Abstract: A hardware loading adjusting method includes performing a first thread for receiving and decompressing the compressed data, to generate and to store decompressed data to a first storage module by a first speed; performing a second thread for storing the decompressed data to a second storage module by a second speed; and adjusting a ratio between the size of the compressed data and the decompressed data stored in the first storage module and the size of the first storage module according to the relationship between the first speed and the second speed.

Abstract: Embodiments of the present disclosure are directed towards an acousto-optics deflector and mirror for laser beam steering and associated techniques and configurations. In one embodiment, a laser system may include an acousto-optics module to deflect a laser beam in a first scanning direction of the laser beam on an integrated circuit (IC) substrate when the IC substrate is in a path of the laser beam and a mirror having at least one surface to receive the laser beam from the acousto -optics module, the mirror to move to control position of the laser beam in a second scanning direction, wherein the second scanning direction is substantially perpendicular to the first scanning direction. Other embodiments may be described and/or claimed.

Abstract: The method for manufacturing a file system update package, includes: file information of each source file in a file system to be updated is acquired; an operation type of a target file corresponding to each source file is determined according to the file information of each source file, the operation type including one of a dynamic type, a static type and a recently-added type; when the operation type of the target file is the dynamic type or the recently-added type, the target file is compressed to form a compressed file package, and when the operation type of a certain target file is the static type, a differential operation is executed according to a difference between the target file and the corresponding source file to form a differential file package; and all the compressed file packages and all the differential file packages are packaged to form a file system update package.

Abstract: A first acousto-optic deflector receives a laser beam. The first acousto-optic deflector diffracts the received laser beam along a first axis. A second acousto-optic deflector receives the diffracted laser beam. The second acousto-optic deflector diffracts the received diffracted laser beam along a second axis.

Abstract: Embodiments of the present invention provide a capability negotiation method, system and apparatus, which are applied to the field of communications, and can improve the flexibility of capability negotiation. The capability negotiation method is applied to a base station, including: acquiring a gateway capability identifier, where the gateway capability identifier is a description of an end to end quality of service EtoE QoS control capability of a gateway; parsing the gateway capability identifier to obtain the EtoE QoS control capability of the gateway; and determining whether the EtoE QoS control capability of the gateway matches a local EtoE QoS control capability, so that when the EtoE QoS control capability of the gateway matches the local EtoE QoS control capability, EtoE QoS control is established.

Abstract: Embodiments of the present invention provide a credit control method, a policy and charging enforcement function entity, and an online charging system.

Abstract: Embodiments of the present invention provide a data transmission method and a gateway. In this way, a quantity of APNs may be decreased, management on the APN is simplified, no change is required for a network structure, a general APN that needs to return to the subscription home location may be configured flexibly, only performing parsing the home location of the APN is required, and a signaling procedure may be simplified; thereby, a requirement for a processing capacity of a gateway device is reduced.

Abstract: An apparatus including a package substrate including a plurality of layers of conductive material, the package substrate including a cavity; and a device in the cavity, wherein an ultimate layer of the plurality of layers of conductive material defines contacts to contact points of the device. An apparatus including a package substrate comprising a plurality of conductive layers and a silicon bridge die disposed between ones of the plurality of conductive layers and an ultimate layer of the plurality of conductive layers defines contact points to contact points of the silicon bridge die; and a logic die coupled to the contact points of the ultimate layer of the plurality of layers of conductive layers.

Abstract: An acousto-optic deflector with multiple acoustic transducers is described that is suitable for use in substrate processing. In one example a method includes transmitting an optic beam through an acousto-optic deflector, applying an acoustic signal with a phase delay across multiple transducers of the acousto-optic deflector to deflect the beam along a first axis by the acousto-optic deflector, and directing the deflected beam onto a workpiece.

Abstract: An apparatus including a package substrate including a plurality of layers of conductive material, the package substrate including a cavity; and a device in the cavity, wherein an ultimate layer of the plurality of layers of conductive material defines contacts to contact points of the device. An apparatus including a package substrate comprising a plurality of conductive layers and a silicon bridge die disposed between ones of the plurality of conductive layers and an ultimate layer of the plurality of conductive layers defines contact points to contact points of the silicon bridge die; and a logic die coupled to the contact points of the ultimate layer of the plurality of layers of conductive layers.

Abstract: Embodiments of the present disclosure are directed towards interconnect structures for embedded bridge in integrated circuit (IC) package assemblies. In one embodiment, a method includes depositing an electrically insulative layer on a bridge interconnect structure, the bridge interconnect structure including a die contact that is configured to route electrical signals between a first die and a second die, depositing a sacrificial layer on the electrically insulative layer, forming an opening through the sacrificial layer and the electrically insulative layer to expose the die contact and forming a die interconnect of the first die or the second die by depositing an electrically conductive material into the opening. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations for interconnect structures embedded in a package assembly including a bridge. In one embodiment, a package assembly may include a package substrate, a bridge embedded in the package substrate and including a bridge substrate, and an interconnect structure including a via extending through the package substrate into a surface of the bridge substrate and configured to interface with a conductive feature disposed on or beneath the surface of the bridge substrate. The interconnect structure may be configured to route electrical signals between the conductive feature and a die mounted on the package substrate. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations for using projection patterning in making an electronic substrate with an embedded die. In one embodiment, a method may include providing a die embedded in dielectric material of a substrate, and projecting a laser beam through a mask with a preconfigured pattern to create a projected mask pattern on a surface of the dielectric material in accordance with the preconfigured pattern. The projected mask pattern may include a via disposed over the die. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the present disclosure are directed towards interconnect structures for embedded bridge in integrated circuit (IC) package assemblies. In one embodiment, a method includes depositing an electrically insulative layer on a bridge interconnect structure, the bridge interconnect structure including a die contact that is configured to route electrical signals between a first die and a second die, depositing a sacrificial layer on the electrically insulative layer, forming an opening through the sacrificial layer and the electrically insulative layer to expose the die contact and forming a die interconnect of the first die or the second die by depositing an electrically conductive material into the opening. Other embodiments may be described and/or claimed.

Abstract: A graphics server and method for streaming rendered content via a remote graphics rendering service. One embodiment of the graphics server includes: (1) a frame capturer configured to capture frames of rendered content at a frame rate, (2) an encoder configured to encode captured frames at the frame rate, and (3) a processor configured to cause encoded frames to be transmitted if the rendered content is at least partially changed, and cause a skip-frame message to be transmitted, the skip-frame message configured to cause the frame capturer to forgo capturing and the encoder to forgo encoding if the rendered content is unchanged.

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations for interconnect structures embedded in a package assembly including a bridge. In one embodiment, a package assembly may include a package substrate, a bridge embedded in the package substrate and including a bridge substrate, and an interconnect structure including a via extending through the package substrate into a surface of the bridge substrate and configured to interface with a conductive feature disposed on or beneath the surface of the bridge substrate. The interconnect structure may be configured to route electrical signals between the conductive feature and a die mounted on the package substrate. Other embodiments may be described and/or claimed.

Abstract: Embodiments of preventing unwanted damage to microelectronic substrates from laser drilling are generally described herein. In some embodiments, the method includes forming a microelectronic substrate, and adding a layer of protective material to dielectric material of the microelectronic substrate. The microelectronic substrate is configured for mounting one or more integrated circuits (ICs) thereon and includes interconnection for a plurality of electronic circuits. The protective material is configured to absorb laser energy applied in laser drilling of the microelectronic substrate.

Abstract: A first acousto-optic deflector receives a laser beam. The first acousto-optic deflector diffracts the received laser beam along a first axis. A second acousto-optic deflector receives the diffracted laser beam. The second acousto-optic deflector diffracts the received diffracted laser beam along a second axis.

Abstract: Substrate cores for laser through hole formation are described. Substrate core embodiments include a plurality of reinforcement material layers and a microfiller loaded resin disposed between the plurality of reinforcement material layers. Microfiller and reinforcement materials are selected to reduce opto-thermal mismatch for a laser of a predetermined bandwidth. In embodiments, the reinforcement material may include a fibrous polymer, reducing the thermal contrast with the microfiller loaded resin, and/or include a chromophore that absorbs within the laser bandwidth. In further embodiments, the microfiller is of a material having a high melting temperature to reduce thermal contrast with the reinforcement material.

Abstract: A method of interpolating positron emission tomography (PET) data for reconstructing a PET image, including acquiring PET event data, which was obtained by scanning an object using a PET scanner; generating a two-dimensional line-of-response (LOR) sinogram from the acquired PET event data; determining a plurality of triangles connecting sampling points within the LOR sinogram, wherein adjacent sampling points are connected horizontally row-by-row within the LOR sinogram to determine the plurality of triangles; and determining a uniformly sampled sinogram from the LOR sinogram using the determined plurality of triangles.