Abstract: Methods of forming an inductor using dry processes are described. A cavity is laser drilled in an insulator. A first magnetic material layer is printed in the cavity. An Ag conductive ink is printed on the first magnetic material layer and a second magnetic material layer printed on the ink. The ink has a trace sandwiched between the first and second magnetic material layers that provides a majority of the inductance of the inductor. A protective insulating layer protects the second magnetic material layer from a wet chemistry solution when contacts are formed to the ink. The second magnetic material layer and ink are deposited in or on the cavity.

Abstract: An audio output method applied to an electronic device having a proximity sensor, where the method includes obtaining proximity data of the proximity sensor when the electronic device is coupled to an audio output device and has an audio signal to output, outputting, by an earpiece of the electronic device, the audio signal when the proximity data meets a preset condition, determining a type of the audio output device, and selecting, based on the type of the audio output device, whether to output the audio signal using the audio output device. Hence, an earpiece is enabled to output an audio signal under a specific condition when an electronic device including a mobile phone is coupled to another audio output device, thereby improving user experience.

Abstract: A quantum dot comb laser includes a body defining a lasing cavity and an extension defining an external cavity, the FSR of the lasing cavity being an inverse of an integer multiple of the FSR of the external cavity.

Abstract: A method for processing images, including: determining, subsequent to transmitting content of a target image corresponding to a current processing request to a processor, whether the target image is being used by other processing requests; and in response to the determination that the target image is not being used by the other processing requests, releasing memory utilized by the target image at a target memory, the target memory being used to store a copy corresponding to the target image.

Abstract: An apparatus and method of forming a magnetic inductor circuit. A substrate is provided and a first magnetic layer is formed in contact with one layer of the substrate. A conductive trace is formed in contact with the first magnetic layer. A sacrificial cooper layer protects the magnetic material from wet chemistry process steps. A conductive connection is formed from the conductive trace to the outside substrate, the conductive connection comprising a horizontal connection formed by in-layer plating. A second magnetic layer is formed in contact with the conductive trace. Instead of a horizontal connection, a vertical conductive connection can be formed that is perpendicular to the magnetic layers, by drilling a first via in a second of the magnetic layers, forming a buildup layer, and drilling a second via through the buildup layer, where the buildup layer protects the magnetic layers from wet chemistry processes.

Abstract: Disclosed herein are asymmetric cored integrated circuit (IC) package supports, and related devices and methods. For example, in some embodiments, an IC package support may include a core region having a first face and an opposing second face, a first buildup region at the first face of the core region, and a second buildup region at the second face of the core region. A thickness of the first buildup region may be different than a thickness of the second buildup region. In some embodiments, an inductor may be included in the core region.

Abstract: A vertical-edge double-step sawtooth cutter for preparing high-quality holes of composite material and thereof hybrid stack structure, and has three parts which are a major cutting edge region A, a minor cutting edge region B and a shank region C. The minor cutting edge region B comprises a step vertical-edge region D and a sawtooth cutting region E. This has the step structure and the sawtooth structure which is distributed in the first step, has a recutting function at the inlet and a reverse cutting function at the outlet in the direction opposite to the main cutting motion. The cutter has the vertical edge structure distributed in the second step, and the angle of the second step is a negative value, thereby realizing chip breaking and crushing, reducing scratch to the upper-layer composite material and metal hole walls.

Abstract: A semiconductor device package structure is provided. The semiconductor device package structure includes a substrate, a die coupled to the substrate, and a thermoelectric device. The thermoelectric device may include a P-type semiconductor material, a N-type semiconductor material, and a plurality of interconnect structures to transmit current through the P-type and N-type semiconductor material. In an example, the P-type semiconductor material and the N-type semiconductor material may be at least in part embedded within the substrate. The thermoelectric device has a first side proximal to the die, and a second side separated from the die by the first side.

Abstract: A semiconductor device package structure is provided. The semiconductor device package structure includes a substrate having a cavity, and phase change material within the cavity. In an example, the phase change material has a phase change temperature lower than 120 degree centigrade. A die may be coupled to the substrate. In an example, the semiconductor device package structure includes one or more interconnect structures that are to couple the die to the phase change material within the cavity.

Abstract: An audio output method applied to an electronic device having a proximity sensor, where the method includes obtaining proximity data of the proximity sensor when the electronic device is coupled to an audio output device and has an audio signal to output, outputting, by an earpiece of the electronic device, the audio signal when the proximity data meets a preset condition, determining a type of the audio output device, and selecting, based on the type of the audio output device, whether to output the audio signal using the audio output device. Hence, an earpiece is enabled to output an audio signal under a specific condition when an electronic device including a mobile phone is coupled to another audio output device, thereby improving user experience.

Abstract: Methods of forming an inductor using dry processes are described. A cavity is laser drilled in an insulator. A first magnetic material layer is printed in the cavity. An Ag conductive ink is printed on the first magnetic material layer and a second magnetic material layer printed on the ink. The ink has a trace sandwiched between the first and second magnetic material layers that provides a majority of the inductance of the inductor. A protective insulating layer protects the second magnetic material layer from a wet chemistry solution when contacts are formed to the ink. The second magnetic material layer and ink are deposited in or on the cavity.

Abstract: An electronic device may include a substrate, and the substrate may include one or more layers. The one or more layers may include a first dielectric material and one or more electrical traces. A cavity may be defined in the substrate, and the cavity may be adapted to receive one or more electrical components. One or more lateral traces may extend through a wall of the cavity. The lateral traces may provide electrical communication pathways between the substrate and the electrical components.

Abstract: A computer-implemented method includes identifying a source data object of a distributed computing environment. The distributed computing environment includes two or more storage nodes. The source data object exists as two or more slices. At least one of the slices is replicated on at least two storage nodes. The computer-implemented method further includes associating the source data object with a tape. The tape is written by a tape drive controlled from the distributed computing environment. The computer-implemented method further includes copying the source data object to the tape by, for each source slice of the two or more slices, in sequence: selecting a source node of the two or more storage nodes whereon the source slice is replicated, mounting the tape drive to the source node, appending the source slice to the tape, and unmounting the tape drive.

Abstract: A computer-implemented method includes identifying a source data object of a distributed computing environment. The distributed computing environment includes two or more storage nodes. The source data object exists as two or more slices. At least one of the slices is replicated on at least two storage nodes. The computer-implemented method further includes associating the source data object with a tape. The tape is written by a tape drive controlled from the distributed computing environment. The computer-implemented method further includes copying the source data object to the tape by, for each source slice of the two or more slices, in sequence: selecting a source node of the two or more storage nodes whereon the source slice is replicated, mounting the tape drive to the source node, appending the source slice to the tape, and unmounting the tape drive. A corresponding computer program product and computer system are also disclosed.

Abstract: A quantum dot comb laser includes a body defining a lasing cavity and an extension defining an external cavity, the FSR of the lasing cavity being an inverse of an integer multiple of the FSR of the external cavity.

Abstract: Rendering user interfaces is disclosed including acquiring, using a first thread, a to-be-handled user interface render event, the first thread being a thread on a dynamic language application runtime platform, and the dynamic language application runtime platform being preloaded with a render engine, and calling, using the first thread, a corresponding user interface rendering function provided by the render engine based on an interface that corresponds to the event and that is used to call the render engine.

Abstract: A vehicle can include a battery architecture configured to provide electrical power to motors, accessories, and other components of the vehicle. The architecture can include a controller coupled to multiple battery units. Each battery unit can include a battery and a battery management system. Additionally, each battery unit can be coupled to a controller and to other battery units. Through the use of redundant coupling and redundant data transmitted to and from the controller, battery units, and other components, the architecture can detect a fault and continue to operate while providing an indication of the fault.

Abstract: A graphics server and method for streaming rendered content via a remote graphics rendering service is provided. In one embodiment, the server includes a memory, a graphics renderer, a frame capturer, an encoder, and a processor. The memory is configured to store a pre-computed skip-frame message indicative to a client to re-use a previously transmitted frame of the video stream. The graphics renderer is configured to identify when rendered content has not changed. When the graphics renderer identifies that the rendered content has not changed, the processor is configured to cause: (1) the frame capturer to not capture the frames of the rendered content; (2) the encoder to not encode the frames of the rendered content; and (3) the pre-encoded skip-frame message to be transmitted without requiring any pixel processing.

Abstract: Embodiments may relate to a semiconductor package that includes a die and a glass core coupled with the die. The glass core may include a cavity with an interconnect structure therein. The interconnect structure may include pads on a first side that are coupled with the die, and pads on a second side opposite the first side. Other embodiments may be described and/or claimed.

Abstract: Embodiments herein relate to integrating FIVR switching circuitry into a substrate that has a first side and a second side opposite the first side, where the first side of the substrate to electrically couple with a die and to provide voltage to the die and the second side of the substrate is to couple with an input voltage source. In embodiments, the FIVR switching circuitry may be printed onto the substrate using OFET, CNT, or other transistor technology, or may be included in a separate die that is incorporated within the substrate.