Heat dissipating module

- Delta Electronics, Inc.
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Description

FIG. 1 is a perspective view of a heat dissipating module;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a right side elevational view thereof; and,

FIG. 7 is a left side elevational view thereof.

Claims

The ornamental design for a heat dissipating module, as shown and described herein.

Referenced Cited
U.S. Patent Documents
6407919 June 18, 2002 Chou
D501450 February 1, 2005 Watanabe et al.
7221567 May 22, 2007 Otsuki et al.
20020182068 December 5, 2002 Liu
20050141992 June 30, 2005 Lin
20050271506 December 8, 2005 Pan
20050280992 December 22, 2005 Carter et al.
20060067053 March 30, 2006 Yu et al.
20060219386 October 5, 2006 Hsia et al.
Patent History
Patent number: D561120
Type: Grant
Filed: Sep 28, 2006
Date of Patent: Feb 5, 2008
Assignee: Delta Electronics, Inc. (Taoyuan Hsien)
Inventors: Chin-Ming Chen (Taoyuan Hsien), Yuhsien Lin (Taoyuan Hsien), Tsung-Lin Chen (Taoyuan Hsien), Alex Hsia (Taoyuan Hsien)
Primary Examiner: Selina Sikder
Attorney: Birch, Stewart, Kolasch & Birch, LLP
Application Number: 29/266,730
Classifications
Current U.S. Class: Heat Sink (D13/179)