Patents by Inventor Ching Yao

Ching Yao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10403865
    Abstract: A method for lithium aluminum film packaging materials, with water, high temperature and corrosion resistance, the substrate layer, and then layer, aluminum foil layer, anti-corrosion layer, adhesive layer and the inner layer together constitute from the outermost to innermost layer laminate structure in which one side of the aluminum foil layer, or both side surface of the conductive coating material to said coating and curing anticorrosive layer, and the use of fluorine-containing polyurethane resin constituting the laminated rubber layer and the inner layer of corrosion between the adhesive layer, used lithium batteries as plastic film packaging applications, it can promote lithium battery with Merit water resistance, high temperature resistance and corrosion resistance, and enhance the use of lithium batteries in years.
    Type: Grant
    Filed: October 3, 2014
    Date of Patent: September 3, 2019
    Assignee: NAN YA PLASTICS CORPORATION
    Inventors: Dein-Run Fung, Ying-Te Huang, Chao-Hsien Lin, Ching-Yao Yuan, Teng-Ko Ma
  • Publication number: 20190252339
    Abstract: A manufacturing method of integrated fan-out package includes following steps. First and second dies are provided on adhesive layer formed on carrier. Heights of first and second dies are different. First and second dies respectively has first and second conductive posts each having substantially a same height. The dies are pressed against adhesive layer to make active surfaces thereof be in direct contact with adhesive layer and conductive posts thereof be submerged into adhesive layer. Adhesive layer is cured. Encapsulant is formed to encapsulate the dies. Carrier is removed from adhesive layer. Heights of first and second conductive posts are reduced and portions of the adhesive layer is removed. First and second conductive posts are laterally wrapped by and exposed from adhesive layer. Top surfaces of first and second conductive posts are leveled. Redistribution structure is formed over adhesive layer and is electrically connected to first and second conductive posts.
    Type: Application
    Filed: April 29, 2019
    Publication date: August 15, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ai-Tee Ang, Shing-Chao Chen, Ching-Hua Hsieh, Chih-Wei Lin, Ching-Yao Lin
  • Publication number: 20190252427
    Abstract: A device includes a semiconductor substrate having a front side and a backside. A photo-sensitive device is disposed at a surface of the semiconductor substrate, wherein the photo-sensitive device is configured to receive a light signal from the backside of the semiconductor substrate, and convert the light signal to an electrical signal. An amorphous-like adhesion layer is disposed on the backside of the semiconductor substrate. The amorphous-like adhesion layer includes a compound of nitrogen and a metal. A metal shielding layer is disposed on the backside of the semiconductor substrate and contacting the amorphous-like adhesion layer.
    Type: Application
    Filed: April 29, 2019
    Publication date: August 15, 2019
    Inventors: Shih-Chieh Chang, Jian-Shin Tsai, Chih-Chang Huang, Ing-Ju Lee, Ching-Yao Sun, Jyun-Ru Wu, Ching-Che Huang, Szu-An Wu, Ying-Lang Wang
  • Publication number: 20190243476
    Abstract: A touch input device includes a base board unit, a movable board unit, an actuating member and a noise reduction member. The base board unit has a distal end portion. The movable board unit overlaps and is connected to the base board unit, and has a free end portion movable toward or away from the distal end portion of the base board unit. The actuating unit includes a switch protruding from the free end portion and extending into the noise reduction member, and an actuating member protruding from the distal end portion. The noise reduction member is compressed by the distal end portion when the free end portion moves to the position adjacent to the distal end portion for the actuating member to actuate the switch.
    Type: Application
    Filed: June 11, 2018
    Publication date: August 8, 2019
    Applicant: SUNREX TECHNOLOGY CORP.
    Inventors: Chun-Chieh CHEN, Ching-Yao HUANG, Ling-Cheng TSENG
  • Publication number: 20190240928
    Abstract: A method for forming a resin-based composite structure is provided. The method includes: providing a prepreg layup, wherein the prepreg layup includes an epoxy resin-carbon fiber composite material; covering a thermal-fusion material on a surface of the prepreg layup; and performing a molding and curing process to fuse the thermal-fusion material with the prepreg layup. Wherein the molding and curing process includes: heating at a first temperature to melt, soften and fully fuse the thermal-fusion material with the prepreg layup; and heating at a second temperature to solidify the thermal-fusion material for forming the resin-based composite structure. Wherein the first temperature is lower than the second temperature.
    Type: Application
    Filed: January 30, 2019
    Publication date: August 8, 2019
    Inventors: Yao-Tun CHIANG, Chih-Kai CHANG, Ching-Yao LIN
  • Publication number: 20190208006
    Abstract: A method and a server for dynamic work transfer are provided. The method includes following steps: regularly collecting and recording network resources of multiple nodes including a cloud node and multiple edge nodes in a network; receiving a request of a first job at a first time point, calculating a cost for configuring the first job to each node according to the network resource of each node at the first time point, and configuring the first job to a first target node; receiving a request of a second job at a second time point, calculating a cost for configuring the second job to each node according to the network resource of each node at the first time point, and determining a second target node suitable for configuring the second job and whether to transfer the first job; and accordingly configuring the second job and maintaining or transferring the first job.
    Type: Application
    Filed: March 19, 2018
    Publication date: July 4, 2019
    Applicant: Industrial Technology Research Institute
    Inventors: Lyu-Han Chen, Ching-Yao Wang
  • Publication number: 20190201736
    Abstract: A crank apparatus includes a crank arm having at least one cavity on one of the surfaces of the crank arm, at least one thin material layer embedded within the at least one cavity and having an exposed outer surface, and at least one sensing element attached to the outer surface of the thin material layer. The crank arm is manufactured of a material with non-uniform strain characteristics, the thin material layer is manufactured of a material with uniform strain characteristics, the crank arm is adapted to be deformed by a force, the thin material layer is adapted to be deformed correspondingly with the deformation of the crank arm, the at least one sensing element is adapted to measure the corresponding strain of the thin material layer to measure the force applied on the crank arm. A bicycle and a stationary exercise bicycle equipped with the crank apparatus are further provided.
    Type: Application
    Filed: December 20, 2018
    Publication date: July 4, 2019
    Applicant: Giant Manufacturing Co., Ltd.
    Inventors: Chung-Wei Lin, Hsaio-Wen Hsu, Chih-Hsiang Shen, Ching-Yao Lin
  • Publication number: 20190132877
    Abstract: Distributed resource allocation for devices can be facilitated via a priority sequencing scheme. The priority sequencing scheme can mitigate source device collisions by assigning priority values to source devices and channels associated with the source devices. Various priority sequencing can be used based upon whether source devices can only communicate with a limited number of sink devices or whether source devices can communicate with all sink devices.
    Type: Application
    Filed: December 14, 2018
    Publication date: May 2, 2019
    Inventors: Hsuan-Li Lin, Ching-Yao Huang
  • Patent number: 10276537
    Abstract: An integrated fan-out package includes a first and second dies, an encapsulant, and a redistribution structure. The first and second dies respectively has an active surface, a rear surface opposite to the active surface, and conductive posts on the active surface. The first and second dies are different types of dies. The active and rear surfaces of the first die are respectively leveled with the active and rear surfaces of the second die. Top surfaces of the conductive posts of the first and second dies are leveled. The conductive posts of the first and second dies are wrapped by same material. The encapsulant encapsulates sidewalls of the first and second dies. A first surface of the encapsulant is leveled with the active surfaces. The second surface of the encapsulant is leveled with the rear surfaces. The redistribution structure is disposed over the first die, the second die, and the encapsulant.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: April 30, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ai-Tee Ang, Shing-Chao Chen, Ching-Hua Hsieh, Chih-Wei Lin, Ching-Yao Lin
  • Patent number: 10276621
    Abstract: A device includes a semiconductor substrate having a front side and a backside. A photo-sensitive device is disposed at a surface of the semiconductor substrate, wherein the photo-sensitive device is configured to receive a light signal from the backside of the semiconductor substrate, and convert the light signal to an electrical signal. An amorphous-like adhesion layer is disposed on the backside of the semiconductor substrate. The amorphous-like adhesion layer includes a compound of nitrogen and a metal. A metal shielding layer is disposed on the backside of the semiconductor substrate and contacting the amorphous-like adhesion layer.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: April 30, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih-Chieh Chang, Jian-Shin Tsai, Chih-Chang Huang, Ing-Ju Lee, Ching-Yao Sun, Jyun-Ru Wu, Ching-Che Huang, Szu-An Wu, Ying-Lang Wang
  • Publication number: 20190096840
    Abstract: An integrated fan-out package includes a first and second dies, an encapsulant, and a redistribution structure. The first and second dies respectively has an active surface, a rear surface opposite to the active surface, and conductive posts on the active surface. The first and second dies are different types of dies. The active and rear surfaces of the first die are respectively levelled with the active and rear surfaces of the second die. Top surfaces of the conductive posts of the first and second dies are levelled. The conductive posts of the first and second dies are wrapped by same material. The encapsulant encapsulates sidewalls of the first and second dies. A first surface of the encapsulant is levelled with the active surfaces. The second surface of the encapsulant is levelled with the rear surfaces. The redistribution structure is disposed over the first die, the second die, and the encapsulant.
    Type: Application
    Filed: September 25, 2017
    Publication date: March 28, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ai-Tee Ang, Shing-Chao Chen, Ching-Hua Hsieh, Chih-Wei Lin, Ching-Yao Lin
  • Patent number: 10189996
    Abstract: Disclosed herein is an anthracene-based organic dye represented by Formula (1): wherein the substituents contained in Formula (1) are as defined herein. The anthracene-based organic dye may be used as a photosensitizer in dye-sensitized solar cells to effectively absorb light having a wavelength range which covers the entire visible light wavelength range and which even expands to a near infrared wavelength range and convert the absorbed light into photoelectric current.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: January 29, 2019
    Assignee: NATIONAL CHI NAN UNIVERSITY
    Inventors: Ching-Yao Lin, Chin-Li Wang, Ming-Chi Tsai
  • Patent number: 10165465
    Abstract: Distributed resource allocation for devices can be facilitated via a priority sequencing scheme. The priority sequencing scheme can mitigate source device collisions by assigning priority values to source devices and channels associated with the source devices. Various priority sequencing can be used based upon whether source devices can only communicate with a limited number of sink devices or whether source devices can communicate with all sink devices.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: December 25, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsuan-Li Lin, Ching-Yao Huang
  • Patent number: 10154108
    Abstract: According to an exemplary embodiment, a method for brokering between devices and network services provides a platform for brokering between at least one device and at least one service group, and uses a brokering service module on the service platform to execute: using a computing device to compute a correlation between a thing and another thing, thereby computing a correlation between a thing and a service group of the at least one service group; for a service group of the at least one service group, using the computing device to compute the correlation between each of at least one thing and a service group of the at least one service group; for a device corresponding to the thing, brokering one or more service groups; and for a service group of the at least one service group, brokering one or more devices corresponding to one or more things.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: December 11, 2018
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wen-Hsing Kuo, Tein-Yaw David Chung, Ching-Yao Wang, Yian-Shu Chu
  • Patent number: 10129209
    Abstract: A method and a communication device for network address translation (NAT) traversal is provided. The method includes following steps. A NAT device information is exchanged between a communication device and another communication device. A relay connection is established between the communication device and the another communication device through a relay server. Whether it is feasible to establish a P2P connection between the communication device and the another communication device is determined according to the NAT device information. When it is feasible to establish the P2P connection between the communication device and the another communication device, an attempt to establish the P2P connection between the communication device and the another communication device is made. If the P2P connection is not established successfully, an attempt to establish the P2P connection between the communication device and the another communication device is made again.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: November 13, 2018
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ching-Yao Wang, Lyu-Han Chen, Hung-Wei Lin
  • Patent number: 10128193
    Abstract: A package structure and methods for forming the same are provided. The package structure includes an integrated circuit die in a package layer. The package structure also includes a first passivation layer covering the package layer and the integrated circuit die, and a second passivation layer over the first passivation layer. The package structure further includes a seed layer and a conductive layer in the second passivation layer. The seed layer covers the top surface of the first passivation layer and extends into the first passivation layer. The conductive layer covers the seed layer and extends into the first passivation layer. In addition, the package structure includes a third passivation layer covering the second passivation layer. The seed layer further extends from the top surface of the first passivation layer to the third passivation layer along a sidewall of the conductive layer.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: November 13, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shing-Chao Chen, Chih-Wei Lin, Ching-Yao Lin, Ming-Da Cheng, Ching-Hua Hsieh
  • Publication number: 20180315851
    Abstract: A high voltage depletion mode MOS device with adjustable threshold voltage includes: a first conductive type well region; a second conductive type channel region, wherein when the channel region is not depleted, the MOS device is conductive, and when the channel region is depleted, the MOS device is non-conductive; a second conductive type connection region which contacts the channel region; a first conductive type gate, for controlling the conductive condition of the MOS device; a second conductive type lightly doped diffusion region formed under a spacer layer of the gate and contacting the channel region; a second type source region; and a second type drain region contacting the connection region but not contacting the gate; wherein the gate has a first conductive type doping or both a first and a second conductive type doping, and wherein a net doping concentration of the gate is determined by a threshold voltage target.
    Type: Application
    Filed: March 1, 2018
    Publication date: November 1, 2018
    Inventors: Tsung-Yi Huang, Ching-Yao Yang
  • Patent number: 10016765
    Abstract: A method for advancing a non-magnetically responsive functional agent includes steps (a) and (b). In step (a), a magnetically responsive agent construct at a target site is subjected to a homogeneous static magnetic field such that magnetically responsive micro particles are aligned to obtain a magnetic chain while the non-magnetically responsive functional agent is separated and discrete from the magnetic chain. In step (b), the magnetic chain is subjected to a rotational magnetic field to cause repeating breaking up and reformation of the magnetic chain such that the non-magnetically responsive functional agent is displaced to a predetermined position.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: July 10, 2018
    Assignee: National Chiao Tung University
    Inventors: Ching-Yao Chen, Yan-Hom Li, Ren-Chiuan Shiu
  • Publication number: 20180167857
    Abstract: A handover method, system and user equipment are provided. The handover method includes establishing a voice call between a caller device and a callee device in a first network; detecting first-link performance between the caller device and the first network and detecting second-link performance between the caller device and a second network; detecting third-link performance between the callee device and the second network; and determining whether to turn over from the first network to the second network and start a standby call between the caller device and the callee device which has been established in the second network, according to the first-link performance, the second-link performance and the third-link performance, wherein the first network and the second network are respectively a circuit-switched network and a packet-switched network or respectively a packet-switched network and a circuit-switched network.
    Type: Application
    Filed: June 9, 2017
    Publication date: June 14, 2018
    Inventors: Tzi-Cker CHIUEH, Ching-Yao WANG, Yu-Chi LU
  • Patent number: 9996663
    Abstract: A system, a method and a recording medium for calculating a physiological index are provided. The method includes: dividing a physiological data sequence into a plurality of windows; analyzing a data segment in each window to obtain metadata that represents data characteristics of the data segment; updating the metadata including the data characteristics of all data segments in the windows up to a previous window by using the metadata corresponding to one of the windows to obtain the metadata including the data characteristics of all data segments in the windows up to a current window; and finally, calculating the physiological index by using the updated metadata.
    Type: Grant
    Filed: May 13, 2015
    Date of Patent: June 12, 2018
    Assignee: Industrial Technology Research Institute
    Inventors: Chuan-Wei Ting, Ching-Yao Wang