Abstract: A small data transmission method, configured for a User Equipment (UE) to transceive a small data from a control node in a wireless network without establishing a Radio Resource Control (RRC) connection, and the method includes but not limited to the step of: monitoring a paging opportunity (PO) sub frame in a paging frame in an idle mode; when an identifier in the PO sub frame corresponding to the UE is detected, receiving a paging message corresponding to the PO sub frame; and analyzing the paging message, and when the paging message includes a small data indicator, extracting a data from an indicating address, in which the data is the small data.

Abstract: A preparation method of a fruit and vegetable preservation film is used for preparing a three-layer co-extrusion film having a thickness ranging from 0.02 mm to 2.0 mm. A preservation master-batch composed of 5-20% of an inorganic nano-powder and 80-95% of a resin material is uniformly distributed in one layer of the co-extrusion film.

Abstract: A PET synthetic paper is composed of a PET substrate and a soft ink absorbing coating coated on the PET substrate. The soft ink absorbing coating includes an acrylic coating and a polyurethane coating embossed on the acrylic coating. The acrylic coating has excellent printability and the polyurethane coating has velvety-soft tactility.

Abstract: A PET synthetic paper is composed of a PET substrate and a soft ink absorbing coating coated on the PET substrate. The soft ink absorbing coating includes an acrylic coating and a polyurethane coating embossed on the acrylic coating. The acrylic coating has excellent printability and the polyurethane coating has velvety-soft tactility.

Abstract: A stretchable modified polyester film, and more particularly to a modified polyester film for in-mold decoration film and having high extensibility, high light transmittance, low shrinkage (high temperature resistance) and the like is provided. The stretchable polyester film is suitable to serve as a stretchable modified polyester film for an in-mold decoration film. The stretchable modified polyester film includes following components: (a) a polyester resin and (b) an acrylic resin.

Abstract: A semiconductor package includes a first redistribution structure, a semiconductor die disposed on the first redistribution structure, a die attach material disposed between the first redistribution structure and the semiconductor die, and an insulating encapsulant disposed on the first redistribution structure. A first shortest distance from a midpoint of a bottom edge of the semiconductor die to a midpoint of an bottom edge of an extruded region of the die attach material in a width direction of the semiconductor die is greater than a second shortest distance between an endpoint of the bottom edge of the semiconductor die to an endpoint of the bottom edge of the extruded region of the die attach material. The insulating encapsulant encapsulates the semiconductor die and the die attach material. An inclined interface is between the insulating encapsulant and the extruded region of the die attach material.

Abstract: An aluminum plastic film packaging material for lithium batteries to prolong service life, at least comprising an inner layer and an aluminum foil layer, is performed an anti-corrosion treatment between the inner layer and the aluminum foil layer by one of the following ways: 1) a chromium-containing anti-corrosion layer is formed from an aqueous modified resin containing trivalent chromium; and 2) an adhesive layer with non-chromium material is formed from an aqueous modified resin, an epoxy curing agent, a silane coupling agent and a nano-sized metal oxide particle.

Abstract: A manufacturing method of a semiconductor package includes at least the following steps. A dielectric layer is formed on a conductive pattern and in a space between the conductive pattern, where a concave area of the dielectric layer is formed corresponding to the space between the conductive pattern. A semiconductor die is disposed on the concave area of the dielectric layer with a die attach material interposed therebetween. A pressure is applied to the die attach material so that the concave area of the dielectric layer is filled with the die attach material, and a portion of the die attach material is extruded from the concave area to expand wider than an area of the semiconductor die. An insulating encapsulant is formed on the dielectric layer to cover the semiconductor die. Other methods for forming a semiconductor package are also provided.

Abstract: A process for modifying glycoproteins is provided. The invention also provides a process for producing glycoprotein payload conjugates, as well as the conjugates produced thereby.

Abstract: An aluminum plastic film packaging material for lithium batteries to prolong service life, at least comprising an inner layer and an aluminum foil layer, is performed an anti-corrosion treatment between the inner layer and the aluminum foil layer by one of the following ways: 1) a chromium-containing anti-corrosion layer is formed from an aqueous modified resin containing trivalent chromium; and 2) an adhesive layer with non-chromium material is formed from an aqueous modified resin, an epoxy curing agent, a silane coupling agent and a nano-sized metal oxide particle.

Abstract: A semiconductor package and a manufacturing method thereof are provided with the following steps, attaching a rear surface of a semiconductor die on a first redistribution structure by a die attach material, wherein the semiconductor die is pressed so that the die attach material is extruded laterally out and climbs upwardly to cover a sidewall of the semiconductor die, and after attaching, the die attach material comprises an extruded region surrounding the semiconductor die, a first shortest distance from a midpoint of an bottom edge of semiconductor die to a midpoint of an bottom edge of extruded region in a width direction is greater than a second shortest distance between an endpoint of the bottom edge of semiconductor die to an endpoint of the bottom edge of extruded region; and forming an insulating encapsulant on the first redistribution structure to encapsulate the semiconductor die and the die attach material.

Abstract: A touch input device includes a base board, an upper board, and a touch unit. The base board has an elongate opening having opposite opening ends respectively defined by two end walls. The upper board is disposed on and above the base board and includes a touched sensing member. The touch unit is mounted to the base board and includes two positioning seats, a contact element, and two resilient arms. The positioning seats respectively abut against the end walls. The contact element corresponding in position to the touched sensing member is disposed. Each resilient arm interconnects the contact element and a respective one of the positioning seats.

Abstract: A reinforced prepreg which is applied to a wear-resistant layer structure of a braking track is provided. The reinforced prepreg includes a fiber fabric and a mixture mixed with the fiber fabric. The mixture includes a resin and a plurality of needle-shaped crystals having microscale or nanoscale sizes mixed with the resin.

Abstract: An aluminum plastic film packaging material for lithium batteries to prolong service life, at least comprising an inner layer and an aluminum foil layer, is performed an anti-corrosion treatment between the inner layer and the aluminum foil layer by one of the following ways: 1) a chromium-containing anti-corrosion layer is formed from an aqueous modified resin containing trivalent chromium; and 2) an adhesive layer with non-chromium material is formed from an aqueous modified resin, an epoxy curing agent, a silane coupling agent and a nano-sized metal oxide particle.

Abstract: A semiconductor package and a manufacturing method thereof are provided with the following steps, attaching a rear surface of a semiconductor die on a first redistribution structure by a die attach material, wherein the semiconductor die is pressed so that the die attach material is extruded laterally out and climbs upwardly to cover a sidewall of the semiconductor die, and after attaching, the die attach material comprises an extruded region surrounding the semiconductor die, a first shortest distance from a midpoint of an bottom edge of semiconductor die to a midpoint of an bottom edge of extruded region in a width direction is greater than a second shortest distance between an endpoint of the bottom edge of semiconductor die to an endpoint of the bottom edge of extruded region; and forming an insulating encapsulant on the first redistribution structure to encapsulate the semiconductor die and the die attach material.

Abstract: A heat-insulating transparent PVC sheet is formed from a PVC substrate having a thickness of 0.02-2.0 mm and contains heat-insulation pastes evenly distributed over the PVC substrate, since the heat-insulation paste contains an essential component of wolfram cesium powder (WCs) with a chemical formula of CsXNYWO3-ZClC and having a particle size of 0.005-2 ?m, the heat-insulating transparent PVC sheet has an excellent weatherability, and particularly before and after tested in 300-hour service life in line with ASTM G-154 specification, has a physical property of weatherability decay rate (%) small than 4%.

Abstract: A touch input device includes a base board unit and an upper board unit. The base board unit includes opposite side ribs, opposite top and bottom surfaces, an intermediate portion disposed at the middle of one side rib, two flanking portions flanking the intermediate portion and two slots formed respectively through the flanking portions. The base board unit includes two resilient arms extending from the intermediate portion into the slots, respectively. The upper board unit is disposed on and above the base board unit and includes opposite sides correspond respectively in position to the side ribs, and two touch sensing modules respectively correspond in position to and spaced apart from the resilient arms.

Abstract: A touch input device includes a base board unit, an upper board unit, and a touched unit. The base board unit has an elongate opening having opposite opening ends respectively defined by two end walls. The upper board unit is disposed on and above the base board unit and includes a touched sensing module. The touched unit is mounted to the base board unit and includes two positioning seats, a touched portion, and two resilient arms. The positioning seats respectively abut against the end walls. The touched portion corresponding in position to the touched sensing module-is disposed. Each resilient arm interconnects the touched portion and a respective one of the positioning seats.

Abstract: A touch input device includes a base board unit, a movable board unit, an actuating member and a noise reduction member. The base board unit has a distal end portion. The movable board unit overlaps and is connected to the base board unit, and has a free end portion movable toward or away from the distal end portion of the base board unit. The actuating unit includes a switch protruding from the free end portion and extending into the noise reduction member, and an actuating member protruding from the distal end portion. The noise reduction member is compressed by the distal end portion when the free end portion moves to the position adjacent to the distal end portion for the actuating member to actuate the switch.

Abstract: This disclosure generally relates to facilitation of a small cell device to detect direct link opportunities to establish a direct link mode connection to a user equipment based upon monitoring uplink communications from the user equipment to a macro base station, and cooperating with the macro base station to establish a direct link with the user equipment.