Heat dissipating module
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Description
Claims
The ornamental design for a heat dissipating module, as shown and described herein.
Referenced Cited
U.S. Patent Documents
6407919 | June 18, 2002 | Chou |
D501450 | February 1, 2005 | Watanabe et al. |
7221567 | May 22, 2007 | Otsuki et al. |
20020182068 | December 5, 2002 | Liu |
20050141992 | June 30, 2005 | Lin |
20050271506 | December 8, 2005 | Pan |
20050280992 | December 22, 2005 | Carter et al. |
20060067053 | March 30, 2006 | Yu et al. |
20060219386 | October 5, 2006 | Hsia et al. |
Patent History
Patent number: D561120
Type: Grant
Filed: Sep 28, 2006
Date of Patent: Feb 5, 2008
Assignee: Delta Electronics, Inc. (Taoyuan Hsien)
Inventors: Chin-Ming Chen (Taoyuan Hsien), Yuhsien Lin (Taoyuan Hsien), Tsung-Lin Chen (Taoyuan Hsien), Alex Hsia (Taoyuan Hsien)
Primary Examiner: Selina Sikder
Attorney: Birch, Stewart, Kolasch & Birch, LLP
Application Number: 29/266,730
Type: Grant
Filed: Sep 28, 2006
Date of Patent: Feb 5, 2008
Assignee: Delta Electronics, Inc. (Taoyuan Hsien)
Inventors: Chin-Ming Chen (Taoyuan Hsien), Yuhsien Lin (Taoyuan Hsien), Tsung-Lin Chen (Taoyuan Hsien), Alex Hsia (Taoyuan Hsien)
Primary Examiner: Selina Sikder
Attorney: Birch, Stewart, Kolasch & Birch, LLP
Application Number: 29/266,730
Classifications
Current U.S. Class:
Heat Sink (D13/179)