Abstract: The present invention comprises freeform variable focusing optical component, optical module, focus controller, display unit, display controller and processing unit. With the freeform variable focusing optical component, the augmented reality head up display system of the present invention can overcome limitation on the number of virtual images for various focal length of the system and support visual information to vehicle driver comfortably decreasing the fatigue of eye as reducing the eyes distributed focus change between objects and display.

Abstract: A polarizing plate and an optical display apparatus are provided. A polarizing plate includes: a polarizer; and a first retardation layer and a second retardation layer sequentially stacked on a lower surface of the polarizer, and the first retardation layer has a short wavelength dispersion of about 1 to about 1.03, a long wavelength dispersion of about 0.98 to about 1, and an in-plane retardation of about 180 nm to about 220 nm at a wavelength of 550 nm, the second retardation layer has a short wavelength dispersion of about 1 to about 1.1, a long wavelength dispersion of about 0.96 to about 1, and an in-plane retardation Re of about 70 nm to about 120 nm at a wavelength of 550 nm, and a ratio of out-of-plane retardation of the second retardation layer at a wavelength of 550 nm to thickness thereof is about ?33 nm/?m to about ?15 nm/?m.

Abstract: A polarizing plate and an optical display apparatus including the same are provided. A polarizing plate includes a polarizer; and a first retardation layer and a second retardation layer sequentially stacked on a lower surface of the polarizer, and the first retardation layer has an in-plane retardation of about 180 nm to about 220 nm at a wavelength of about 550 nm; and the second retardation layer has an in-plane retardation of about 80 nm to about 100 nm at a wavelength of about 550 nm.

Abstract: A semiconductor package may comrpise a substrate, a chip structure on the substrate, a passive element structure in the substrate and including a passive element, and a stiffening structure at least partially overlapping the passive element structure. A top surface of the passive element may be below a top surface of the substrate.

Abstract: Disclosed is a semiconductor package comprising an interposer, a first semiconductor die below the interposer, and a first dummy die, a second dummy die, and a second semiconductor die over the interposer. The first semiconductor die, the second semiconductor die, the first dummy die, and the second dummy die overlap the interposer. The first semiconductor die overlaps the second semiconductor die. The second semiconductor die is between the first dummy die and the second dummy die.

Abstract: Provided is a polarizing plate and an optical display device comprising same, the polarizing plate comprising: a polarizer; and a stack body of a first phase difference layer and a second phase difference layer stacked on a lower surface of the polarizer, wherein the first phase difference layer satisfies Equation 1, the second phase difference layer satisfies Equation 2, the sum of an in-plane phase difference at a wavelength of 550 nm between the first phase difference layer and the second phase difference layer is about 100 nm to about 110 nm, the sum of a thickness direction phase difference at a wavelength of 550 nm between the first phase difference layer and the second phase difference layer is about ?30 nm to about +10 nm, and the second phase difference layer comprises a fluorine-based phase difference layer.

Abstract: A polarizing plate for an optical display apparatus includes: a polarizer; and a retardation layer laminated on one surface of the polarizer, wherein the retardation layer includes a retardation film satisfying nx>nz>ny at a wavelength of 550 nm (Here, nx, ny, and nz refer to a refractive index of the retardation film in a slow axis direction, a refractive index of the retardation film in a fast axis direction, and a refractive index of the retardation film in a thickness direction at a wavelength of 550 nm.), an orientation direction of a main chain of a resin contained in the retardation film is about ?5° to about +5° relative to a light absorption axis of the polarizer, and the retardation film has a degree of biaxiality of about 0.3 to about 0.7 at a wavelength of 550 nm.

Abstract: A semiconductor package includes a redistribution line structure that has a redistribution line layer. A first semiconductor chip is disposed above the redistribution line structure and includes a first region with a first thickness and a second region with a second thickness that is less than the first thickness. A sub-semiconductor package includes a second semiconductor chip and is disposed above the second region of the first semiconductor chip. A silicon through via penetrates the second region of the first semiconductor chip and electrically connects the sub-semiconductor package with the redistribution line structure. A sealant seals at least a portion of each of the first semiconductor chip and the sub-semiconductor package. The sub-semiconductor package is disposed within the second region of the first semiconductor chip.

Abstract: A vehicle seat includes: a seat back frame constituting a framework of the vehicle seat; a retractor received in an internal space of the seat back frame; and headrest poles which vertically extend through the retractor and are mounted to the retractor. The retractor may be mounted at an upper end of the seat back frame. By mounting the retractor within the seat back frame, instead of a separate mounting space, the thickness of the seat back in the forward/backward directions may be reduced, thereby thinning the seat and enlarging the passenger compartment.

Abstract: A polarizing plate and an optical display device are disclosed. A polarizing plate includes a polarizer, and a retardation layer laminated on a surface of the polarizer, the retardation layer includes a retardation film that satisfies a relationship of nx>nz>ny, where nx, ny, and nz are indexes of refraction of the retardation film in a slow axis direction, a fast axis direction, and a thickness direction of the retardation film, respectively, at a wavelength of 550 nm, an alignment direction of a main chain of a resin contained in the retardation film with respect to a light transmission axis of the polarizer is in a range from ?5° to +5°, and the retardation film has a degree of biaxiality of 0.2 to 0.6 at the wavelength of 550 nm.

Abstract: A stacked semiconductor package includes: a first semiconductor package that includes a first region and a second region and includes a semiconductor chip including a first element at the first region and a second element at the second region; a second semiconductor package on the first region of the first semiconductor package; and a member for heat dissipation at the second region of the first semiconductor package and overlapping at least a portion of the second element in a vertical direction perpendicular to an in-plane direction of the first semiconductor package.

Abstract: Disclosed are heat radiation devices and semiconductor apparatuses including the same. The semiconductor apparatus comprises a substrate, a plurality of semiconductor devices on the substrate and arranged in a first direction as a horizontal direction, and a heat radiation device on the plurality of semiconductor devices. The heat radiation device provides a plurality of vapor chambers. The plurality of vapor chambers are spaced apart from each other in the first direction and are not connected to each other.

Abstract: A polarizing plate and an optical display apparatus including the same are provided. The polarizing plate includes: a polarizer; and a first retardation layer and a second retardation layer sequentially stacked on a lower surface of the polarizer. The first retardation layer has an in-plane retardation (Re) of 200 nm to 250 nm at a wavelength of 550 nm; the second retardation layer has an in-plane retardation (Re) of 80 nm to 140 nm at a wavelength of 550 nm; and the polarizing plate has a total transmittance difference of 2% or more between total transmittance at a wavelength of 450 nm and total transmittance at a wavelength of 420 nm.

Abstract: A semiconductor package may include vertically-stacked semiconductor chips and first, second, and third connection terminals connecting the semiconductor chips to each other. Each of the semiconductor chips may include a semiconductor substrate, an interconnection layer on the semiconductor substrate, penetration electrodes connected to the interconnection layer through the semiconductor substrate, and first, second, and third groups on the interconnection layer. The interconnection layer may include an insulating layer and first and second metal layers in the insulating layer. The first and second groups may be in contact with the second metal layer, and the third group may be spaced apart from the second metal layer. Each of the first and third groups may include pads connected to a corresponding one of the first and third connection terminals in a many-to-one manner. The second group may include pads connected to the second connection terminal in a one-to-one manner.

Abstract: An optical display apparatus includes a liquid crystal panel and a viewer-side polarizing plate stacked on a surface of the liquid crystal panel, and the liquid crystal panel includes a liquid crystal layer having a pre-tilt angle of 2° to 5°, and the viewer-side polarizing plate includes a first retardation layer including a positive A layer, a second retardation layer including a positive C layer, and a polarizer sequentially stacked from the liquid crystal panel, and satisfies Equation 1.

Abstract: A semiconductor package includes a first package substrate, a first semiconductor chip on the first package substrate, a plurality of first chip bumps between the first package substrate and the first semiconductor chip, a plurality of second semiconductor chips sequentially stacked on the first semiconductor chip, a molding member which covers the plurality of second semiconductor chips, on the first semiconductor chip, and a thermoelectric cooling layer attached onto a surface of the first semiconductor chip. The thermoelectric cooling layer includes a cooling material layer extending along the surface of the first semiconductor chip, a first electrode pattern which surrounds the plurality of first chip bumps from a planar viewpoint, in the cooling material layer, and a second electrode pattern which surrounds the first electrode pattern from the planar viewpoint, in the cooling material layer.

Abstract: A semiconductor package includes a substrate, a semiconductor die on the substrate, a heat spreader covering the semiconductor die. The heat spreader includes an upper plate portion, a base portion, and a sidewall portion connecting the upper plate portion to the base portion. The upper plate portion and the sidewall portion define an underlying cavity. The base portion is disposed on the substrate, extends from an exterior side of the sidewall portion in a horizontal direction, includes a plurality of first through holes, has a bottom surface at the same level as a bottom surface of the sidewall portion, and has a height in a vertical direction from a lowermost portion to an uppermost portion thereof less than or equal to that of the sidewall portion.

Abstract: A semiconductor package includes a redistribution layer structure, a semiconductor structure on the redistribution layer structure, at least one heat dissipation structure on the semiconductor structure, where the at least one heat dissipation structure may include a first epoxy molding compound, a molding material for molding the semiconductor structure and the at least one heat dissipation structure, on the redistribution layer structure, where the molding material may include a second epoxy molding compound, where the first epoxy molding compound may have higher thermal conductivity than the second epoxy molding compound.

Abstract: Provided are a polarizing plate and an optical display device comprising same, the polarizing plate comprising a polarizer and a protective layer formed on at least one surface of the polarizer, wherein: the polarizing plate comprises a first area and a second area formed within an image display area; the first area and the second area have different single transmittances in the same wavelength; and the first area has a single transmittance of 45% to 85%, a maximum absorbance of 1.0 to 5.0 in a wavelength in a range from about 270 nm to about 325 nm, a maximum absorbance of 0.5 to 4.0 in a wavelength which exceeds about 325 nm and is lower than or equal to 420 nm, and a maximum absorbance of 0.5 or less in a wavelength in a range from about 500 nm to about 800 nm.

Abstract: The present invention relates to a current sensing device comprising: a bus bar including a plurality of low-resistance metal portions separated from each other with a resistance portion therebetween; a printed circuit board arranged below the bus bar; a plurality of fixing pins which are joined to the metal portions of the bus bar to fix the bus bar on the printed circuit board and provide a current path between the metal portions and the printed circuit board; and at least one Hall sensor module. At least a portion of the Hall sensor module is inserted into a sensor hole formed in at least one of the low-resistance metal portions of the bus bar.