) in structure; and (C) a non-reactive phosphorus-containing flame retardant, which is compatible with the other constituents of the resin composition.

Abstract: A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): wherein m, n, 1, R1, and R2 are as defined in the specification.

Abstract: An illumination device includes a supporting base, and a light-emitting element inserted in the supporting base. The light-emitting element includes a substrate having a supporting surface and a side surface, a light-emitting chip disposed on the supporting surface, and a first wavelength conversion layer covering the light-emitting chip and only a portion of the supporting surface without covering the side surface.

Abstract: An antenna structure includes a housing and a feeding source. The housing forms a radiating portion, a first coupling portion, and a second coupling portion. The first coupling portion and the second coupling portion are grounded. The feeding source is electrically connected to the radiating portion for feeding current to the radiating portion and divides the radiating portion into a first radiating section and a second radiating section. When the feeding source supplies current, the current flows through the first radiating section and is coupled to the first coupling portion to activate a first operation mode and a second operation mode. When the feeding source supplies current, the current flows through the second radiating section and is coupled to the second coupling portion to activate a third operation mode and a fourth operation mode.

Abstract: A resin composition is provided. The resin composition comprises the following components: (A) epoxy resin; (B) a cross-linking agent; (C) bismaleimide resin (BMI) represented by the following formula (I): wherein R1 is an organic group; and (D) a resin represented by the following formula (II): wherein n is an integer of 1 to 10.

Abstract: A resin composition is provided. The resin composition comprises an epoxy resin with at least two epoxy groups in each molecule, and a first hardener of the following formula (I): wherein R11, R12, R13, R14, R15, R16, and n are as defined in the specification.

Abstract: An illumination device includes a supporting base, and a light-emitting element inserted in the supporting base. The light-emitting element includes a substrate having a supporting surface and a side surface, a light-emitting chip disposed on the supporting surface, and a first wavelength conversion layer covering the light-emitting chip and only a portion of the supporting surface without covering the side surface.

Abstract: A resin composition is provided. The resin composition comprises an epoxy resin, a zinc oxide powder and a hardener, wherein the zinc oxide powder has a Mohs hardness ranging from about 4 to about 5 and a diameter ranging from about 0.1 ?m to about 50 ?m, and the amount of the zinc oxide powder is more than 0.5 parts by weight and less than 10 parts by weight per 100 parts by weight of the epoxy resin.

Abstract: An illumination device includes a supporting base, and a light-emitting element inserted in the supporting base. The light-emitting element includes a substrate having a supporting surface and a side surface, a light-emitting chip disposed on the supporting surface, and a first wavelength conversion layer covering the light-emitting chip and only a portion of the supporting surface without covering the side surface.

Abstract: A resin composition is provided. The resin composition comprises an epoxy resin (A) and a first hardener (B) of the following formula (I): wherein Ar, R and n are as defined in the specification, and the molar ratio of the epoxy group of the epoxy resin to the active functional group of the first hardener ranges from about 1:0.4 to about 1:1.6.