Abstract: Distributed resource allocation for devices can be facilitated via a priority sequencing scheme. The priority sequencing scheme can mitigate source device collisions by assigning priority values to source devices and channels associated with the source devices. Various priority sequencing can be used based upon whether source devices can only communicate with a limited number of sink devices or whether source devices can communicate with all sink devices.

Abstract: A back panel of a solar cell, a method for manufacturing the back panel, and a method for manufacturing a solar cell module are provided. A method of manufacturing a back panel of a solar cell includes steps below. A polyester layer is provided. A reflective laminate is disposed on one surface of the polyester layer and a protective layer is disposed on another surface of the polyester layer to obtain the back panel of the solar cell. The reflective laminate includes a reflective packaging layer and a connecting layer. The connecting layer is sandwiched between the polyester layer and the reflective packaging layer. A material of the reflective packaging layer is ethylene vinyl acetate. A material of the connecting layer is polyolefin.

Abstract: An electronic system includes an echo canceller, a calculation unit, and a control circuit. The echo canceller includes a plurality of operational segments and is configured to perform echo cancellation in a data mode or a power-saving mode. Based on the power of each operational segment provided by the calculation unit, the control circuit is configured to deactivate each stage whose power is lower than a threshold value when the echo canceller is performing echo cancellation in the power-saving mode.

Abstract: An identity recognition system based on compressed signals and a method thereof are provided. When a sensing end is in an identification mode, it continuously measures a physiological identification signal of a user having at least one first predetermined length of time, and performs a compression process on the physiological identification signal having at least one first predetermined length of time to generate a first compressed signal. An identification end receives the first compressed signal, obtains first identification information of the first compressed signal in a discrimination subspace according to a principal eigenvector, and recognizes the first identification signal according to a classification model from a learning end to determine that the user is one of multiple subjects.

Abstract: A bicycle capable of measuring power is disclosed. The bicycle comprises a spider including a torque input section and at least one torque output section; a crank assembly coupled with the spider through the torque input section and applying an input torque to the spider; a chainring mounted to the spider through the at least one torque output section and receiving an output torque from the spider; a gauge disposed and oriented generally along a tangential direction or a quasi-tangential direction with respect to the torque input section and the at least one torque output section; and a circuitry coupled to the gauge and receiving a signal from the gauge.

Abstract: A bicycle capable of measuring power is disclosed. The bicycle comprises a spider including a torque input section and at least one torque output section; a crank assembly coupled with the spider through the torque input section and applying an input torque to the spider; a chainring mounted to the spider through the at least one torque output section and receiving an output torque from the spider; a gauge disposed and oriented generally along a tangential direction or a quasi-tangential direction with respect to the torque input section and the at least one torque output section; and a circuitry coupled to the gauge and receiving a signal from the gauge.

Abstract: A polyester film and a method for manufacturing the polyester film are provided. The method for manufacturing a polyester film by using a recycled plastic material includes the following steps. A part of the recycled plastic material is physically reproduced to obtain a physically regenerated polyester resin. Another part of the recycled plastic material is chemically reproduced to obtain a chemically regenerated polyester resin. A polyester composition including the physically regenerated polyester resin and the chemically regenerated polyester resin is prepared. Based on a total weight of the polyester composition being 100 wt %, a weight of the chemically regenerated polyester resin is larger than or equal to 5 wt %. The polyester film is manufactured by using the polyester composition. Based on a total weight of the polyester film being 100 wt %, a total amount of the physically regenerated polyester resin and the chemically regenerated polyester resin is from 10 wt % to 100 wt %.

Abstract: A chip package including a first semiconductor die, conductive pillars, a dielectric structure, a second semiconductor die and insulating encapsulant is provided. The first semiconductor die includes a top surface having a first region and a second region. The conductive pillars are disposed over the second region of the first semiconductor die. The dielectric structure includes a first support portion disposed on the first region of the semiconductor die, and a second support portion physically separated from the first semiconductor die. The second semiconductor die is stacked over the first support portion and the second support portion, and is electrically connected to the first semiconductor die through the conductive pillars. The insulating encapsulant encapsulates the first semiconductor die, the second semiconductor die, the dielectric structure and the conductive pillars.

Abstract: A manufacturing method of a semiconductor package includes at least the following steps. A rear surface of a semiconductor die is attached to a patterned dielectric layer of a first redistribution structure through a die attach material, where a thickness of a portion of the die attach material filling a gap between the rear surface of the semiconductor die and a recessed area of the patterned dielectric layer is greater than a thickness of another portion of the die attach material interposed between the rear surface of the semiconductor die and a non-recessed area of the patterned dielectric layer. An insulating encapsulant is formed on the patterned dielectric layer of the first redistribution structure to cover the semiconductor die and the die attach material. Other methods for forming a semiconductor package are also provided.

Abstract: A manufacturing method of integrated fan-out package includes following steps. First and second dies are provided on adhesive layer formed on carrier. Heights of first and second dies are different. First and second dies respectively has first and second conductive posts each having substantially a same height. The dies are pressed against adhesive layer to make active surfaces thereof be in direct contact with adhesive layer and conductive posts thereof be submerged into adhesive layer. Adhesive layer is cured. Encapsulant is formed to encapsulate the dies. Carrier is removed from adhesive layer. Heights of first and second conductive posts are reduced and portions of the adhesive layer is removed. First and second conductive posts are laterally wrapped by and exposed from adhesive layer. Top surfaces of first and second conductive posts are leveled. Redistribution structure is formed over adhesive layer and is electrically connected to first and second conductive posts.

Abstract: A touch input device includes a base board, a circuit module having a free end portion and a connecting end portion, a metallic connecting member and an annular, metallic frame. The connecting member includes a positioning portion fixedly mounted to the connecting end portion of the circuit module, and an elastic arm extending from the positioning portion away from the connecting end portion and toward a free end portion in such a way to define a coupling groove that indents away therefrom. The frame is spaced apart from the circuit module and includes a coupling portion that is embossed from a side of the frame proximate to the connecting member, and that has a coupling block coupled to the coupling groove of the elastic arm.

Abstract: A telescopic tube is disclosed. By pressing and rotating a switching button, an abutting section is aligned to a first hole of an outer tube and then elastically pushed by an elastic member, a pin section of the switching button is released from engagement with a fastening hole of the inner tube, and the position of the inner tube in the outer tube can be adjusted individually. After the inner tube is adjusted completely and the switching button is pressed to rotated again, the pin section is inserted into the fastening hole, the engaging section is engaged in the first hole. When the switching button is pressed, the movement of the inner tube makes the switching button release from the first hole and the third hole, and the inner tube, the control assembly and the inner mounting member are retractable in the through hole of the outer tube.

Abstract: A recycled PET foam material and a manufacturing method thereof are characterized in that a recycled material can be used. The manufacturing method includes the following steps: uniformly mixing PET resin, chain extender, antioxidant, flame retardant and heat stabilizer, and then mixing with a twin-screw extruder to obtain a foam PET resin. The PET foaming material obtained is a material having the advantages of light weight, large rigidity, high specific strength, good electrical insulation, good sound insulation and the like, low raw material cost, simple manufacturing process and environmental protection.

Abstract: A semiconductor package includes a first redistribution structure, a semiconductor die electrically coupled to the first redistribution structure, a die attach material interposed between the first redistribution structure and the semiconductor die, and an insulating encapsulant disposed on the first redistribution structure and covering the semiconductor die and the die attach material. A bottom of the semiconductor die is embedded in the die attach material, and a thickness of a portion of the die attach material disposed over a spacing of conductive traces of the first redistribution structure is greater than a thickness of another portion of the die attach material disposed over the conductive traces of the first redistribution structure and underlying the bottom of the semiconductor die.

Abstract: A manufacturing method of a semiconductor package includes at least the following steps. A dielectric layer is formed on a conductive pattern and in a space between the conductive pattern, where a concave area of the dielectric layer is formed corresponding to the space between the conductive pattern. A semiconductor die is disposed on the concave area of the dielectric layer with a die attach material interposed therebetween. A pressure is applied to the die attach material so that the concave area of the dielectric layer is filled with the die attach material, and a portion of the die attach material is extruded from the concave area to expand wider than an area of the semiconductor die. An insulating encapsulant is formed on the dielectric layer to cover the semiconductor die. Other methods for forming a semiconductor package are also provided.

Abstract: An electronic system includes a feedforward equalizer, a feedback equalizer, an RFI canceler, and a control circuit. The feedforward equalizer and the feedback equalizer are configured to adjust the channel response of a transmission channel in the electronic system. The RFI canceler is configured to cancel the RFI presence in the electronic system. When the RFI canceler is off, the controller is configured to turn on the RFI canceler according to a signal error value before RFI cancelation, an error term of the electronic system, or an SNR of the electronic system.

Abstract: A method and a server for dynamic work transfer are provided. The method includes following steps: regularly collecting and recording network resources of multiple nodes including a cloud node and multiple edge nodes in a network; receiving a request of a first job at a first time point, calculating a cost for configuring the first job to each node according to the network resource of each node at the first time point, and configuring the first job to a first target node; receiving a request of a second job at a second time point, calculating a cost for configuring the second job to each node according to the network resource of each node at the first time point, and determining a second target node suitable for configuring the second job and whether to transfer the first job; and accordingly configuring the second job and maintaining or transferring the first job.

Abstract: A semiconductor package includes a first redistribution structure, a semiconductor die disposed on the first redistribution structure, a die attach material disposed between the first redistribution structure and the semiconductor die, and an insulating encapsulant disposed on the first redistribution structure. A first shortest distance from a midpoint of a bottom edge of the semiconductor die to a midpoint of an bottom edge of an extruded region of the die attach material in a width direction of the semiconductor die is greater than a second shortest distance between an endpoint of the bottom edge of the semiconductor die to an endpoint of the bottom edge of the extruded region of the die attach material. The insulating encapsulant encapsulates the semiconductor die and the die attach material. An inclined interface is between the insulating encapsulant and the extruded region of the die attach material.

Abstract: A heat-insulating transparent PVC sheet is formed from a PVC substrate having a thickness of 0.02-2.0 mm and contains heat-insulation pastes evenly distributed over the PVC substrate, since the heat-insulation paste contains an essential component of wolfram cesium powder (WCs) with a chemical formula of CsXNYWO3-ZClC and having a particle size of 0.005-2 ?m, the heat-insulating transparent PVC sheet has an excellent weatherability, and particularly before and after tested in 300-hour service life in line with ASTM G-154 specification, has a physical property of weatherability decay rate (%) small than 4%.

Abstract: A fruit and vegetable anti-fog packaging bag, which is produced with a polypropylene multilayer film, is manufactured by a high-speed bag making machine.