Patents by Inventor Chin-To Chen

Chin-To Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230055687
    Abstract: A nail drive device of electric nail gun includes a nailing rod and a rotary actuator that can output a specific rotation angle and can drive the nailing rod to move downward for nailing. Specifically, the rotary actuator includes a stator and a rotor surrounding it, between the stator and the rotor, even groups of electro-magnetic mutual action components are configured in pairs, to generate a tangential force to drive the rotor to rotate for a specific rotation angle, and to drive the nailing rod to move for a nailing stroke. The nailing stroke can be determined by the specific rotation angle. Thus, through the above configuration of the rotary actuator, the structure of the electric nail gun can be simplified.
    Type: Application
    Filed: June 23, 2022
    Publication date: February 23, 2023
    Inventors: I-TSUNG WU, CHIA-SHENG LIANG, ZHEN-LIANG LIAO, WEN-CHIN CHEN
  • Patent number: 11537347
    Abstract: A method may include receiving, via a processor, a frame of image data, such that the frame of image data may include an active portion and an idle portion. The active portion may include data for presenting one or more images via a first display of a first electronic device. The method may also include receiving a signal from a second electronic device during the idle portion of the frame of image data, such that the second electronic device is separate from the first display. The method may then involve initiating processing of the frame of image data in response to the signal being received from the second electronic device.
    Type: Grant
    Filed: January 13, 2021
    Date of Patent: December 27, 2022
    Assignee: Apple Inc.
    Inventors: Assaf Menachem, Peter F. Holland, Yung-Chin Chen
  • Publication number: 20220407156
    Abstract: The present invention discloses a flame-retardant and explosion-proof battery pack for an electric vehicle and a manufacturing method thereof, the battery pack comprising: at least one battery brick consisting of batteries, which are electrically connected to define a positive electrode welding sheet and a negative electrode welding sheet; a battery brick positive electrode conducting wire and a battery brick negative electrode conducting wire, which are electrically connected to the positive electrode welding sheet and the negative electrode welding sheet, respectively; and a cover and a battery of brick container, which define a first storage space that is sufficient to accommodate the batteries, wherein the first storage space is filled with a flame-retardant oil so that the batteries are immersed in the flame-retardant oil, and the positive electrode conducting wire and the negative electrode conducting wire are exposed outside the first storage space to form a battery brick assembly.
    Type: Application
    Filed: February 2, 2022
    Publication date: December 22, 2022
    Inventor: SHU-CHIN CHEN
  • Publication number: 20220402106
    Abstract: A bolt extractor structure includes: a main body, including a base plate, first wall, and second wall, both sides of the base plate vertically combined with the first wall and second wall, the first wall and second wall respectively provided with an opposite first shaft hole, each of the shaft holes provided with a first shaft, the first wall and second wall respectively having a first recess and second recess, and the first recess provided with an abutting element; and a hook body, one end thereof having a through hole, the first shaft passed through the through hole, another end of the hook body having a hooking portion.
    Type: Application
    Filed: June 17, 2021
    Publication date: December 22, 2022
    Inventors: PAI-CHIN CHEN, SHIUE-CHIAU LIU
  • Publication number: 20220392761
    Abstract: A method for grinding a silicon carbide wafer includes the following steps. Firstly, a single crystal is sliced into several wafers, in which each wafer has a silicon-side surface, which is the first surface. The opposite side is a carbon-side surface, which is the second surface. Subsequently, the silicon-side of the wafer is faced down and placed on a grinding stage for performing a first grinding process. It should be noted that a supporting structure exist between the wafer and the grinding stage. The supporting structure can have a concave or a convex framework. After grinding the carbon-side and removing the wafer from the stage, the wafer will appear convex or concave shape on the carbon-side surface. Thereafter, the wafer is flipped upside down and the carbon-side is placed on a flat stage without any supporting structure. Finally, the silicon-side is ground as a second grinding process.
    Type: Application
    Filed: May 4, 2022
    Publication date: December 8, 2022
    Applicant: GlobalWafers Co., Ltd.
    Inventor: Chin Chen Chiu
  • Patent number: 11513858
    Abstract: The present application reveals a system for computing and a method for arranging nodes thereof, which is applied for a remote host connected with a plurality of computing nodes divided to a plurality of first nodes and second nodes due to a first computing mode and a second computing mode. After the remote host receives a job, the remote host evaluates the computing nodes in accordance with the job and a corresponding priority weight parameter to generate a job beginning data to set the first nodes or the second nodes and to proceed the job. While setting the first or the second nodes, the remote host provides the corresponding system image to the corresponding nodes; while the first or the second nodes are full in resource arrangement, the empty nodes will be converted to the supplement nodes with the corresponding system image from the remote host.
    Type: Grant
    Filed: December 2, 2020
    Date of Patent: November 29, 2022
    Assignee: National Applied Research Laboratories
    Inventors: Chin-Chen Chu, Hung-Fu Lu, Jheng Yu Chen, San-Liang Chu, August Chao
  • Publication number: 20220356570
    Abstract: Methods and systems for dry cleaning a semiconductor processing reaction chamber are disclosed herein. In some embodiments, a method for cleaning a semiconductor processing reaction chamber includes: performing a plasma-assisted cleaning process to clean tube deposits formed on an inner surface of the deposition reaction chamber, the plasma-assisted cleaning process comprises: providing a first reactant gas to a remote plasma source chamber to generate a plasma, wherein the plasma comprising a fluorine-containing radical; and providing the plasma from the remote plasma source chamber to the deposition reaction chamber to clean the tube deposits, and performing a chemical cleaning process by providing a second reactant gas to the deposition reaction chamber after performing the plasma dry cleaning process.
    Type: Application
    Filed: July 22, 2022
    Publication date: November 10, 2022
    Inventors: Eddy LAY, Shun-Chin CHEN, Shih-Fang CHEN
  • Patent number: 11482717
    Abstract: A dehydrogenation method for hydrogen storage materials, which is executed by a fuel cell system. The fuel cell system includes a hydrogen storage material tank, a heating unit, a fuel cell, a pump, a water thermal management unit and a heat recovery unit. The described dehydrogenation method utilizes the heating unit and the heat recovery unit to provide thermal energy to the hydrogen storage material tank, so that hydrogen storage material is heated to the dehydrogenation temperature. The pump extracts hydrogen from the hydrogen storage material tank, so that the hydrogen storage material is under negative pressure (i.e. H2 absolute pressure below 1 atm), according to which the hydrogen storage material is dehydrogenated, and the dehydrogenation efficiency and the amount of hydrogen release are improved. The method n can reduce the dehydrogenation temperature of the hydrogen storage material, and reduce the thermal energy consumption for heating the hydrogen storage material.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: October 25, 2022
    Inventors: Chia-Chieh Shen, Shih-Hung Chan, Fang-Bor Weng, Ho Chun Cheung, Yi-Hsuan Lin, Mei-Chin Chen, Jyun-Wei Chen, Ya-Che Wu, Han-Wen Liu, Kuan-Lin Chen, Jin-Xun Zhang
  • Publication number: 20220337799
    Abstract: In one embodiment, a system includes a first device rendering image data, a second device storing the image data, and a display panel that displays the image data stored in the memory. The first device renders multiple frames of the image data, compresses the multiple frames into a single superframe, and transports the single superframe. The second device receives the single superframe, decompresses the single superframe into the multiple frames of image data, and stores the image data on a memory of the second device.
    Type: Application
    Filed: April 19, 2021
    Publication date: October 20, 2022
    Inventors: Yung-Chin Chen, Michael Bekerman, Guy Côté, Aleksandr M. Movshovich, D. Amnon Silverstein, David R. Pope
  • Publication number: 20220336203
    Abstract: A fabrication method of a semiconductor substrate includes: performing a chemical mechanical polishing process on a silicon carbide wafer; and performing a heating process on the silicon carbide wafer to remove a naturally formed oxide layer, to remove contaminants, to obtain a scratch-free surface, and to planarize, wherein the heating process includes: heating a chamber of a furnace and the silicon carbide wafer to T degrees Celsius for a time t, and introducing hydrogen, argon, nitrogen, or/and hydrogen chloride into the chamber; and then cooling down the furnace.
    Type: Application
    Filed: April 6, 2022
    Publication date: October 20, 2022
    Applicant: GlobalWafers Co., Ltd.
    Inventors: Chin Chen Chiu, Hao-Wei Peng
  • Patent number: 11468556
    Abstract: This inventions provides an artificial intelligence (A.I.) identified measuring method for a semiconductor image, comprising the steps of: providing an original image of a semiconductor; identifying a type and/or a category of the original image by an artificial intelligence; introducing a predetermined dimension measuring mode corresponding to the identified type and/or the identified category to scan the original image to generate a measurement signal of the original image; and extracting a designated object from the original image to generate a specific physical parameter of the original image after operation based on a measurement signal of the designated object and the measurement signal of the original image.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: October 11, 2022
    Assignee: MSSCORPS CO., LTD.
    Inventors: Chi-Lun Liu, Jung-Chin Chen, Bang-Hao Huang, Chao-Wei Chen
  • Publication number: 20220316493
    Abstract: A cooling fan includes a hub, a plurality of blades, and a plurality of flow disturbing elements. The blades are arranged on a peripheral surface of the hub; each of the blades has a leading edge and a trailing edge opposite to the leading edge, and each of the blades has at least one flow disturbing element arranged at the trailing edge. Each of the flow disturbing elements includes an engaging part and an extending part opposite to the engaging part; the engaging part of each of the flow disturbing elements is connected to the trailing edge of the corresponding blade, and the extending part of each of the flow disturbing elements extends outwardly toward a direction away from the trailing edge of the corresponding blade.
    Type: Application
    Filed: April 1, 2022
    Publication date: October 6, 2022
    Applicant: Acer Incorporated
    Inventors: Cheng-Wen Hsieh, Wen-Neng Liao, Kuang-Hua Lin, Wei-Chin Chen
  • Publication number: 20220316111
    Abstract: A woven brushed elastic fabric includes a fabric blank and a plurality of yarn segments. The fabric blank is formed by interweaving a plurality of first yarns and composite yarns. Each composite yarn is composed of a second yarn and an elastic yarn. The second yarn is wound around the elastic yarn. The fabric blank has a first side, and a second side opposite to the first side and formed with a plurality of yarn loops. The yarn loops are formed by the interweaving of the first yarns and the composite yarns in a skip manner along a first direction or a second direction transverse to the first direction. The yarn segments are formed on the second side of the fabric blank by breaking at least some of the yarn loops.
    Type: Application
    Filed: June 17, 2022
    Publication date: October 6, 2022
    Inventors: Kuo-Chin CHEN, Sung-Yun HUANG, Chia-Cheng CHOU, Chih-Wei CHEN, Li-Hsun CHANG
  • Patent number: 11454249
    Abstract: A heat dissipation fan including a housing, a hub, and a plurality of blades is provided. The hub is rotatably disposed in the housing. The blades are disposed at a surrounding edge of the hub to be rotated with the hub. When the heat dissipation fan is operated, at least one flow path is formed by two adjacent blades, and the flow path has a reduction section away from the hub.
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: September 27, 2022
    Assignee: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wei-Chin Chen, Cheng-Wen Hsieh, Wen-Neng Liao
  • Patent number: 11435237
    Abstract: The invention provides a temperature sensing device of an integrated circuit. The integrated circuit includes a plurality of stacked metal wire layers, and the temperature sensing device includes a first metal sheet, a first via and a second via. The first metal sheet is disposed between the first metal wire layer and the second metal wire layer of the metal wire layers. The first via and the second via are used to connect the first metal sheet and the first metal wire layer, wherein a temperature sensing signal enters the first metal sheet through the first via and leaves the first metal sheet through the second via to measure the temperature of the integrated circuit.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: September 6, 2022
    Assignee: ITE Tech. Inc.
    Inventors: Yi-Chung Chou, Yu-Chin Chen, Tzu-I Huang
  • Patent number: 11429124
    Abstract: A voltage generation device and a voltage generation method are provided. The voltage generation device includes a first voltage generator, a second voltage generator, a third voltage generator and an output voltage generator. The first to third voltage generators respectively generate first to third voltages. The output voltage generator generates an output voltage at an output end according to the first voltage, the second voltage and the third voltage. When the output voltage is converted between the first voltage and the second voltage, during a first time period, the first voltage generator provides the first voltage to a first capacitor, and the third voltage generator causes the output voltage to change from the second voltage to the third voltage. During a second time period, the first voltage generator and the first capacitor cause the output voltage to change from the third voltage to the first voltage.
    Type: Grant
    Filed: November 3, 2021
    Date of Patent: August 30, 2022
    Assignee: ITE Tech. Inc.
    Inventors: Yi-Chung Chou, Yu-Chin Chen, Chih-Yuan Kuo
  • Patent number: 11431085
    Abstract: An antenna structure with wide radiation bandwidth in a reduced physical space includes a housing, a connection capacitor, and a feed portion. The housing defines at least one gap and a slot dividing the housing into a first radiation portion, a second radiation portion, and a third radiation. The connection capacitor bridges the first gap, connecting the first radiation portion and the second radiation portion. The feed portion is electrically connected to the first radiation portion. The current flows through the first radiation portion and towards the second radiation portion through the connection capacitor. The current is further coupled to the third radiation portion to generate radiation signals in different frequency bands.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: August 30, 2022
    Assignee: Chiun Mai Communication Systems, Inc.
    Inventors: Yung-Chin Chen, Yi-Chieh Lee, Kun-Lin Sung
  • Patent number: 11422336
    Abstract: The disclosure proposes a projection lens including a first lens group, a second lens group and a third lens group arranged in sequence along an optical axis from a magnification side to a reduction side. The first lens group includes a plurality of lenses having refractive power. The second lens group includes at least one lens having refractive power. The third lens group includes a diaphragm, and a plurality of lenses having refractive power, wherein an intermediate image is formed between the first and third lens groups, and the refractive powers of the first, second and third lens groups are positive, positive, and positive, respectively. A projection device including the above projection lens is also proposed.
    Type: Grant
    Filed: September 3, 2020
    Date of Patent: August 23, 2022
    Assignee: Coretronic Corporation
    Inventors: Ching-Chuan Wei, Yi-Chin Chen
  • Publication number: 20220234181
    Abstract: A pair of stamping pliers for stamping and bonding includes a first handle, a second handle and a stamping nail. The first handle and the second handle are staggered, pivotally connected, and rotated with respect to each other, and the first handle has a stamping seat which is a stamping groove and a guide through hole provided for moving the stamping nail axially. The second handle has a linking portion linkable to the stamping nail, so that when the second handle is rotated relative to the first handle, the linking portion can be linked to the stamping nail to move the stamping nail axially in the guide through hole.
    Type: Application
    Filed: January 25, 2021
    Publication date: July 28, 2022
    Inventor: Chin-Chen Huang
  • Patent number: D961977
    Type: Grant
    Filed: July 2, 2019
    Date of Patent: August 30, 2022
    Assignee: ENE HOLDINGS LIMITED
    Inventor: Andrew Yuen Chin Chen