Abstract: A polyester film having a laminated structure and a method for manufacturing the same are provided. The polyester film has at least two polyester film layers. Each of the polyester film layers includes a physically recycled polyester resin and a chemically recycled polyester resin. The physically recycled polyester resin is formed by a plurality of physically recycled polyester chips. The chemically recycled polyester resin is formed by a plurality of chemically recycled polyester chips, and is mixed with the physically recycled polyester resin. The plurality of chemically recycled polyester chips further includes chemically recycled electrostatic pinning polyester chips. The chemically recycled electrostatic pinning polyester chips contain electrostatic pinning additives, and the electrostatic pinning additives are metal salts. The at least two polyester film layers are a white polyester film layer and a black polyester film layer, respectively.

Abstract: A black polyester film and a method for manufacturing the same are provided. The black polyester film includes a physically recycled polyester resin and a chemically recycled polyester resin. The physically recycled polyester resin is formed by a plurality of physically recycled polyester chips. The chemically recycled polyester resin is formed by a plurality of chemically recycled polyester chips and mixed with the physically recycled polyester resin. The plurality of chemically recycled polyester chips further include chemically recycled electrostatic pinning polyester chips. The chemically recycled electrostatic pinning polyester chips contain electrostatic pinning additives, and the electrostatic pinning additives are metal salts. Expressed in percent by weight based on a total weight of the polyester film, a content of the electrostatic pinning additives in the polyester film is between 0.005% and 0.1% by weight. The black polyester film further includes a black additive.

Abstract: A breathable and waterproof membrane and a method for manufacturing the same, and a breathable and waterproof fabric are provided. The breathable and waterproof membrane is formed by stretching a polyolefin material. The breathable and waterproof membrane has a density ranging from 0.6 g/cm3 to 0.8 g/cm3. A plurality of micropores are formed on the breathable and waterproof membrane, and the plurality of micropores each has a size smaller than 500 nm. The polyolefin material includes: 60 wt % to 80 wt % of a first polypropylene resin, 15 wt % to 30 wt % of a second polypropylene resin, and 1 wt % to 10 wt % of inorganic particles. The second polypropylene resin is a modified polypropylene resin having a hydrophilic group. The second polypropylene resin is different from the first polypropylene resin.

Abstract: A crank apparatus includes a crank arm having at least one cavity on one of the surfaces of the crank arm, at least one thin material layer embedded within the at least one cavity and having an exposed outer surface, and at least one sensing element attached to the outer surface of the thin material layer. The crank arm is manufactured of a material with non-uniform strain characteristics, the thin material layer is manufactured of a material with uniform strain characteristics, the crank arm is adapted to be deformed by a force, the thin material layer is adapted to be deformed correspondingly with the deformation of the crank arm, the at least one sensing element is adapted to measure the corresponding strain of the thin material layer to measure the force applied on the crank arm. A bicycle and a stationary exercise bicycle equipped with the crank apparatus are further provided.

Abstract: A bicycle has a spider including a torque input section and at least one torque output section; a crank assembly coupled with the spider through the torque input section and applying an input torque to the spider; a chainring mounted to the spider through the at least one torque output section and receiving an output torque from the spider; a gauge disposed and oriented generally along a tangential direction or a quasi-tangential direction with respect to the torque input section and the at least one torque output section; and a circuitry coupled to the gauge and receiving a signal from the gauge.

Abstract: A recyclable retort pouch and a recyclable retort polyester film thereof are provided. The recyclable retort polyester film includes a heat seal layer and at least one polyester layer. The heat seal layer is composed of isophthalic acid, neopentyl glycol, polybutylene terephthalate, 1,4-cyclohexanedimethanol, and polyethylene terephthalate-1,4-cyclohexane dimethanol ester. The polyester layer is formed on the heat seal layer, and is composed of a polyester composition. The polyester composition includes a polyester resin made from recycled PET bottle flakes processed by physical or chemical methods and the polyester resin has an inherent viscosity between 0.62 dl/g and 1.0 dl/g. The recyclable retort pouch is made of the recyclable retort polyester film.

Abstract: A low oligomer modified polyester film capable of being easily extended and a method for manufacturing the same are provided. The modified polyester film includes a base layer and at least one skin layer formed on the base layer, each of which is formed from a polyester composition. The polyester composition includes 1 to 60 wt % of a blend resin, 0.02 to 2 wt % of an antioxidative ingredient, 0.003 to 2 wt % of a nucleation agent, and 0.003 to 2 wt % of a processing and flowing aid. The blend resin includes 90 to 99.9 phr of a polyester resin and 0.01 to 10 phr of an acrylic resin. The polyester resin has an intrinsic viscosity between 0.62 dl/g and 1.00 dl/g, and the acrylic resin has a weight average molecular weight (Mw) between 10,000 and 80,000.

Abstract: A process for modifying glycoproteins is provided. The invention also provides a process for producing glycoprotein-payload conjugates, as well as the conjugates produced thereby.

Abstract: A high voltage depletion mode MOS device with adjustable threshold voltage includes: a first conductive type well region; a second conductive type channel region, wherein when the channel region is not depleted, the MOS device is conductive, and when the channel region is depleted, the MOS device is non-conductive; a second conductive type connection region which contacts the channel region; a first conductive type gate, for controlling the conductive condition of the MOS device; a second conductive type lightly doped diffusion region formed under a spacer layer of the gate and contacting the channel region; a second type source region; and a second type drain region contacting the connection region but not contacting the gate; wherein the gate has a first conductive type doping or both a first and a second conductive type doping, and wherein a net doping concentration of the gate is determined by a threshold voltage target.

Abstract: A chip package including a first semiconductor die, conductive pillars, a dielectric structure, a second semiconductor die and insulating encapsulant is provided. The first semiconductor die includes a top surface having a first region and a second region. The conductive pillars are disposed over the second region of the first semiconductor die. The dielectric structure includes a first support portion disposed on the first region of the semiconductor die, and a second support portion physically separated from the first semiconductor die. The second semiconductor die is stacked over the first support portion and the second support portion, and is electrically connected to the first semiconductor die through the conductive pillars. The insulating encapsulant encapsulates the first semiconductor die, the second semiconductor die, the dielectric structure and the conductive pillars.

Abstract: A device includes a semiconductor substrate having a front side and a backside. A photo-sensitive device is disposed at a surface of the semiconductor substrate, wherein the photo-sensitive device is configured to receive a light signal from the backside of the semiconductor substrate, and convert the light signal to an electrical signal. An amorphous-like adhesion layer is disposed on the backside of the semiconductor substrate. The amorphous-like adhesion layer includes a compound of nitrogen and a metal. A metal shielding layer is disposed on the backside of the semiconductor substrate and contacting the amorphous-like adhesion layer.

Abstract: A touch input device includes a frame unit, a circuit unit and a touch pad. The circuit unit includes a circuit board, a dome-shaped actuating member including an actuating portion and a resilient metal sheet connected between the actuating portion and the circuit board, and a noise reduction member having a main body connected to the resilient metal sheet, made of an elastic material and formed with a recess surrounding the actuating portion. A touch surface of the touch pad is touchable to push the circuit unit toward the block member, such that the actuating portion contacts the block member to deform the resilient metal sheet to electrically connect the actuating portion with the circuit board.

Abstract: A trigger device includes a circuit board, an arched sheet, and a noise-reducing unit that includes first and second electroconductive sheets respectively connected to first and second nodes of the circuit board. The arched sheet is mounted to the second electroconductive sheet and is pressible from a preset state to a bent state, with the arched sheet being deformed and proximate to the first electroconductive sheet, and further from the bent state to a contact state, with the second electroconductive sheet being compressed and with a central portion of the arched sheet being brought into contact with the first electroconductive sheet to thus electrically connect the first and second nodes.

Abstract: An integrated circuit includes a signal pad, receiving an input signal during a normal mode, and receive an ESD signal during an ESD mode; an internal circuit, processing the input signal during the normal mode; a variable impedance circuit, comprising a first end coupled to the signal pad, a second end coupled to the internal circuit, wherein the variable impedance circuit provides a low or high impedance path between the signal pad and the internal circuit during the normal or ESD mode; and a switch circuit, comprising a first end coupled to a control end of the variable impedance circuit, a second end coupled to a reference voltage terminal, and a control end receiving a node voltage, wherein the switch circuit switches the control end of the variable impedance circuit to have a first specific voltage or be electrically floating during the normal or ESD mode.

Abstract: A detectable dust-proof paper is provided. The detectable dust-proof paper includes a detected layer, a first plastic layers, and a first ink-receptive layer. The detected layer has two opposite surfaces. The detected layer includes at least one metal which is selected from the group consisting of: aluminum, copper, nickel, iron, and a mixture or an alloy thereof. The first plastic layer is disposed on one of the two surfaces of the detected layer. A material of the first plastic layer is selected from the group consisting of: a polyolefin, a polyester, a polyamide, and any combination thereof. The first ink-receptive layer is disposed on the first plastic layer. The first ink-receptive layer contains an inorganic ink-absorption material ranging between a value larger than 0 wt % and 75 wt %.

Abstract: A semiconductor package includes a first redistribution structure, a semiconductor die electrically coupled to the first redistribution structure, a die attach material interposed between the first redistribution structure and the semiconductor die, and an insulating encapsulant disposed on the first redistribution structure and covering the semiconductor die and the die attach material. A bottom of the semiconductor die is embedded in the die attach material, and a thickness of a portion of the die attach material disposed over a spacing of conductive traces of the first redistribution structure is greater than a thickness of another portion of the die attach material disposed over the conductive traces of the first redistribution structure and underlying the bottom of the semiconductor die.

Abstract: A back panel of a solar cell and a method for manufacturing the same are provided. The back panel includes a polyolefin laminate structure and a protective layer disposed on the polyolefin laminate structure. The polyolefin laminate structure includes a reflective layer and a transparent layer disposed on the reflective layer. The transparent layer includes a continuous phase and a dispersed phase dispersed in the continuous phase. The continuous phase is formed from polyolefin. The dispersed phase is formed from a rubber elastomer. Based on the total weight of the transparent layer, an amount of the dispersed phase ranges from 10 wt % to 25 wt %.

Abstract: An antibacterial plastic surface material is provided. The antibacterial plastic surface material includes a polyolefin substrate and an antifouling and antibacterial layer. A material of the polyolefin substrate includes 30 wt % to 60 wt % of linear polyethylene and 40 wt % to 70 wt % of propylene homopolymer. The antifouling and antibacterial layer is formed on the polyolefin substrate. The material of the antifouling and antibacterial layer includes at least 70 wt % of a fluorine-containing polymer.

Abstract: Distributed resource allocation for devices can be facilitated via a priority sequencing scheme. The priority sequencing scheme can mitigate source device collisions by assigning priority values to source devices and channels associated with the source devices. Various priority sequencing can be used based upon whether source devices can only communicate with a limited number of sink devices or whether source devices can communicate with all sink devices.

Abstract: A back panel of a solar cell, a method for manufacturing the back panel, and a method for manufacturing a solar cell module are provided. A method of manufacturing a back panel of a solar cell includes steps below. A polyester layer is provided. A reflective laminate is disposed on one surface of the polyester layer and a protective layer is disposed on another surface of the polyester layer to obtain the back panel of the solar cell. The reflective laminate includes a reflective packaging layer and a connecting layer. The connecting layer is sandwiched between the polyester layer and the reflective packaging layer. A material of the reflective packaging layer is ethylene vinyl acetate. A material of the connecting layer is polyolefin.