Patents by Inventor Chih-Wei Tsai
Chih-Wei Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20160132384Abstract: A data reading method, a memory storage device and a memory controlling circuit unit are provided. The method includes: receiving a first read command; setting a plurality of first read events in a multi trigger queue (MTQ) according to the first read command, wherein the first read events include a general read event and at least one cache read event; sending a first read command sequence according to at least one of the first read events and receiving first data from a rewritable non-volatile memory module; and if a decoding for the first data fails, resetting the MTQ, and sending at least one second read command sequence according to at least one second read event in the reset MTQ, wherein the at least one second read event includes at least one of the at least one cache reading event.Type: ApplicationFiled: December 25, 2014Publication date: May 12, 2016Inventors: Hong-Lipp Ko, Chih-Wei Tsai, Kheng-Joo Tan
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Patent number: 9330044Abstract: A high-speed data transmission interface circuit used in a network switch device is provided. The high-speed data transmission interface circuit comprises a main circuit hoard, a connector and a daughter circuit board. The main circuit board comprises a transmission port interface module and a first wire. The transmission port interface module comprises a reduced pin extended attachment unit interface (RXAUI). The first wire connects the connector and the main circuit board. The daughter circuit board comprises a high definition multimedia interface (HDMI) module and a second wire. The HDMI module is connected to an external network device through a HDMI signal wire. The second wire connects the connector and the HDMI module. The transmission port interface module communicates with the external network device through the connector and the daughter board.Type: GrantFiled: May 23, 2013Date of Patent: May 3, 2016Assignee: ACCTON TECHNOLOGY CORPORATIONInventors: Chih-Wei Tsai, Shu-Jung Wu
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Patent number: 9263300Abstract: A method for manufacturing vias in a glass substrate includes bonding, through a bonding layer, a first face of the glass substrate including a plurality of holes to a first face of a glass carrier. The bonding layer has a thickness t between the first face of the glass substrate and the first face of the glass carrier and extends into at least some of the plurality of holes to a depth h from the first face of the glass substrate. The method includes etching back the bonding layer to a depth d through the plurality of holes in the glass substrate. The depth d is less than the sum of the thickness t and the depth h. The method can include filling the plurality of holes with an electrically conductive material, and de-bonding the glass substrate from the bonding layer and the glass carrier.Type: GrantFiled: April 29, 2015Date of Patent: February 16, 2016Assignee: Corning IncorporatedInventors: Chih-Wei Tsai, Bor Kai Wang
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Publication number: 20150318187Abstract: A method for manufacturing vias in a glass substrate includes bonding, through a bonding layer, a first face of the glass substrate including a plurality of holes to a first face of a glass carrier. The bonding layer has a thickness t between the first face of the glass substrate and the first face of the glass carrier and extends into at least some of the plurality of holes to a depth h from the first face of the glass substrate. The method includes etching back the bonding layer to a depth d through the plurality of holes in the glass substrate. The depth d is less than the sum of the thickness t and the depth h. The method can include filling the plurality of holes with an electrically conductive material, and de-bonding the glass substrate from the bonding layer and the glass carrier.Type: ApplicationFiled: April 29, 2015Publication date: November 5, 2015Inventors: Chih-Wei Tsai, Bor Kai Wang
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Publication number: 20150301431Abstract: A method of capturing images includes the following steps of: providing a camera module including an image capture unit, a liquid lens unit, and an image process unit; capturing a clear image through the camera module; enlarging the camera's relative aperture to create a shallow depth-of-field; adjusting the focal plane of the liquid lens unit to analyze object depth information in the clear image; and adding or storing the depth information of the object to the clear image.Type: ApplicationFiled: December 30, 2014Publication date: October 22, 2015Inventor: CHIH-WEI TSAI
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Publication number: 20150169934Abstract: A fingerprint reading system includes a camera module, a control module, and a signal processing module. The camera module has a detection unit, an image capture unit, a liquid lens unit, and an illumination unit. Control module is electrically connected to camera module for controlling the internal components of camera module. When the detection unit detects a start signal, the control module activates the image capture unit, liquid lens unit, and illumination unit. The liquid lens unit adjusts the focus distance across an entire scanning region and scans fingerprint. The image capture unit adjusts the focus distance across the entire scanning region through the liquid lens unit and scans fingerprint to capture multiple photos. The signal processing module selects the sharpest photo from the multiple photos to convert to a fingerprint image.Type: ApplicationFiled: December 17, 2014Publication date: June 18, 2015Inventor: CHIH-WEI TSAI
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Patent number: 9052451Abstract: A liquid lens package structure includes a first light-transmitting element, a second light-transmitting element, a first elastic surrounding body, a second elastic surrounding body and a package unit. The first elastic surrounding body is disposed between the first and the second light-transmitting elements to form an enclosed space among the first light-transmitting element, the second light-transmitting element and the first elastic surrounding body for receiving and enclosing two unmingled predetermined liquids. The second elastic surrounding body is disposed on the second light-transmitting element. The package unit includes a first retaining seat and a second retaining seat mated with each other. The first retaining seat has a first opening, and the second retaining seat has a second opening.Type: GrantFiled: June 3, 2013Date of Patent: June 9, 2015Assignee: Lustrous Electro-Optic Co., Ltd.Inventors: Chih-Wei Tsai, Jun-Yu Chung
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Publication number: 20140355128Abstract: A liquid lens package structure includes a first light-transmitting element, a second light-transmitting element, a first elastic surrounding body, a second elastic surrounding body and a package unit. The first elastic surrounding body is disposed between the first and the second light-transmitting elements to form an enclosed space among the first light-transmitting element, the second light-transmitting element and the first elastic surrounding body for receiving and enclosing two unmingled predetermined liquids. The second elastic surrounding body is disposed on the second light-transmitting element. The package unit includes a first retaining seat and a second retaining seat mated with each other. The first retaining seat has a first opening, and the second retaining seat has a second opening.Type: ApplicationFiled: June 3, 2013Publication date: December 4, 2014Inventors: CHIH-WEI TSAI, JUN-YU CHUNG
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Publication number: 20140307330Abstract: A liquid lenses driving method to control the focus of a liquid lens by inputting voltages to specific electrodes. The liquid lens includes a first liquid, a second liquid having a lower refractive index than and immiscible with the first liquid, a plurality of driving electrodes (M), an container, and a transparent cover. M is greater than or equal to 2. The first liquid is positioned above the plurality of electrodes. The electrodes are concentrically configured and annular in shape. The outermost electrode is a first electrode and the innermost electrode is an Mth electrode. Adjacent electrodes have opposite polarities. When a driving voltage is provided throughout the first electrode to the Nth electrode, a base circumference of the first liquid is displaced to an inner circumference of the Nth electrode. N is an integer greater than or equal to 1 and smaller than M.Type: ApplicationFiled: July 26, 2013Publication date: October 16, 2014Applicant: LUSTROUS ELECTRO-OPTIC CO., LTD.Inventor: CHIH-WEI TSAI
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Publication number: 20140300803Abstract: An image-capturing system for automatically adjusting divergence angle includes an image-capturing unit, an auxiliary lighting unit and a control unit. The image-capturing unit includes an image sensor and a zoom lens adjacent to the image sensor. The image sensor is applied to capture images of at least one body through the zoom lens, and the zoom lens has a first variable focus. The auxiliary lighting unit includes at least one light-emitting element for generating light beams and at least one electrically-controlled zoom lens module adjacent to the light-emitting element, and the electrically-controlled zoom lens module has a second variable focus. The light beams generated by the light-emitting element can pass through the electrically-controlled zoom lens module to form a projection light source that can be projected onto the body. The control unit includes a voltage controlling module electrically connected between the image-capturing module and the auxiliary lighting device.Type: ApplicationFiled: April 8, 2013Publication date: October 9, 2014Applicant: LUSTROUS ELECTRO-OPTIC CO., LTD.Inventors: CHIH-WEI TSAI, CHUNG-TA WU
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Publication number: 20140095756Abstract: A high-speed data transmission interface circuit used in a network switch device is provided. The high-speed data transmission interface circuit comprises a main circuit hoard, a connector and a daughter circuit board. The main circuit board comprises a transmission port interface module and a first wire. The transmission port interface module comprises a reduced pin extended attachment unit interface (RXAUI). The first wire connects the connector and the main circuit board. The daughter circuit board comprises a high definition multimedia interface (HDMI) module and a second wire. The HDMI module is connected to an external network device through a HDMI signal wire. The second wire connects the connector and the HDMI module. The transmission port interface module communicates with the external network device through the connector and the daughter board.Type: ApplicationFiled: May 23, 2013Publication date: April 3, 2014Applicant: ACCTON TECHNOLOGY CORPORATIONInventors: Chih-Wei TSAI, Shu-Jung WU
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Publication number: 20130335314Abstract: An intelligence reminding apparatus and a method thereof. The intelligence reminding method comprises: using an image capturing unit to preview a preview-image or capture a dynamic image; detecting at least one face image of the preview-image or the dynamic image to obtain a face image; recognizing the face image according to a face photo of a database which comprises at least one face photo and at least one corresponding information; acquiring the corresponding information if the face image matches the face photo. Wherein the face recognition is proceeding during the image preview or dynamic image capturing; reminding the corresponding information to users in a display mode, or reminding in a voice mode via a connected earphone or a connected voice apparatus if the connected earphone or the connected voice apparatus is detected.Type: ApplicationFiled: August 30, 2012Publication date: December 19, 2013Applicant: ALTEK CORPORATIONInventors: Wen-Yan Chang, Tai-Chang Yang, Hong-Long Chou, Chih-Wei Tsai
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Publication number: 20130128367Abstract: An electrode structure, applied to a liquid lens, comprises: a first annular body; a plurality of first connecting parts, connected to the first annular body and extended radially outward from the center of the first annular body; a second annular body; and a plurality of the second connecting parts, connected the second annular body and extended radially inward into the center of the second annular body. Wherein, the first annular body and the second annular body are on the same plane, the center of the first annular body is concentric with the center of the second annular body, the first connecting parts and the second connecting parts are mutually interlaced and arranged in circular permutation.Type: ApplicationFiled: June 8, 2012Publication date: May 23, 2013Applicant: NATIONAL TSING HUA UNIVERSITYInventors: Chih-Wei Tsai, Jer-Liang Yeh
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Patent number: 8332607Abstract: A non-volatile memory storage device has a non-volatile memory, e.g., a flash memory, and a controller coupled to the non-volatile memory. The controller comprises a plurality of control circuits and an arbitration circuit. Each control circuit is configured to generate a request to update the chip-enable (CE) signals for non-volatile memory, and the arbitration circuit is configured to determine when the requests are acknowledged. The arbitration circuit generates acknowledge signals to the control circuits when all of the requests of the control circuits have been received by the arbitration circuit. The CE signals for non-volatile memory are updated when requests are acknowledged.Type: GrantFiled: July 31, 2008Date of Patent: December 11, 2012Assignee: Skymedi CorporationInventors: Chih Wei Tsai, Chuang Cheng, Yung Li Ji, Shih Chieh Tai, Chih Cheng Tu, Fuja Shone
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Patent number: 8220144Abstract: A method for improving EBG (electromagnetic bandgap) structures is provided. First, a multi-layer board having at least one EBG unit is provided. Then, a maximum input impedance of the EBG unit under a predetermined frequency band is measured, in which a frequency corresponding to the maximum input impedance is a resonance frequency, and a capacitance is determined based on the resonance frequency. Besides, a minimum input impedance of the EBG unit is measured, and a logarithmic value corresponding to the maximum input impedance and a logarithmic value corresponding to the minimum input impedance are obtained so as to determine a resistance. Finally, an electronic device having the capacitance and the resistance is coupled to the EBG unit in parallel.Type: GrantFiled: November 18, 2008Date of Patent: July 17, 2012Assignee: ASUSTeK Computer Inc.Inventors: Chia-Hsing Chou, Chih-Wei Tsai
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Patent number: 8166228Abstract: A non-volatile memory system and a method for reading data therefrom are provided. The data comprises a first sub-data and a second sub-data. The non-volatile memory system comprises a first storage unit and a second storage unit, adapted for storing the two sub-data respectively. The first storage unit reads a first command from the controller, and stores the first sub-data temporarily as the first temporary sub-data according to the first command. The second storage unit reads a second command from the controller, and stores the second sub-data temporarily as the second temporary sub-data according to the second command. The first temporary sub-data is read from the first storage unit. Then, the first storage unit reads a third command from the controller. The second temporary sub-data is also read from the second storage unit while reading the third command. The time for reading data from the non-volatile memory system is reduced.Type: GrantFiled: May 14, 2008Date of Patent: April 24, 2012Assignee: SkyMedi CorporationInventors: Chuang Cheng, Satashi Sugawa, Chih-Wei Tsai, Wen-Lin Chang, Fu-Ja Shone
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Patent number: 7957141Abstract: A heat-dissipating mechanism includes a first heat-dissipating device, a first positioning device, a second heat-dissipating device and a second positioning device. The first heat-dissipating device is contacted with a memory module. The first positioning device is disposed on the first heat-dissipating device and includes a protrusion. The second heat-dissipating device is connected with the first heat-dissipating device. The second positioning device has a positioning rail formed in the second heat-dissipating device and corresponding to the protrusion. The second heat-dissipating device is connected with the first heat-dissipating device when the protrusion of the first positioning device is embedded into the positioning rail second positioning device.Type: GrantFiled: August 6, 2010Date of Patent: June 7, 2011Assignee: Asustek Computer Inc.Inventors: Chia-Hsing Chou, Chih-Wei Tsai, Chia-Hung Lu
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Patent number: 7880094Abstract: A positive differential signal trace and a negative differential signal trace are formed on different layers of a printed circuit board. A first ground trace is formed on the layer on which the positive differential signal trace is formed, and a second ground trace is formed on the layer on which the negative differential signal trace is formed. An insulation layer is positioned between the two layers and has a predetermined thickness. A differential mode impedance and a common mode impedance of differential signals are dependent on the predetermined thickness of the insulation layer, width and thickness of each differential signal trace, and a space between each differential signal trace and the corresponding ground trace formed on the same layer.Type: GrantFiled: April 26, 2007Date of Patent: February 1, 2011Assignee: ASUSTeK Computer Inc.Inventors: Cheng-Jan Chi, Wen-Cheng Ko, Sheng-Ming Chang, Chih-Wei Tsai
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Publication number: 20100302732Abstract: A heat-dissipating mechanism includes a first heat-dissipating device, a first positioning device, a second heat-dissipating device and a second positioning device. The first heat-dissipating device is contacted with a memory module. The first positioning device is disposed on the first heat-dissipating device and includes a protrusion. The second heat-dissipating device is connected with the first heat-dissipating device. The second positioning device has a positioning rail formed in the second heat-dissipating device and corresponding to the protrusion. The second heat-dissipating device is connected with the first heat-dissipating device when the protrusion of the first positioning device is embedded into the positioning rail second positioning device.Type: ApplicationFiled: August 6, 2010Publication date: December 2, 2010Applicant: ASUSTEK COMPUTER INC.Inventors: Chia-Hsing Chou, Chih-Wei Tsai, Chia-Hung Lu
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Patent number: 7791881Abstract: A heat-dissipating mechanism includes a first heat-dissipating device, a first positioning device, a second heat-dissipating device and a second positioning device. The first heat-dissipating device is contacted with a memory module. The first positioning device is disposed on the first heat-dissipating device and includes a protrusion. The second heat-dissipating device is connected with the first heat-dissipating device. The second positioning device has a positioning rail formed in the second heat-dissipating device and corresponding to the protrusion. The second heat-dissipating device is connected with the first heat-dissipating device when the protrusion of the first positioning device is embedded into the positioning rail second positioning device.Type: GrantFiled: May 19, 2009Date of Patent: September 7, 2010Assignee: Asustek Computer Inc.Inventors: Chia-Hsing Chou, Chih-Wei Tsai, Chia-Hung Lu