Abstract: Method for increasing the moisture-proof capability of a chip includes coating moisture-proof glue at the chink of the chip. More particularly, when the packaging structure carries a chink exposed to outside of the chip, the chink is coated with the moisture-proof glue for preventing moisture from entering the internal part of the chip so as to increase the moisture-proof capability of the chip.

Abstract: A semiconductor substrate has a plurality of active device patterns. At least some of the active device patterns comprise doped regions. The substrate has a plurality of surface regions, including the active device patterns and un-patterned regions, with respectively different reflectances for light in a near infrared wavelength. A first difference is determined, between a largest reflectance at the near infrared wavelength and a smallest reflectance at the near infrared wavelength. A second infrared wavelength is determined, for which a second difference between a largest reflectances a smallest reflectance is substantially less than the first difference at the near infrared wavelength. A rapid thermal processing (RTP) spike annealing dopant activation step is performed on the substrate using a second light source providing light at the second wavelength.

Abstract: A wafer container includes a container body, a door, and a purging valve, wherein the purging valve is disposed in the through hole of the container body. The purging valve includes a fixed sleeve body, a purging head, an elastic component, and a valve lid. The fixed sleeve body comprises a base, and a lower opening is formed at the center of the base for the purging head to be disposed therein. The purging head comprises a bottom portion and a hollow sleeve portion protruding upward from the bottom portion, wherein the hollow sleeve portion is surroundingly disposed with elastic component and with vent disposed on its circumference wall. The valve lid is disposed on top of the hollow sleeve portion so that the purging head can move from the first position to the second position inside the fixed sleeve body when being propped up by an upward force.

Abstract: A reticle pod, comprising an upper cover having a first accommodating space and a lower cover having a second accommodating space, a third accommodating space being formed after the upper cover and the lower cover close together, wherein the characteristic of the reticle pad is in that: the reticle pod includes a plurality of supporting pieces respectively and suspendingly disposed at each corner of the inner surfaces of the upper cover and of the lower cover, and two ends of each of the plurality of supporting pieces are respectively connected to two neighboring sides of corner of the inner surface to form a closed sheet body and a gap is formed at the bend of the closed sheet body.

Abstract: A reticle pod, comprising an upper cover having a first accommodating space and a lower cover having a second accommodating space, a third accommodating space being formed after the upper cover and the lower cover close together, wherein the characteristic of the reticle pad is in that: the reticle pod includes a plurality of supporting pieces respectively and suspendingly disposed at each corner of the inner surfaces of the upper cover and of the lower cover, and two ends of each of the plurality of supporting pieces are respectively connected to two neighboring sides of corner of the inner surface to form a closed sheet body and a gap is formed at the bend of the closed sheet body.

Abstract: The present invention provides a storage apparatus for storing a semiconductor element or a reticle. The storage apparatus comprises a first cover, a second cover and a flange. The first cover has a top and a plurality of laterals around the top. The second cover is for being assembled with the first cover to form an inner space for accommodating the reticle. As to the flange, it is provided on the first cover for being mechanically held and placed. The characteristic of the disclosed storage apparatus is that the flange and the first cover are integrally formed.

Abstract: A wafer container includes a container body, the internal of which is disposed with a plurality of slots for supporting a plurality of wafers and an opening is formed on one sidewall of which for importing and exporting said plurality of wafers, and a door with an inner surface, which is joined with opening of the container body with the inner surface for protecting the plurality of wafers in the container body, the characteristic in that: at least one restraint module is disposed on the inner surface of the door, the restraint module including a base which is disposed with a plurality of restraints arranged at intervals and an opening, and a snap-fitting piece is disposed on the inner surface of the door for snap-fitting the restraint module by passing the snap-fitting piece through the opening of the base of restraint module and rotating the restraint to an angle.

Abstract: A wafer container includes a container body, the internal of which is disposed with a plurality of slots for supporting a plurality of wafers and an opening is formed on one sidewall of which for importing and exporting said plurality of wafers, and a door with an outer surface and an inner surface, which is joined with opening of the container body with its inner surface for protecting the plurality of wafers in the container body, the characteristic in that: a recess is integrated with the inner surface of the door for separating the inner surface into two platforms, a restraint module is formed respectively on each of two platforms, and each restraint module includes a base which is disposed with a plurality of notches arranged at interval for contacting said plurality of wafers.

Abstract: A wafer container includes a container body, which is disposed with a plurality of slots for supporting a plurality of wafers and an opening is formed on one sidewall of which for importing and exporting the plurality of wafers, and a door with an outer surface and an inner surface, which is assembled with opening of the container body with its inner surface for protecting the plurality of wafers within the container body, the characteristic in that: at least one latch component is disposed in the door, which includes an oval cam, a pair of moving bars contacting two ends of the oval cam, at least one roller disposed in the door and fixed in a slide groove of the moving bars, and at least one locating spring being an integral part of the moving bars.

Abstract: A wafer container includes a container body that having an open front on sidewall, a plurality of slots disposed in the container body for support wafers, and a door is assembled with opening of the container body for protecting the wafer therein, the characteristic in that: an recess is disposed in the inner surface, and a wafer restraint modules on the sides of the recess. The wafer restraint module includes a base portion for fixing the wafer restraint module on the platform, and a plurality of curve portions is formed on the side of the platform, in which each curve portion and the free ends constructed the protruding portion, thereby, the guiding notch of the protruding portion contacted the wafer to restrict the wafer from moving.

Abstract: A wafer container includes a container body with an opening on one side, and the inside with slots for placing the wafers. The door joined with the opening of the container body to protect the wafer therein, the characteristic in that: two rows of the plurality of wafer restraint components with a spaced at interval is located on the inner surface of the door and adjacent to the central of the door, in which the each wafer restraint component includes a base portion, which one end is fixed on the inner surface of the door, and another end is joined with a bent arm. The bent arm includes a first contact head and a second contact head to restrict the wafer moving toward the opening of the door.

Abstract: The present invention provides a storage apparatus for storing a semiconductor element or a reticle. The storage apparatus comprises a first cover, a second cover and a flange. The first cover has a top and a plurality of laterals around the top. The second cover is for being assembled with the first cover to form an inner space for accommodating the reticle. As to the flange, it is provided on the first cover for being mechanically held and placed. The characteristic of the disclosed storage apparatus is that the flange and the first cover are integrally formed.

Abstract: A wafer container includes a container body that having a plurality of slots therein for placing a plurality of wafers; an opening is formed on a sidewall of the container body for importing or exporting the wafers; and a door having an inner surface and an outer surface, in which the inner surface of the door is joined with the opening of the container body for protecting the plurality of wafers therein, the characteristic in that: a recess is disposed in the central portion of the inner surface of the door to divide the inner surface into two platforms, and each restraint module is located on two platforms.

Abstract: A method for preparing the low carbon number petrochemical products along with the high energy fuels from pyrolysis gasoline is provided. In this method, the pyrolysis gasoline is used as feedstock, and the reactive non-aromatic, unsaturated moieties, and the sulfur impurity contained in the pyrolysis gasoline are removed. Then the stabilized feedstock is used to produce C5 olefins, C6-C9 aromatic hydrocarbons as petrochemical products, and C10+ hydrocarbons as precursors of high energy fuels. Upon acid catalytic isomerization, or upon crystallization followed by acid catalytic isomerization, the C10+ hydrocarbons as precursors of high energy fuels are converted to exo-isomers as high energy fuels.