Abstract: A resin composition is provided. The resin composition comprises an epoxy resin (A) and a first hardener (B) of the following formula (I): wherein Ar, R and n are as defined in the specification, and the molar ratio of the epoxy group of the epoxy resin to the active functional group of the first hardener ranges from about 1:0.4 to about 1:1.6.

Abstract: An antenna module includes a holder, a first feed portion, a second feed portion, a first antenna unit, and a second antenna unit. The holder includes a top surface, an end surface, and a side surface. The first feed portion is positioned on the top surface. The second feed portion is positioned on the top surface and is spaced from the first feed portion. The first antenna unit is positioned on the top surface and the end surface, and is electrically connected to the first feed portion. The second antenna unit is spaced from the second antenna unit and is positioned on the top surface and the side surface. The second antenna unit is electrically connected to the second feed portion. The first feed portion and the second feed portion respectively feed current to the first antenna unit and the second antenna unit.

Abstract: An illumination device includes a supporting base, and a light-emitting element inserted in the supporting base. The light-emitting element includes a substrate having a supporting surface and a side surface, a light-emitting chip disposed on the supporting surface, and a first wavelength conversion layer covering the light-emitting chip and only a portion of the supporting surface without covering the side surface.

Abstract: An example method to prepare a prepreg is disclosed. In one embodiment, the method includes applying a mixture on a fibrous material and heating the mixture and the fibrous material to a temperature greater than about 225 degrees Celsius during a process of preparing the prepreg. The mixture includes an epoxy compound, a compound having a ring structure, and a crosslinking agent.

Abstract: An illumination device includes a supporting base, at least two supports and at least two semiconductor light emitting elements. The supports are disposed on the supporting base and coupled to each other. The semiconductor light emitting elements are respectively coupled to the supports. The semiconductor light emitting element includes a transparent substrate and a light emitting diode (LED) structure. The transparent substrate has a support surface and a second main surface disposed opposite to each other. The LED structure is disposed on the support surface. At least a part of the light emitted from the LED structure may pass through the transparent substrate and emerge from the second main surface.

Abstract: An antenna module includes a holder, a first feed portion, a second feed portion, a first antenna unit, and a second antenna unit. The holder includes a top surface, an end surface, and a side surface. The first feed portion is positioned on the top surface. The second feed portion is positioned on the top surface and is spaced from the first feed portion. The first antenna unit is positioned on the top surface and the end surface, and is electrically connected to the first feed portion. The second antenna unit is spaced from the second antenna unit and is positioned on the top surface and the side surface. The second antenna unit is electrically connected to the second feed portion. The first feed portion and the second feed portion respectively feed current to the first antenna unit and the second antenna unit.

Abstract: A component-positioning module comprises an elastic member, a plurality of fastening members, a plurality of adjustment elements and a positioning element. The elastic member is secured to a first component of the electronic device by the plurality of fastening members, and an operative portion of the elastic member is movable in a linear extension direction substantially perpendicular to an outer surface of the first component. The plurality of adjustment elements are secured between the elastic member and the first component by the fastening members respectively; the positioning element is combined with the operative portion to position a second component of the electronic device, and the positioning element at least partially protrudes from the outer surface. Manipulation of the plurality of fastening members deforms the plurality of adjustment elements and changes a distance of the positioning element protruding from the outer surface.

Abstract: A component-positioning module comprises an elastic member, a plurality of fastening members, a plurality of adjustment elements and a positioning element. The elastic member is secured to a first component of the electronic device by the plurality of fastening members, and an operative portion of the elastic member is movable in a linear extension direction substantially perpendicular to an outer surface of the first component. The plurality of adjustment elements are secured between the elastic member and the first component by the fastening members respectively; the positioning element is combined with the operative portion to position a second component of the electronic device, and the positioning element at least partially protrudes from the outer surface. Manipulation of the plurality of fastening members deforms the plurality of adjustment elements and changes a distance of the positioning element protruding from the outer surface.

Abstract: A prepreg is provided. The prepreg is prepared by immersing a reinforcing material into a resin composition and drying the immersed reinforcing material, wherein the resin composition has a first dielectric constant and comprises a thermosetting resin component, a hardener and a filler. The reinforcing material has a second dielectric constant, and the ratio of the first dielectric constant to the second dielectric constant ranges from 0.8 to 1.05.

Abstract: An actuating device of a wireless access point (WAP), the WAP includes a first module, a second module with a power requirement, and an actuating device. The WAP has a first voltage range and a second voltage range. The actuating device includes a switching unit and a voltage regulating unit. The switching unit receives an input voltage and has two output terminals. The switching unit outputs a first voltage via the first output terminal when the input voltage is within the first voltage range, and outputs a second voltage via the second output terminal when the input voltage is within the second voltage range. The voltage regulating unit is coupled to the output terminals to convert the second voltage to the first voltage. The second module is coupled to the second output terminal of the switching unit.

Abstract: An illumination device includes a supporting base, at least two supports and at least two semiconductor light emitting elements. The supports are disposed on the supporting base and coupled to each other. The semiconductor light emitting elements are respectively coupled to the supports. The semiconductor light emitting element includes a transparent substrate and a light emitting diode (LED) structure. The transparent substrate has a support surface and a second main surface disposed opposite to each other. The LED structure is disposed on the support surface. At least a part of the light emitted from the LED structure may pass through the transparent substrate and emerge from the second main surface.

Abstract: A resin composition is provided. The resin composition comprises an epoxy resin, a hardener, and a modifier, wherein the modifier is a polymer solution obtainable from the following steps: (a) dissolving an N,O-heterocyclic compound of Formula I or Formula II into a first solvent to form a first reaction solution: (b) heating the first reaction solution to a first temperature to carry out a ring-opening polymerization to provide a solution of ring-opening polymerized product; and (c) cooling the solution of ring-opening polymerized product to a second temperature to substantially terminate the ring-opening polymerization to obtain the polymer solution, wherein, the first solvent is unreactive to the N,O-heterocyclic compound; the first temperature is higher than the softening temperature of the N,O-heterocyclic compound and lower than the boiling point of the first solvent; and the second temperature is lower than the first temperature.

Abstract: An example method to prepare a prepreg is disclosed. In one embodiment, the method includes applying a mixture on a fibrous material and heating the mixture and the fibrous material to a temperature greater than about 225 degrees Celsius during a process of preparing the prepreg. The mixture includes an epoxy compound, a compound having a ring structure, and a crosslinking agent.

Abstract: A resin composition is provided. The resin composition comprises an epoxy resin and a hardener, wherein the amount of the hardener is about 10 parts by weight to about 200 parts by weight per 100 parts by weight of the epoxy resin and the hardener comprises a first styrene-maleic anhydride copolymer (SMA) copolymer and a second SMA copolymer, the first SMA copolymer has a molar ratio of styrene to maleic anhydride m1, the second SMA copolymer has a molar ratio of styrene to maleic anhydride m2, and m1?m2?3.

Abstract: A resin composition is provided. The resin composition comprises an epoxy resin, a first filler containing calcium carbonate and hydrated magnesium silicate and a hardener, wherein the first filler has a diameter ranging from about 0.1 ?m to about 100 ?m; and the amount of the first filler is about 1 part by weight to about 150 parts by weight per 100 parts by weight of the epoxy resin.

Abstract: A resin composition is provided. The resin composition comprises an epoxy resin, a zinc oxide powder and a hardener, wherein the zinc oxide powder has a Mohs hardness ranging from about 4 to about 5 and a diameter ranging from about 0.1 ?m to about 50 ?m, and the amount of the zinc oxide powder is more than 0.5 parts by weight and less than 10 parts by weight per 100 parts by weight of the epoxy resin.

Abstract: A stable solution of the polymer prepared from N,O-heterocyclic compound and its preparing method are provided, wherein the stable solution is prepared by making the N,O-heterocyclic compound of formulae I or II carry out a ring-opening polymerization: wherein R1 to R3, W1, W2, m, n, p and q are as defined in the specification. The stable solution can be used as a hardener for curing epoxy resin.

Abstract: Disclosed is an epoxy resin composition, which includes (A) an epoxy resin having at least two epoxy groups in one molecule; (B) a curing agent; and (C) polystyrene.

Abstract: An actuating device of a wireless access point (WAP), the WAP includes a first module, a second module with a power requirement, and an actuating device. The WAP has a first voltage range and a second voltage range. The actuating device includes a switching unit and a voltage regulating unit. The switching unit receives an input voltage and has two output terminals. The switching unit outputs a first voltage via the first output terminal when the input voltage is within the first voltage range, and outputs a second voltage via the second output terminal when the input voltage is within the second voltage range. The voltage regulating unit is coupled to the output terminals to convert the second voltage to the first voltage. The second module is coupled to the second output terminal of the switching unit.

Abstract: A fused filler and method for manufacturing the same are provided. The fused filler comprises about 50 wt % to about 60 wt % SiO2, about 10 wt % to about 20 wt % Al2O3, about 20 wt % to about 30 wt % B2O3 and about 1 wt % to about 5 wt % oxides of IA/IIA metals. The fused filler can be used in a resin composition for preparing prepregs and printed circuit boards.