Abstract: An activity monitoring system comprising a plurality of wireless units wherein a first wireless unit comprises a wireless transceiver to broadcast at least one timing signal; a second wireless unit comprises: a wireless transceiver to receive at least one signal; a monitoring device that generates monitoring data; a memory to store the monitoring data; a processor to synchronize a time with the corresponding monitoring data; and wherein the second wireless unit: processes the received timing signal from the first wireless unit; synchronizes the monitoring data with the timing signal resulting in a time-synchronized data stream.

Abstract: A high voltage device includes a semiconductor substrate, an ion well, a Schottky diode in the ion well, an isolation structure in the ion well surrounding the Schottky diode, and an assistant gate surrounding the Schottky diode. The assistant gate is disposed only on the isolation structure and is not in direct contact with the ion well.

Abstract: A linear gear shift mechanism for chainless vehicles includes a gear shift unit having a support rotator, transmission balls and driving posts, with the transmission balls disposed in the support rotator, with a cylindrical receiving portion disposed on each transmission ball radially, with the driving posts disposed in the cylindrical receiving portions along radial direction of the support rotator and rotating from radial direction thereof to but not reach axial direction of the support rotator; an axial power input rotator having an inward-tilted power input annular surface; an axial power output rotator having an inward-tilted power output annular surface, with the transmission balls clamped between inward-tilted power input and output annular surfaces and support rotator; a tread-required transverse power source meshing with axial power input rotator; an axial power transfer portion meshing with axial power output rotator axially; a transverse power output portion meshing with axial power transfer portio

Abstract: Structures and formation methods of an image sensor structure are provided. The image sensor structure is provided. The image sensor structure includes a substrate, a photodiode component in the substrate, and a grid structure over the substrate. The grid structure includes a bottom dielectric element over the substrate, a reflective element over the bottom dielectric element, and an upper dielectric element over the reflective element. The reflective element has a sidewall which is anti-corrosive in a basic condition and an acidic condition. The image sensor structure also includes a color filter element over the substrate and surrounded by the grid structure. The color filter element is aligned with the photodiode component.

Abstract: A method of forming a semiconductor image sensing device includes: providing a semiconductor substrate; forming a radiation sensitive region and a peripheral region in the semiconductor substrate, wherein the peripheral region surrounds the radiation sensitive region and includes a top surface projected from a backside of the semiconductor substrate and a sidewall coplanar with a sidewall of the semiconductor substrate and perpendicular to the top surface; forming a photon blocking spacer in the peripheral region, wherein the photon blocking spacer covers a portion of the sidewall of the peripheral region; and forming an anti reflective coating adjacent to the photon blocking layer.

Abstract: In some embodiments, the present disclosure relates to a method of forming an absorption enhancement structure for an integrated chip image sensor that reduces crystalline defects resulting from the formation of the absorption enhancement structure. The method may be performed by forming a patterned masking layer over a first side of a substrate. A dry etching process is performed on the first side of the substrate according to the patterned masking layer to define a plurality of intermediate protrusions arranged along the first side of the substrate within a periodic pattern. A wet etching process is performed on the plurality of intermediate protrusions to form a plurality of protrusions. One or more absorption enhancement layers are formed over and between the plurality of protrusions. The wet etching process removes a damaged region of the intermediate protrusions that can negatively impact performance of the absorption enhancement structure.

Abstract: A method of fabricating a transistor with reduced hot carrier injection effects includes providing a substrate covered by a gate material layer. Later, the gate material layer is patterned into a gate electrode. Then, a mask layer is formed to cover part of the gate electrode and expose two ends of the gate electrode. Finally, a first implantation process is performed to implant dopants through the exposed two ends of the gate electrode into the substrate directly under the gate electrode to form two LDD regions by taking the mask layer as a mask.

Abstract: A method of fabricating tantalum nitride barrier layer in an ultra low threshold voltage semiconductor device is provided. The method includes forming a high-k dielectric layer over a semiconductor substrate. Subsequently, a tantalum nitride barrier layer is formed on the high-k dielectric layer. The tantalum nitride barrier layer has a Ta:N ratio between 1.2 and 3. Next, a plurality of first metal gates is formed on the tantalum nitride barrier layer. The first metal gates are patterned, and then a second metal gate is formed on the tantalum nitride barrier layer.

Abstract: In some embodiments, the present disclosure relates to a method of forming an absorption enhancement structure for an integrated chip image sensor that reduces crystalline defects resulting from the formation of the absorption enhancement structure. The method may be performed by forming a patterned masking layer over a first side of a substrate. A dry etching process is performed on the first side of the substrate according to the patterned masking layer to define a plurality of intermediate protrusions arranged along the first side of the substrate within a periodic pattern. A wet etching process is performed on the plurality of intermediate protrusions to form a plurality of protrusions. One or more absorption enhancement layers are formed over and between the plurality of protrusions. The wet etching process removes a damaged region of the intermediate protrusions that can negatively impact performance of the absorption enhancement structure.

Abstract: An apparatus for tracking patients utilizes a wristband with integrated radio frequency circuits (RFIC). The wristband may further incorporate an antenna on a flex PCB. The wristband may also be disposable and comprising means for replacing the RFIC.

Abstract: A lens assembly includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens and a seventh lens, all of which are arranged in sequence from an object side to an image side along an optical axis. The first lens is a meniscus lens with negative refractive power and includes a convex surface facing the object side. The second lens is with negative refractive power and includes a concave surface facing the object side. The third lens is with positive refractive power and includes a convex surface facing the image side. The fourth lens is with positive refractive power. The fifth lens is with positive refractive power. The sixth lens is with negative refractive power. The seventh lens is with refractive power.

Abstract: An electronic device coupling system includes a plurality of electronic devices. The plurality of electronic devices includes a master device and a plurality of slave devices coupleable to the master device one by one. Each electronic device includes a plurality of bus-bars and a plurality of switch modules. Each switch module includes a plurality of switch paths each corresponding to one of the plurality of bus-bars. Two of the electronic devices are inserted together by two of the plurality of bus-bars located in the two of the electronic devices respectively. When the two of the electronic devices are inserted together, the switch paths of each switch module corresponding to the two of the plurality of bus-bars are switched on.

Abstract: A system for estimating the location of a node in a mesh network and predicting future location of the same. Historical RSSI of nodes in a mesh network may be used to determine relative location amongst other nodes. The system may employ statistical approaches to predict future node locations.

Abstract: A telephoto lens assembly comprises sequentially from an object side to an image side along an optical axis a first lens, a second lens, a stop, a third lens, a fourth lens, a fifth lens and a sixth lens. The first lens has negative refractive power and includes a convex surface facing the object side. The second lens has negative refractive power and includes a convex surface facing the image side. The third lens has positive refractive power. The fourth lens has refractive power. The fifth lens has refractive power. The sixth lens has positive refractive power. The fourth lens and the fifth lens are cemented.

Abstract: A folding mechanism includes two retractable folding assemblies. A first retractable folding assembly includes a first base member, two friction members, two first dual-pivotal plate units, two first fixation plate units and a first pulling member. The two friction members are mounted to opposing ends of the first base member. The first dual-pivotal plate unit is symmetrically pivotally connected with opposing sides of the first base member. The first fixation plate unit is individually pivotally connected with the first dual-pivotal plate unit. The first pulling member is mounted at the first base member. A second retractable folding assembly is structurally resembled to the first retractable folding assembly. A movable buckle unit is further included to buckle or release springily two dual-pivotal plate units of the second retractable folding assembly.

Abstract: An electronic device coupling system includes a plurality of electronic devices and an external power supply. The plurality of electronic devices includes a master device and a plurality of slave devices coupleable to the master device one by one. Each electronic device has a sequence number according to an insertion sequence, the sequence number is corresponds to all the information of local electronic device, the sequence numbers of the plurality of electronic devices are sorted according to the insertion sequence, the sequence number of the master device is a first number of the sequence, and the master device is coupleable to at least one slave device by the sequence number and all the information corresponding to the sequence number. The at least one slave device is a customized group of the master device.

Abstract: A motor system includes at least two motors respectively having an output power and a rotary shaft, wherein at least one coupling is provided to connected the at least two rotary shafts. A detect unit is electrically connected to each of the at least two motors and detects the currents of the at least two motors and forms detecting signals relative to the current value of each of the at least two motors. A control unit is electrically connected to the at least two motors for receiving a controlling signal and the detecting signal for adjusting an output power to the electric actuator.

Abstract: Structures and formation methods of an image sensor structure are provided. The image sensor structure is provided. The image sensor structure includes a substrate, a photodiode component in the substrate, and a grid structure over the substrate. The grid structure includes a bottom dielectric element over the substrate, a reflective element over the bottom dielectric element, and an upper dielectric element over the reflective element. The reflective element has a sidewall which is anti-corrosive in a basic condition and an acidic condition. The image sensor structure also includes a color filter element over the substrate and surrounded by the grid structure. The color filter element is aligned with the photodiode component.

Abstract: A semiconductor structure includes a semiconductive substrate including a first surface and a second surface opposite to the first surface, a shallow trench isolation (STI) including a first portion at least partially disposed within the semiconductive substrate and tapered from the first surface towards the second surface, and a second portion disposed inside the semiconductive substrate, coupled with the first portion and extended from the first portion towards the second surface, and a void enclosed by the STI, wherein the void is at least partially disposed within the second portion of the STI.

Abstract: A two-wheel suspension mechanism includes a control frame having therein a left channel and a right channel; a control valve disposed at the control frame and connected between the left and right channels; a left retractable cylinder having a left external-cylinder and a left internal-cylinder, with the left external-cylinder pivotally connected to the control frame, and the left internal-cylinder retractable into the left external-cylinder, defining a left retractable space between the left external-cylinder and the left internal-cylinder, allowing the left retractable space to communicate with the left channel; a right retractable cylinder having a right external-cylinder and a right internal-cylinder, with the right external-cylinder pivotally connected to the control frame, and the right internal-cylinder retractable into the right external-cylinder, defining a right retractable space between the right external-cylinder and the right internal-cylinder, allowing the right retractable space to communicate w