Abstract: A semiconductor device package structure is provided. The semiconductor device package structure includes a substrate, a die coupled to the substrate, and a thermoelectric device. The thermoelectric device may include a P-type semiconductor material, a N-type semiconductor material, and a plurality of interconnect structures to transmit current through the P-type and N-type semiconductor material. In an example, the P-type semiconductor material and the N-type semiconductor material may be at least in part embedded within the substrate. The thermoelectric device has a first side proximal to the die, and a second side separated from the die by the first side.

Abstract: An audio output method applied to an electronic device having a proximity sensor, where the method includes obtaining proximity data of the proximity sensor when the electronic device is coupled to an audio output device and has an audio signal to output, outputting, by an earpiece of the electronic device, the audio signal when the proximity data meets a preset condition, determining a type of the audio output device, and selecting, based on the type of the audio output device, whether to output the audio signal using the audio output device. Hence, an earpiece is enabled to output an audio signal under a specific condition when an electronic device including a mobile phone is coupled to another audio output device, thereby improving user experience.

Abstract: Methods of forming an inductor using dry processes are described. A cavity is laser drilled in an insulator. A first magnetic material layer is printed in the cavity. An Ag conductive ink is printed on the first magnetic material layer and a second magnetic material layer printed on the ink. The ink has a trace sandwiched between the first and second magnetic material layers that provides a majority of the inductance of the inductor. A protective insulating layer protects the second magnetic material layer from a wet chemistry solution when contacts are formed to the ink. The second magnetic material layer and ink are deposited in or on the cavity.

Abstract: An electronic device may include a substrate, and the substrate may include one or more layers. The one or more layers may include a first dielectric material and one or more electrical traces. A cavity may be defined in the substrate, and the cavity may be adapted to receive one or more electrical components. One or more lateral traces may extend through a wall of the cavity. The lateral traces may provide electrical communication pathways between the substrate and the electrical components.

Abstract: A computer-implemented method includes identifying a source data object of a distributed computing environment. The distributed computing environment includes two or more storage nodes. The source data object exists as two or more slices. At least one of the slices is replicated on at least two storage nodes. The computer-implemented method further includes associating the source data object with a tape. The tape is written by a tape drive controlled from the distributed computing environment. The computer-implemented method further includes copying the source data object to the tape by, for each source slice of the two or more slices, in sequence: selecting a source node of the two or more storage nodes whereon the source slice is replicated, mounting the tape drive to the source node, appending the source slice to the tape, and unmounting the tape drive.

Abstract: A computer-implemented method includes identifying a source data object of a distributed computing environment. The distributed computing environment includes two or more storage nodes. The source data object exists as two or more slices. At least one of the slices is replicated on at least two storage nodes. The computer-implemented method further includes associating the source data object with a tape. The tape is written by a tape drive controlled from the distributed computing environment. The computer-implemented method further includes copying the source data object to the tape by, for each source slice of the two or more slices, in sequence: selecting a source node of the two or more storage nodes whereon the source slice is replicated, mounting the tape drive to the source node, appending the source slice to the tape, and unmounting the tape drive. A corresponding computer program product and computer system are also disclosed.

Abstract: A quantum dot comb laser includes a body defining a lasing cavity and an extension defining an external cavity, the FSR of the lasing cavity being an inverse of an integer multiple of the FSR of the external cavity.

Abstract: A vehicle can include a battery architecture configured to provide electrical power to motors, accessories, and other components of the vehicle. The architecture can include a controller coupled to multiple battery units. Each battery unit can include a battery and a battery management system. Additionally, each battery unit can be coupled to a controller and to other battery units. Through the use of redundant coupling and redundant data transmitted to and from the controller, battery units, and other components, the architecture can detect a fault and continue to operate while providing an indication of the fault.

Abstract: Rendering user interfaces is disclosed including acquiring, using a first thread, a to-be-handled user interface render event, the first thread being a thread on a dynamic language application runtime platform, and the dynamic language application runtime platform being preloaded with a render engine, and calling, using the first thread, a corresponding user interface rendering function provided by the render engine based on an interface that corresponds to the event and that is used to call the render engine.

Abstract: A graphics server and method for streaming rendered content via a remote graphics rendering service is provided. In one embodiment, the server includes a memory, a graphics renderer, a frame capturer, an encoder, and a processor. The memory is configured to store a pre-computed skip-frame message indicative to a client to re-use a previously transmitted frame of the video stream. The graphics renderer is configured to identify when rendered content has not changed. When the graphics renderer identifies that the rendered content has not changed, the processor is configured to cause: (1) the frame capturer to not capture the frames of the rendered content; (2) the encoder to not encode the frames of the rendered content; and (3) the pre-encoded skip-frame message to be transmitted without requiring any pixel processing.

Abstract: Embodiments may relate to a semiconductor package that includes a die and a glass core coupled with the die. The glass core may include a cavity with an interconnect structure therein. The interconnect structure may include pads on a first side that are coupled with the die, and pads on a second side opposite the first side. Other embodiments may be described and/or claimed.

Abstract: An apparatus and method of forming a magnetic inductor circuit. A substrate is provided and a first magnetic layer is formed in contact with one layer of the substrate. A conductive trace is formed in contact with the first magnetic layer. A sacrificial cooper layer protects the magnetic material from wet chemistry process steps. A conductive connection is formed from the conductive trace to the outside substrate, the conductive connection comprising a horizontal connection formed by in-layer plating A second magnetic layer is formed in contact with the conductive trace. Instead of a horizontal connection, a vertical conductive connection can be formed that is perpendicular to the magnetic layers, by drilling a first via in a second of the magnetic layers, forming a buildup layer, and drilling a second via through the buildup layer, where the buildup layer protects the magnetic layers from wet chemistry processes.

Abstract: Embodiments herein relate to integrating FIVR switching circuitry into a substrate that has a first side and a second side opposite the first side, where the first side of the substrate to electrically couple with a die and to provide voltage to the die and the second side of the substrate is to couple with an input voltage source. In embodiments, the FIVR switching circuitry may be printed onto the substrate using OFET, CNT, or other transistor technology, or may be included in a separate die that is incorporated within the substrate.

Abstract: Techniques are provided for an inductor at a first level interface between a first die and a second die. In an example, the inductor can include a winding and a core disposed inside the winding. The winding can include first conductive traces of a first die, second conductive traces of a second die, and a plurality of connectors configured to connect the first die with the second die. Each connector of the plurality of connecters can be located between a trace of the first conductive traces and a corresponding trace of the second conductive traces.

Abstract: Techniques are provided for an inductor at a second level interface between a first substrate and a second substrate. In an example, the inductor can include a winding and a core disposed inside the winding. The winding can include first conductive traces of a first substrate, second conductive traces of a second non-semiconductor substrate, and a plurality of connectors configured to connect the first substrate with the second substrate. Each connector of the plurality of connecters can be located between a trace of the first conductive traces and a corresponding trace of the second conductive traces.

Abstract: An aerial-and-ground data combined gravity conversion methodincludes the following steps: calculate the first estimated ground gravity by the Runge-Kutta format 1, and calculate the first error between the first estimated ground gravity and the measured ground gravity; calculate the second estimated ground gravity by the Runge-Kutta format 2, and calculate the second error between the second estimated ground gravity and the measured ground gravity; and select the smaller one from the first and second errors, use the corresponding Runge-Kutta format as the Runge-Kutta format for gravity conversion, and finish the gravity data conversion using the mentioned Runge-Kutta format.

Abstract: Disclosed herein are magnetic structures in integrated circuit (IC) package supports, as well as related methods and devices. For example, in some embodiments, an IC package support may include a conductive line and a magnetic structure around a top surface of the conductive line and side surfaces of the conductive line. The magnetic structure may have a tapered shape that narrows toward the conductive line.

Abstract: An audio output method applied to an electronic device having a proximity sensor, where the method includes obtaining proximity data of the proximity sensor when the electronic device is coupled to an audio output device and has an audio signal to output, outputting, by an earpiece of the electronic device, the audio signal when the proximity data meets a preset condition, determining a type of the audio output device, and selecting, based on the type of the audio output device, whether to output the audio signal using the audio output device. Hence, an earpiece is enabled to output an audio signal under a specific condition when an electronic device including a mobile phone is coupled to another audio output device, thereby improving user experience.

Abstract: Techniques for fabricating a package substrate comprising a via, a conductive line, and a pad are described. The package substrate can be included in a semiconductor package. For one technique, a package substrate includes: a pad in a dielectric layer; a via; and a conductive line. The via and the conductive line can be part of a structure. Alternatively, the conductive line can be adjacent to the via. The dielectric layer can include a pocket above the pad. One or more portions of the via may be formed in the pocket above the pad. Zero or more portions of the via can be formed on the dielectric layer outside the pocket. In some scenarios, no pad is above the via. The package substrate provides several advantages. One exemplary advantage is that the package substrate can assist with increasing an input/output density per millimeter per layer (IO/mm/layer) of the package substrate.

Abstract: Embodiments include semiconductor packages and a method of forming the semiconductor packages. A semiconductor package includes a trace disposed on a conductive layer. The semiconductor package has one or more adhesion anchoring points and a plurality of portions on the trace. An adhesion anchoring point is between two portions on the trace. A surface roughness of an adhesion anchoring point is greater than a surface roughness of a portion on the trace. The trace may be a high-speed input/output (HSIO) trace. The semiconductor package may include via pads disposed on each end of the trace, and a dielectric disposed on the trace. The dielectric is patterned to form openings on the dielectric that expose second portions on the trace. The dielectric remains over the portions. The semiconductor package may have a chemical treatment disposed on the exposed openings on the trace to form the adhesion anchoring points.