Patents by Inventor Chin Hung

Chin Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240097323
    Abstract: In some examples, a device can include an antenna to emit waves in a radiation pattern having a first beamwidth, a directional radiation control device located in a path of the waves, where the directional radiation control device is to receive the waves from the antenna and is shaped to cause the waves to be directed in a different radiation pattern having a second beamwidth that is larger than the first beamwidth.
    Type: Application
    Filed: September 15, 2022
    Publication date: March 21, 2024
    Inventors: Chin-Hung Ma, Pai-Cheng Huang, Po Chao Chen, Shih-Huang Wu
  • Patent number: 11935957
    Abstract: Semiconductor device structures having gate structures with tunable threshold voltages are provided. Various geometries of device structure can be varied to tune the threshold voltages. In some examples, distances from tops of fins to tops of gate structures can be varied to tune threshold voltages. In some examples, distances from outermost sidewalls of gate structures to respective nearest sidewalls of nearest fins to the respective outermost sidewalls (which respective gate structure overlies the nearest fin) can be varied to tune threshold voltages.
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Chiang Wu, Wei-Chin Lee, Shih-Hang Chiu, Chia-Ching Lee, Hsueh Wen Tsau, Cheng-Yen Tsai, Cheng-Lung Hung, Da-Yuan Lee, Ching-Hwanq Su
  • Patent number: 11935452
    Abstract: An electronic circuit for operating with a display panel including touch sensors and fingerprint sensors is provided. The electronic circuit includes a first circuit, a second circuit, a third circuit, a first switch circuit and a control circuit. The first circuit generates display driving signals for driving the display panel. The second circuit receives fingerprint sensing signals from the fingerprint sensors. The third circuit determines a touch information according to touch sensing signals from the touch sensors. The first switch circuit includes a plurality of first switch units, each of the first switch units includes a first switch element and a second switch element. The control circuit controls the first switch circuit to transmit the display driving signals in a first time interval, controls the first switch circuit to transmit the fingerprint sensing signals in a second time interval, and controls the third circuit to receive the fingerprint sensing signals in a third time interval.
    Type: Grant
    Filed: February 17, 2023
    Date of Patent: March 19, 2024
    Assignee: Novatek Microelectronics Corp.
    Inventors: Huan-Teng Cheng, Ting-Hsuan Hung, Tzu-Wen Hsieh, Wei-Lun Shih, Huang-Chin Tang
  • Publication number: 20240087974
    Abstract: An semiconductor package includes a redistribution structure, a first semiconductor device, a second semiconductor device, an underfill layer and an encapsulant. The first semiconductor device is disposed on and electrically connected with the redistribution structure, wherein the first semiconductor device has a first bottom surface, a first top surface and a first side surface connecting with the first bottom surface and the first top surface, the first side surface comprises a first sub-surface and a second sub-surface connected with each other, the first sub-surface is connected with the first bottom surface, and a first obtuse angle is between the first sub-surface and the second sub-surface.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Sheng Lin, Chin-Hua Wang, Shu-Shen Yeh, Chien-Hung Chen, Po-Yao Lin, Shin-Puu Jeng
  • Publication number: 20240088293
    Abstract: An n-type metal oxide semiconductor transistor includes a gate structure, two source/drain regions, two amorphous portions and a silicide. The gate structure is disposed on a substrate. The two source/drain regions are disposed in the substrate and respectively located at two sides of the gate structure, wherein at least one of the source/drain regions is formed with a dislocation. The two amorphous portions are respectively disposed in the two source/drain regions. The silicide is disposed on the two source/drain regions, wherein at least one portion of the silicide overlaps the two amorphous portions.
    Type: Application
    Filed: October 5, 2022
    Publication date: March 14, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chun-Ya Chiu, Ssu-I Fu, Chin-Hung Chen, Jin-Yan Chiou, Wei-Chuan Tsai, Yu-Hsiang Lin
  • Publication number: 20240084483
    Abstract: A liquid color masterbatch composition for fabricating a colored fiber includes 5 parts by weight to 45 parts by weight of a colorant, 40 parts by weight to 94 parts by weight of a carrier, and 1 part by weight to 15 parts by weight of a lubricant, in which a chemical structure of the lubricant includes a carbonyl group and an amine group.
    Type: Application
    Filed: February 6, 2023
    Publication date: March 14, 2024
    Inventors: Rih-Sheng CHIANG, Wei-Jen LAI, Huang-Chin HUNG
  • Publication number: 20240076084
    Abstract: A dehumidification device of a package thermal-shrinking oven includes at least one thermal-shrinking oven body for being combined with a packaging and conveying strip for conveying an object-to-be-packaged and having a lower portion that is provided with at least one pair of connecting portions, at least one steam conduit having a lower end connected with at least one steam device, at least one thermal isolation board mounted to an upper portion of interior of the steam conduit and enclosing two sides of the packaging and conveying strip, at least one pair of first heaters respectively mounted to two sides of exterior of the steam conduit, at least one second heater mounted to a bottom of interior of the steam conduit, and at least one pair of third heaters respectively mounted to two sides of exterior of the thermal-shrinking oven body.
    Type: Application
    Filed: August 25, 2023
    Publication date: March 7, 2024
    Inventor: TZU-CHIN HUNG
  • Patent number: 11921380
    Abstract: An electronic device is provided. The electronic device includes a working region and a non-working region adjacent to the working region. The electronic device includes a first substrate, a first photo spacer, a second photo spacer, and a plurality of third photo spacers. The first photo spacer is disposed on the first substrate in the working region and has a first thickness. The second photo spacer is disposed on the first substrate in the non-working region and has a second thickness. The plurality of third photo spacers are disposed on the first substrate. The first photo spacer is disposed between two of the plurality of third photo spacers. At least one of the plurality of third photo spacers has a third thickness. The first thickness is different from the second thickness, and the third thickness is less than the first thickness.
    Type: Grant
    Filed: November 28, 2022
    Date of Patent: March 5, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Tang-Chin Hung, Zhi-Fu Huang
  • Patent number: 11915855
    Abstract: A method to form a plurality of inductors in a single process by placing multiple coils on a first magnetic sheet, and then stacking magnetic layers on the first magnetic sheet to encapsulate the coils so as to from a large magnetic body, and then cutting the large magnetic body into multiple inductors, wherein a terminal part of the coil disposed on the bottom surface of the magnetic body of the inductor is extended away from the axis of the coil and is entirely located at a same side of the axis of the coil.
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: February 27, 2024
    Assignee: CYNTEC CO., LTD.
    Inventors: Chin Hung Wei, Min Lian Kuo, Chung Kai Liao
  • Patent number: 11901239
    Abstract: A semiconductor device includes a single diffusion break (SDB) structure dividing a fin-shaped structure into a first portion and a second portion, an isolation structure on the SDB structure, a first spacer adjacent to the isolation structure, a metal gate adjacent to the isolation structure, a shallow trench isolation (STI around the fin-shaped structure, and a second isolation structure on the STI. Preferably, a top surface of the first spacer is lower than a top surface of the isolation structure and a bottom surface of the first spacer is lower than a bottom surface of the metal gate.
    Type: Grant
    Filed: February 1, 2023
    Date of Patent: February 13, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chih-Kai Hsu, Ssu-I Fu, Chun-Ya Chiu, Chi-Ting Wu, Chin-Hung Chen, Yu-Hsiang Lin
  • Patent number: 11899419
    Abstract: An integrated control management system includes an input output device. The input output device includes a database, a memory module, a first processing module, and a second processing module. The memory module receives and stores a plurality of integrated control commands, and one of the integrated control commands is generated based on a hardware control command for setting a hardware control transmitted by another input and output device. The first processing module reads the integrated control command from the memory module and obtains the hardware control data from the integrated control command. The first processing module updates the hardware control data to the database. The second processing module reads the database and updates the hardware control data stored in the database to another database in another input output device. The second processing module sets the hardware control based on the hardware control data stored in the database.
    Type: Grant
    Filed: November 11, 2021
    Date of Patent: February 13, 2024
    Assignee: MITAC COMPUTING TECHNOLOGY CORPORATION
    Inventors: Heng-Chia Hsu, Chen-Yin Lin, Yu-Shu Yeh, Chien-Chung Wang, Chin-Hung Tan
  • Publication number: 20240048218
    Abstract: An example mobile computing device includes: an antenna capable of switching between a plurality of antenna patterns; an image sensor to capture image data representing an environment of the mobile computing device; a depth sensor to capture depth data representing the environment of the mobile computing device; a processor connected to the antenna, the image sensor and the depth sensor, the processor to: obtain the image data and the depth data; select a designated antenna pattern from the plurality of antenna patterns based on the image data and the depth data; and control the antenna to use the designated antenna pattern.
    Type: Application
    Filed: August 3, 2022
    Publication date: February 8, 2024
    Inventors: Chin-Hung Ma, Huai-Yung Yen, Kun-Jung Wu, Xin-Chang Chen, Hsiao Chun Su
  • Patent number: 11895236
    Abstract: A device which can be implemented on a single packaged integrated circuit or a multichip module comprises a plurality of non-volatile memory cells, and logic to use a physical unclonable function to produce a key and to store the key in a set of non-volatile memory cells in the plurality of non-volatile memory cells. The physical unclonable function can use entropy derived from non-volatile memory cells in the plurality of non-volatile memory cells to produce a key. Logic is described to disable changes to data in the set of non-volatile memory cells, and thereby freeze the key after it is stored in the set.
    Type: Grant
    Filed: January 17, 2023
    Date of Patent: February 6, 2024
    Assignee: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Chun-Hsiung Hung, Chin-Hung Chang
  • Publication number: 20240032236
    Abstract: A heat dissipation assembly is disclosed and includes a fan, a vapor chamber and a heat dissipation fin set. The fan includes a fan frame, an impeller and a fan cover. The impeller is disposed on the fan frame and accommodated in an accommodation space. The impeller includes plural metal blades and a hub, and the plural metal blades are radially arranged on the periphery of the hub to form a dense-metal-blade impeller. The fan cover is assembled with the fan frame to form an outlet, and the fan cover includes an inlet. The vapor chamber includes an upper plate and a lower plate assembled with each other. The upper plate or the lower plate is connected to the fan cover, and the vapor chamber and the fan cover are coplanar. The heat dissipation fin set is connected to the lower plate and spatially corresponding to the outlet.
    Type: Application
    Filed: November 7, 2022
    Publication date: January 25, 2024
    Inventors: Chin-Ting Chen, Chih-Wei Yang, Shu-Cheng Yang, Che-Wei Chang, Wen-Cheng Huang, Chin-Hung Lee, Chih-Wei Chan
  • Patent number: 11876099
    Abstract: An electronic device may include a display having an array of display pixels on a substrate. The display pixels may be organic light-emitting diode display pixels or display pixels in a liquid crystal display. In an organic light-emitting diode display, hybrid thin-film transistor structures may be formed that include semiconducting oxide thin-film transistors, silicon thin-film transistors, and capacitor structures. The capacitor structures may overlap the semiconducting oxide thin-film transistors. Organic light-emitting diode display pixels may have combinations of oxide and silicon transistors. In a liquid crystal display, display driver circuitry may include silicon thin-film transistor circuitry and display pixels may be based on oxide thin-film transistors. A single layer or two different layers of gate metal may be used in forming silicon transistor gates and oxide transistor gates. A silicon transistor may have a gate that overlaps a floating gate structure.
    Type: Grant
    Filed: January 18, 2023
    Date of Patent: January 16, 2024
    Assignee: Apple Inc.
    Inventors: Hiroshi Osawa, Kyung-Wook Kim, Ming-Chin Hung, Shih Chang Chang, Yu-Cheng Chen
  • Publication number: 20240006127
    Abstract: An electronic modulating device is provided. The electronic modulating device includes a first substrate, a second substrate, at least one working unit, and at least one adjustment structure. The first substrate includes a recess. The second substrate is disposed opposite to the first substrate. The at least one working unit includes a first cell gap and is disposed between the first substrate and the second substrate. The at least one working unit includes a modulating material. The at least one adjustment structure is disposed corresponding to the recess and includes a second cell gap and is disposed between the first substrate and the second substrate. The second cell gap is greater than the first cell gap.
    Type: Application
    Filed: September 19, 2023
    Publication date: January 4, 2024
    Inventors: Tang-Chin HUNG, Chih-Chiang HSIA
  • Publication number: 20230417258
    Abstract: A centrifugal fan is disclosed and includes a housing, a fan wheel, a first throat portion and a second throat portion. The housing includes a lower cover connected to an upper cover through a peripheral wall to form an accommodation space and an outlet. The upper cover includes an inlet communicated with the outlet. The fan wheel is disposed on the lower cover and accommodated in the accommodation space. The fan wheel is rotated along a rotation direction. The first throat portion is disposed adjacent to a lateral end of the outlet and protrudes from the peripheral wall toward the accommodation space. The second throat portion is disposed adjacent to another lateral end of the outlet, and protrudes from the peripheral wall toward the accommodation space. When the fan wheel is rotated along the rotational direction, an airflow is guided from the first throat portion to the second throat portion.
    Type: Application
    Filed: September 7, 2023
    Publication date: December 28, 2023
    Inventors: Chin-Hung Lee, Chih-Wei Chan, Ya-Ting Chang
  • Patent number: 11847467
    Abstract: A boot method for an embedded system is provided. The embedded system includes two mainboards each provided with a baseboard management controller (BMC), a non-volatile memory unit and a network adapter. When the embedded system is turned on, each of the BMCs performs a boot procedure, and then loads an operating system (OS) image file from a corresponding non-volatile memory unit to execute an operating system. When one BMC fails to load the OS image file or to execute the operating system, the BMC causes the corresponding network adapter to communicate with the other network adapter to acquire the OS image file from the non-volatile memory unit on the other mainboard, so as to replace the OS image file in the corresponding non-volatile memory unit, and directly loads the OS image thus acquired to execute the operating system.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: December 19, 2023
    Assignee: MITAC COMPUTING TECHNOLOGY CORPORATION
    Inventors: Yu-Shu Yeh, Heng-Chia Hsu, Chen-Yin Lin, Chien-Chung Wang, Chin-Hung Tan
  • Publication number: 20230386541
    Abstract: A memory device comprises an array of memory cells, a physically unclonable function PUF circuit in the memory device to generate a PUF code, a data path connecting a first circuit to a second circuit in the memory device coupled to the array of memory cells, and logic circuitry to encode data on the data path from the first circuit using the PUF code to produce encoded data, and to provide the encoded data to the second circuit.
    Type: Application
    Filed: August 8, 2023
    Publication date: November 30, 2023
    Applicant: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Chin-Hung CHANG, Chia-Jung CHEN, Ken-Hui CHEN, Kuen-Long CHANG
  • Patent number: 11817388
    Abstract: The disclosure provides an electronic apparatus. The electronic apparatus includes a substrate, a first metal layer, an insulating layer, a first conductor, an electronic assembly and a transistor circuit die. The first metal layer is disposed on the substrate. The insulating layer is disposed on the substrate. The first conductor is formed in a first via of the insulating layer. The electronic assembly is disposed on the substrate and electrically connected to the first metal layer through the first conductor. The transistor circuit die is electrically connected to the first metal layer.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: November 14, 2023
    Assignee: Innolux Corporation
    Inventors: Tang Chin Hung, Chin-Lung Ting, Chung-Kuang Wei, Ker-Yih Kao, Tong-Jung Wang, Chih-Yung Hsieh, Hao Jung Huang, I-Yin Li, Chia-Chi Ho, Yi Hung Lin, Cheng-Hsu Chou, Chia-Ping Tseng