Patents by Inventor Chih-Wei Yang

Chih-Wei Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10672570
    Abstract: A keyswitch structure includes a base plate, a keycap, a first support, and a second support. The keycap is located above the base plate. The first support is connected to and between the keycap and the base plate and has an upper connection portion, a lower connection portion, and a protruding limitation portion. The upper connection portion is located between the lower connection portion and the protruding limitation portion. The first support is rotatably connected to the keycap and the base plate through the upper connection portion and the lower connection portion respectively. The protruding limitation portion is located close to and under the cap body. The second support is connected to and between the keycap and the base plate. The keycap moves up and down relative to the base plate through the first support and the second support.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: June 2, 2020
    Assignee: DARFON ELECTRONICS CORP.
    Inventors: Chih-Hao Chen, Po-Wei Tsai, Chun-Yuan Wang, Kuan-Te Lin, Shao-Wei Yang, Ling-Hsi Chao
  • Publication number: 20200168616
    Abstract: Well pick-up regions are disclosed herein for improving performance of memory arrays, such as static random access memory arrays. An exemplary integrated circuit (IC) device includes a circuit region; a first well pick-up (WPU) region; a first well oriented lengthwise along a first direction in the circuit region and extending into the first WPU region, the first well having a first conductivity type; and a second well oriented lengthwise along the first direction in the circuit region and extending into the first WPU region, the second well having a second conductivity type different from the first conductivity type, wherein the first well has a first portion in the circuit region and a second portion in the first WPU region, and the second portion of the first well has a width larger than the first portion of the first well along a second direction perpendicular to the first direction.
    Type: Application
    Filed: October 18, 2019
    Publication date: May 28, 2020
    Inventors: Chih-Chuan Yang, Chang-Ta Yang, Ping-Wei Wang
  • Patent number: 10658292
    Abstract: A semiconductor device or structure includes a first pattern metal layer disposed between a first supply metal tract and a second supply metal tract, the first pattern metal layer comprising an internal route and a power route. A follow pin couples the first supply metal to the power route. The second supply metal tract is wider than the first supply metal tract. The first supply metal tract has a thickness substantially same as the first pattern metal layer. The first supply metal tract comprises a first metal and a follow pin comprises a second metal.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: May 19, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Shih-Wei Peng, Chih-Liang Chen, Charles Chew-Yuen Young, Hui-Ting Yang, Jiann-Tyng Tzeng, Wei-Cheng Lin
  • Publication number: 20200134128
    Abstract: A method of designing a layout includes generating first routing tracks assigned to a first color group, generating second routing tracks assigned to a second color group, wherein a first routing track of the first routing tracks is between adjacent second routing tracks of the second routing tracks, and specifying a color stitching region connecting a selected first routing track of the first routing tracks with a selected second routing track of the second routing tracks of the layout, wherein the color stitching region represents a conductive region that connects a first conductive element represented by the selected first routing track with a second conductive element represented by the selected second routing track through an exposed portion of the selected first routing track, and wherein the exposed portion is at a removed portion of a sidewall structure surrounding the selected first routing track.
    Type: Application
    Filed: October 30, 2019
    Publication date: April 30, 2020
    Inventors: Shih-Wei PENG, Chih-Ming LAI, Hui-Ting YANG, Jiann-Tyng TZENG, Wei-Cheng LIN
  • Publication number: 20200126787
    Abstract: A method for lithography patterning includes depositing a target layer over a substrate, the target layer including an inorganic material; implanting ions into the target layer, resulting in an ion-implanted target layer; forming a photoresist layer directly over the ion-implanted target layer; and exposing the photoresist layer to radiation in a photolithography process. The ion-implanted target layer reduces reflection of the radiation back to the photoresist layer during the photolithography process.
    Type: Application
    Filed: December 19, 2019
    Publication date: April 23, 2020
    Inventors: Cheng-Han Yang, Tsung-Han Wu, Chih-Wei Chang, Hsin-mei Lin, I-Chun Hsieh, Hsi-Yen Chang
  • Publication number: 20200123307
    Abstract: A thermal-curable resin composition is provided. The thermal-curable resin composition comprises: (A) a thermal-curable resin component, which comprises: (a1) bismaleimide resin; (a2) cyanate ester resin; and (a3) epoxy resin, wherein the cyanate ester resin (a2) and the epoxy resin (a3) are respectively in an amount ranging from 50 parts by weight to 150 parts by weight and from 24 parts by weight to 51 parts by weight per 100 parts by weight of the bismaleimide resin (a1); and (B) a filler, wherein the filler (B) is in an amount ranging from 40 parts by weight to 55 parts by weight per 100 parts by weight of the dry weight of the resin composition; and wherein the resin composition has a dynamic viscosity of not higher than 800 Pa┬Ěs after being brought into a semi-cured state (B-stage), and the resin composition has a dissipation factor (Df) of not higher than 0.006 at 10 GHz after being cured completely.
    Type: Application
    Filed: January 17, 2019
    Publication date: April 23, 2020
    Inventors: JU-MING HUANG, CHEN-HUA YU, CHANG-CHIEN YANG, GUAN-SYUN TSENG, CHIH-WEI LIAO
  • Patent number: 10627855
    Abstract: A display device includes a backlight module, a rear casing, an outer bezel frame, and a panel module. The backlight module includes a back plate and a light emitting assembly disposed on the back plate for emitting light. The rear casing covers the backlight module. The outer bezel frame includes a bezel body, a first fixing portion and a second fixing portion. The first fixing portion and the second fixing portion are disposed on a rear side of the bezel body and spaced apart from each other in a lateral direction. The second fixing portion is located at a side of the first fixing portion away from the backlight module. The first fixing portion and the second fixing portion are respectively fixed to the back plate and the rear casing in the lateral direction. The panel module is fixed on a front side of the bezel body for displaying images.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: April 21, 2020
    Assignee: Wistron Corporation
    Inventors: Guo-Wei Huang, Wei-Chia Huang, Chih-Chou Chou, Yao-Chen Yang
  • Publication number: 20200116860
    Abstract: A proximity sensing device which is disposed under the OLED panel and has an emitting module and a receiving module, is provided. The emitting module can emit an invisible light which has a peak wavelength not less than 1000 nm. The receiving module is disposed adjacent to the emitting module and can receive a reflecting light from the reflected invisible light. Therefore, the invisible light passing through the OLED panel will not cause a bright spot on the panel.
    Type: Application
    Filed: March 25, 2019
    Publication date: April 16, 2020
    Applicant: Everlight Electronics Co., Ltd.
    Inventors: Shih-Wen Lai, Yi-Ting Huang, Jing-Hong Lai, Chih-Hao Hsu, Chia-Wei Yang, Chih-Min Lin, Chieh-Yu Kang, Kuang-Mao Lu, Jian-Hong Fan
  • Publication number: 20200110454
    Abstract: A system and method for compensating for voltage drops in a device having a remote node is disclosed. A power supply unit has an adjustable voltage output and a feedback circuit. A power path is coupled to the power supply unit to supply voltage to the remote node. A switch has an output coupled to the feedback circuit, a first input coupled to the power path, and a second input coupled to the remote node. A controller is coupled to the switch. The controller is operable to control the switch to switch between the inputs to cause the feedback circuit of the power supply unit to compensate the voltage output for a voltage drop on the power path or the remote node.
    Type: Application
    Filed: October 9, 2018
    Publication date: April 9, 2020
    Inventor: Chih-Wei YANG
  • Publication number: 20200099012
    Abstract: Display panel stack-up structures are described. In an embodiment, a display panel includes a substrate, a light source, and a multiple layer thin film encapsulation over the light source. In an embodiment, the display panel additionally includes an anti-reflection layer over the light source. In an embodiment, an incoherence layer is located within the thin film encapsulation.
    Type: Application
    Filed: June 21, 2019
    Publication date: March 26, 2020
    Inventors: Yifan Zhang, Amin Salehi, Yun Liu, Paul S. Drzaic, Tae-Wook Koh, Chih Jen Yang, Bhadrinarayana Lalgudi Visweswaran, Chieh-Wei Chen
  • Patent number: 10601184
    Abstract: A transmission wafer includes an insulating frame, a plurality of signal terminals each partially fixed in the insulating frame, and a shielding member fixed on the insulating frame. The insulating frame includes a front end portion and a bottom end portion both substantially perpendicular to each other, and the bottom end portion has a plurality of retaining structures. Each of the signal terminals includes a mounting segment protruding from the bottom end portion, and the shielding member includes a plurality of mounting portions each partially protruding from the bottom end portion. The mounting portions and the mounting segments are arranged in a row, and the mounting portions are respectively retained by the retaining structures of the insulating frame.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: March 24, 2020
    Assignee: STARCONN ELECTRONICS (SU ZHOU) CO., LTD
    Inventors: Chih-Wei Chen, Yueh-Lin Yang, Shin-Tai Ho, Yu-Hsiung Lin
  • Publication number: 20200083294
    Abstract: A resistive random access memory (RRAM) structure includes a resistive memory element formed on a semiconductor substrate. The resistive element includes a top electrode, a bottom electrode, and a resistive material layer positioned between the top electrode and the bottom electrode. The RRAM structure further includes a field effect transistor (FET) formed on the semiconductor substrate, the FET having a source and a drain. The drain has a zero-tilt doping profile and the source has a tilted doping profile. The resistive memory element is coupled with the drain via a portion of an interconnect structure.
    Type: Application
    Filed: November 11, 2019
    Publication date: March 12, 2020
    Inventors: Chin-Chieh Yang, Hsia-Wei Chen, Chih-Yang Chang, Kuo-Chi Tu, Wen-Ting Chu, Yu-Wen Liao
  • Publication number: 20200081482
    Abstract: A display device includes a backlight module, a rear casing, an outer bezel frame, and a panel module. The backlight module includes a back plate and a light emitting assembly disposed on the back plate for emitting light. The rear casing covers the backlight module. The outer bezel frame includes a bezel body, a first fixing portion and a second fixing portion. The first fixing portion and the second fixing portion are disposed on a rear side of the bezel body and spaced apart from each other in a lateral direction. The second fixing portion is located at a side of the first fixing portion away from the backlight module. The first fixing portion and the second fixing portion are respectively fixed to the back plate and the rear casing in the lateral direction. The panel module is fixed on a front side of the bezel body for displaying images.
    Type: Application
    Filed: December 19, 2018
    Publication date: March 12, 2020
    Inventors: Guo-Wei Huang, Wei-Chia Huang, Chih-Chou Chou, Yao-Chen Yang
  • Patent number: 10583123
    Abstract: The present invention relates to the area of ATG4-related disorders. More particularly, the present invention relates to a method of treating an ATG4B-related disorder comprising a step of administering a subject with an effective amount of tioconazole. The present invention relates also to a method of increasing a subject's responsiveness to a therapy for a cancer comprising inhibition of ATG4B activity in cells; said method comprises administering the subject with an effective amount of tioconazole. The present invention also relates to a method for enhancing or inducing a response in a cancer cell consisting of cytotoxicity, chemosensitivity or starvation-sensitivity; said method comprises administering a subject with an effective amount of tioconazole to inhibit ATG4B's activity.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: March 10, 2020
    Assignee: National Tsing Hua University
    Inventors: Lee-Wei Yang, Chih-Wen Shu, Pei-Feng Liu, Kun-Lin Tsai
  • Publication number: 20200069373
    Abstract: A navigation method for a medical operation and implemented by a robotic system is provided. The method includes the steps of: receiving, at a processor of the robotic system, at least one set of navigation data; receiving or generating at least one three-dimensional model of the virtual object in the navigation data; calculating the navigation data to generate a virtual environment and at least one navigation instruction; and presenting, at a user interface associated with the robotic system, the virtual environment and/or the navigation instruction to a user of the robotic system for the user to refer to during the medical operation.
    Type: Application
    Filed: September 5, 2018
    Publication date: March 5, 2020
    Inventors: SHOU-AN YU, BANG-HAO DAI, CHE-WEI SU, HAO-KAI CHOU, CHIA-HO YEN, CHIH-MIN YANG, SHYUE-CHERNG JUANG
  • Publication number: 20200066900
    Abstract: A semiconductor device and method of forming thereof includes a first fin and a second fin each extending from a substrate. A first gate segment is disposed over the first fin and a second gate segment is disposed over the second fin. An interlayer dielectric (ILD) layer is adjacent the first gate segment and the second gate segment. A cut region (e.g., opening or gap between first gate structure and the second gate structure) extends between the first and second gate segments. The cut region has a first portion has a first width and a second portion has a second width, the second width is greater than the first width. The second portion interposes the first and second gate segments and the first portion is defined within the ILD layer.
    Type: Application
    Filed: November 4, 2019
    Publication date: February 27, 2020
    Inventors: I-Wei YANG, Chih-Chang HUNG, Shu-Yuan KU, Ryan Chia-Jen CHEN, Ming-Ching CHANG
  • Publication number: 20200057524
    Abstract: A touch sensing device includes an amplifier, a charge measurer, and a comparator. The amplifier has an input terminal and an output terminal. The charge measurer is electrically connected to the input terminal of the amplifier, configured to measure a volume of charges on the input terminal of the amplifier with different measuring basis. The comparator is configured to compare an output voltage on the output terminal of the amplifier with a reference voltage.
    Type: Application
    Filed: July 9, 2019
    Publication date: February 20, 2020
    Inventors: Chun-Wei YANG, Chih-Hsiung CHEN, Yu-Chin HSU, Chih YUAN
  • Publication number: 20200058627
    Abstract: A package includes a first redistribution structure, a bridge structure, an adhesive layer, a plurality of conductive pillars, an encapsulant, a first die, and a second die. The bridge structure is disposed on the first redistribution structure. The adhesive layer is disposed between the bridge structure and the first redistribution structure. The conductive pillars surround the bridge structure. A height of the conductive pillars is substantially equal to a sum of a height of the adhesive layer and a height of the bridge structure. The encapsulant encapsulates the bridge structure, the adhesive layer, and the conductive pillars. The first die and the second die are disposed over the bridge structure. The first die is electrically connected to the second die through the bridge structure. The first die and the second die are electrically connected to the first redistribution structure through the conductive pillars.
    Type: Application
    Filed: August 14, 2018
    Publication date: February 20, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shing-Chao Chen, Ching-Hua Hsieh, Chih-Wei Lin, Sheng-Chieh Yang
  • Patent number: 10563006
    Abstract: A resin composition is provided. The resin composition comprises an epoxy resin (A) and a first hardener (B) of the following formula (I): wherein Ar, R and n are as defined in the specification, and the molar ratio of the epoxy group of the epoxy resin to the active functional group of the first hardener ranges from about 1:0.4 to about 1:1.6.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: February 18, 2020
    Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
    Inventors: Guan-Syun Tseng, Ju-Ming Huang, Tsung-Hsien Lin, Chang-Chien Yang, Chih-Wei Liao
  • Patent number: D879723
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: March 31, 2020
    Assignee: STARCONN ELECTRONIC (Su Zhou) Co., LTD
    Inventors: Chih-Wei Chen, Chung-Nan Pao, Yueh-Lin Yang, Yu-Hsiung Lin, Kai Wu