Patents by Inventor Choon Kim

Choon Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220187524
    Abstract: A polarizing plate and an optical display apparatus including the same. The polarizing plate includes: a polarizer; a first retardation layer; and a second retardation layer, the first retardation layer and the second retardation layer being sequentially laminated on a lower surface of the polarizer, wherein the first retardation layer has a short wavelength dispersion of about 1 to about 1.03, a long wavelength dispersion of about 0.98 to about 1, and an in-plane retardation of about 220 nm to about 270 nm at a wavelength of about 550 nm, the second retardation layer has a short wavelength dispersion of about 1 to about 1.1, a long wavelength dispersion of about 0.96 to about 1, and an in-plane retardation of about 80 nm to about 130 nm at a wavelength of about 550 nm, and a ratio (Rth/d) of out-of-plane retardation (Rth, unit: nm) of the second retardation layer at a wavelength of about 550 nm to thickness (d, unit: ?m) of the second retardation layer ranges from about ?33 nm/?m to about ?15 nm/?m.
    Type: Application
    Filed: March 19, 2020
    Publication date: June 16, 2022
    Inventors: Jun Mo KOO, Bong Choon KIM, Jung Hun YOU, Sang Hum LEE, Dong Yoon SHIN
  • Patent number: 11362240
    Abstract: The invention refers to a light emitting device including a semiconductor chip having a main radiation surface, which emits UV light in operation, a phosphor, which is arranged in the radiation beam of the UV light, absorbs partially the UV light, wherein the phosphor converts the UV light into visible light so that the device emits mixed light comprising the UV light as well as visible light.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: June 14, 2022
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Choon Kim Lim, Choo Kean Lim, Hui Chiang Teoh
  • Patent number: 11356545
    Abstract: A communication terminal and a method of providing a unified natural language interface to the same are disclosed. The method includes: determining, when text information containing many characters is created, whether the text information conforms to one of preset grammatical constraints; extracting, when the text information conforms to one of the grammatical constraints, tokens of one or more of characters from the text information, and extracting, when the text information does not conform to one of the grammatical constraints, one or more characters having an attribute probability higher than a reference probability as a token; and analyzing the extracted tokens to determine a function to handle the extracted tokens, and executing the determined function based on the extracted tokens.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: June 7, 2022
    Assignees: Samsung Electronics Co., Ltd., Sogang University Research & Commercialization Foundation
    Inventors: Myeong Gi Jeong, Young Hee Park, Kwang Choon Kim, Jung Yun Seo, Choong Nyoung Seon
  • Patent number: 11348906
    Abstract: An optoelectronic device comprises a phosphor plate, an optoelectronic chip comprising a layer stack of a first optoelectronic semiconductor layer and a second optoelectronic semiconductor layer, a first electrode, and a second electrode. The optoelectronic chip is attached to the phosphor plate, so that the second optoelectronic semiconductor layer is arranged between the phosphor plate and the first optoelectronic semiconductor layer. The first electrode and the second electrode are arranged on a first main surface of the first optoelectronic semiconductor layer on a side remote from the phosphor plate. The second electrode directly contacts the first optoelectronic semiconductor layer.
    Type: Grant
    Filed: March 21, 2018
    Date of Patent: May 31, 2022
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventor: Choon Kim Lim
  • Patent number: 11338136
    Abstract: A cranial nerve control device includes: goggles worn on a patient head; a functional electric stimulator adapted to apply peripheral nerve stimulation to a patient; a plurality of module guides provided to the goggles; a functional electric stimulator controller adapted to control the functional electric stimulator; a transcranial current stimulator-combined near-infrared spectroscopy measurement module controller adapted to control the transcranial current stimulator-combined functional near-infrared spectroscopy measurement module; and a simulation device connected to both the transcranial current stimulator-combined near-infrared spectroscopy measurement module controller and the functional electric stimulator to provide feedback of a transcranial current stimulation control signal to the transcranial current stimulator and feedback of a functional electrical stimulation control signal to the functional electric stimulator while monitoring the patient brain activity.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: May 24, 2022
    Assignee: CYBERMEDIC CO., LTD.
    Inventors: Ho Choon Jeong, Hyun Hee Lee, Sang Sea Lee, Myoung Choon Kim
  • Publication number: 20220075108
    Abstract: A polarizing plate and an optical display including the same are provided. A polarizing plate includes a polarizer; and a first retardation layer and a second retardation layer sequentially stacked on a lower surface of the polarizer, and the first retardation layer has a degree of biaxiality (NZ) of less than 0 at a wavelength of 550 nm and is a non-liquid crystal layer, and the second retardation layer has a degree of biaxiality (NZ) of greater than 1 at a wavelength of 550 nm.
    Type: Application
    Filed: September 1, 2021
    Publication date: March 10, 2022
    Inventors: Jun Mo KOO, Bong Choon KIM, Sang Hum LEE, Jung Hun YOU, Hee Seop KIM, Kwang Ho SHIN
  • Publication number: 20220026614
    Abstract: A polarizing plate and an optical display apparatus including the same are provided. A polarizing plate includes a polarizer; and a first retardation layer and a second retardation layer sequentially stacked on a lower surface of the polarizer, and the first retardation layer has an in-plane retardation of about 180 nm to about 220 nm at a wavelength of about 550 nm; and the second retardation layer has an in-plane retardation of about 80 nm to about 100 nm at a wavelength of about 550 nm.
    Type: Application
    Filed: July 21, 2021
    Publication date: January 27, 2022
    Inventors: Bong Choon KIM, Jun Mo KOO, Dong Yoon SHIN, Jung Hun YOU, Sang Hum LEE
  • Publication number: 20210398870
    Abstract: A chip on film package includes: a flexible base film having a first surface and a second surface opposite to each other, and having a chip mounting region on the first surface; a plurality of wirings extending in a first direction toward the chip mounting region; a semiconductor chip mounted in the chip mounting region on the first surface of the base film and electrically connected to the wirings; a pair of first heat dissipation members on the first surface of the base film and spaced apart from the semiconductor chip, and extending in a second direction perpendicular to the first direction; and a second heat dissipation member on the first surface of the base film and covering the semiconductor chip and the pair of first heat dissipation members.
    Type: Application
    Filed: August 31, 2021
    Publication date: December 23, 2021
    Inventors: Seung-Tae HWANG, Jae-Choon KIM, Kyung-Suk OH, Woon-Bae KIM, Jae-Min JUNG
  • Patent number: 11205604
    Abstract: A semiconductor package includes a semiconductor chip having a first surface that is an active surface and a second surface opposing the first surface, a first redistribution portion disposed on the first surface, the first redistribution portion including a lower wiring layer electrically connected to the semiconductor chip, a thermal conductive layer disposed on the second surface of the semiconductor chip, a sealing layer surrounding a side surface of the semiconductor chip and a side surface of the thermal conductive layer, and a second redistribution portion disposed on the sealing layer, the second redistribution portion including a first upper wiring layer connected to the thermal conductive layer, the second redistribution portion including a second upper wiring layer electrically connected to the semiconductor chip.
    Type: Grant
    Filed: October 1, 2018
    Date of Patent: December 21, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Choon Kim, Woo Hyun Park, Eon Soo Jang, Young Sang Cho
  • Publication number: 20210336230
    Abstract: Provided is a circularly polarizing plate capable of improving the tone of reflective color sense by using a retardation film having flat dispersion characteristics; and an OLED device comprising the circularly polarizing plate.
    Type: Application
    Filed: November 4, 2019
    Publication date: October 28, 2021
    Inventors: Yeon Keun LEE, Hyun Hee SON, Mun Kyu JOO, Deok Hwan KIM, Dong Choon KIM
  • Publication number: 20210325590
    Abstract: Provided is a circularly polarizing plate capable of improving a reflection color by using a retardation film with flat dispersion characteristics, and an OLED device comprising the circularly polarizing plate.
    Type: Application
    Filed: November 4, 2019
    Publication date: October 21, 2021
    Inventors: Yeon Keun LEE, Hyun Hee SON, Mun Kyu JOO, Deok Hwan KIM, Dong Choon KIM
  • Patent number: 11107743
    Abstract: A chip on film package includes; a flexible base film having a first surface and a second surface opposite to each other, and having a chip mounting region on the first surface; a plurality of wirings extending in a first direction toward the chip mounting region; a semiconductor chip mounted in the chip mounting region on the first surface of the base film and electrically connected to the wirings; a pair of first heat dissipation members on the first surface of the base film and spaced apart from the semiconductor chip, and extending in a second direction perpendicular to the first direction; and a second heat dissipation member on the first surface of the base film and covering the semiconductor chip and the pair of first heat dissipation members.
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: August 31, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung-Tae Hwang, Jae-Choon Kim, Kyung-Suk Oh, Woon-Bae Kim, Jae-Min Jung
  • Publication number: 20210202462
    Abstract: A semiconductor package includes a first semiconductor chip on a substrate, a second semiconductor chip on the substrate and spaced apart from the first semiconductor device, a mold layer on the substrate and covering sides of the first and second semiconductor chips, and an image sensor unit on the first and second semiconductor chips and the mold layer. The image sensor unit is electrically connected to the first semiconductor chip.
    Type: Application
    Filed: March 17, 2021
    Publication date: July 1, 2021
    Inventors: JICHUL KIM, CHAJEA JO, SANG-UK HAN, KYOUNG SOON CHO, JAE CHOON KIM, WOOHYUN PARK
  • Patent number: 11004760
    Abstract: A chip structure is provided. The chip structure includes: a first lower chip structure; and an upper chip structure on the first lower chip structure and having a pixel array region. The first lower chip structure includes: a first lower semiconductor substrate having a first side and a second side opposing each other; a first portion on the first side of the first lower semiconductor substrate; and a second portion on the second side of the first lower semiconductor substrate, the first portion of the first lower chip structure includes a gate wiring, the second portion of the first lower chip structure includes a second side wiring and a heating element, and the heating element is on the same plane as that of the second side wiring and has a length greater than that of the second side wiring.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: May 11, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Woo Hyun Park, Jae Choon Kim
  • Patent number: 10993185
    Abstract: An apparatus and method for reducing power consumption of a portable terminal are provided. More particularly, an apparatus and method for reducing power consumption generated in an idle state in order to solve a power consumption problem in a portable terminal are provided. The apparatus includes a state determination unit which is configured independently from an application processor for controlling applications and which wakes up when entering an idle mode to allow the application processor to sleep, and thereafter determines a state of the portable terminal, and if it is determined that the portable terminal escapes from the idle mode, allows the application processor to wake up.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: April 27, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hee-Jun Song, Kwang-Choon Kim, Nam-Woo Kim, Sung Kwon, Yu-Jin Lee
  • Publication number: 20210120603
    Abstract: A method of controlling, by using a mobile terminal, at least one Bluetooth Low Energy (BLE) device is provided. The method includes searching for at least one BLE device, displaying a BLE device list, including the at least one searched for BLE device, on a display unit of the mobile terminal, receiving an input of selection of a BLE device from the BLE device list, receiving an input of user added information from a user regarding the selected BLE device, and mapping and storing property information and the user added information regarding the selected BLE device.
    Type: Application
    Filed: December 28, 2020
    Publication date: April 22, 2021
    Inventors: Ju-youn LEE, Sang-hyup LEE, Min-jeong KO, Kwang-choon KIM, Jung-won SUH, Seung-hyuck SHIN, Sung-jin YOON
  • Patent number: 10985152
    Abstract: A semiconductor package includes a first semiconductor chip on a substrate, a second semiconductor chip on the substrate and spaced apart from the first semiconductor device, a mold layer on the substrate and covering sides of the first and second semiconductor chips, and an image sensor unit on the first and second semiconductor chips and the mold layer. The image sensor unit is electrically connected to the first semiconductor chip.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: April 20, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jichul Kim, Chajea Jo, Sang-Uk Han, Kyoung Soon Cho, Jae Choon Kim, Woohyun Park
  • Publication number: 20210098432
    Abstract: An optoelectronic device comprises a phosphor plate, an optoelectronic chip comprising a layer stack of a first optoelectronic semiconductor layer and a second optoelectronic semiconductor layer, a first electrode, and a second electrode. The optoelectronic chip is attached to the phosphor plate, so that the second optoelectronic semiconductor layer is arranged between the phosphor plate and the first optoelectronic semiconductor layer. The first electrode and the second electrode are arranged on a first main surface of the first optoelectronic semiconductor layer on a side remote from the phosphor plate. The second electrode directly contacts the first optoelectronic semiconductor layer.
    Type: Application
    Filed: March 21, 2018
    Publication date: April 1, 2021
    Inventor: Choon Kim LIM
  • Publication number: 20210083160
    Abstract: A semiconductor device and a method for producing a carrier element suitable for a semiconductor device are disclosed. In an embodiment a semiconductor device includes a carrier element including a carrier layer having a first depression extending from a first main surface of the carrier layer in a direction of a second main surface of the carrier layer opposite the first main surface and a metal substrate and an electrically insulating layer on at least a portion of the metal substrate, a first electrically conductive filling component arranged in the first depression in a form-fitting manner, the electrically insulating layer being arranged between the metal substrate and the first filling component and a semiconductor chip arranged on the carrier element, wherein the electrically insulating layer is an anodization layer.
    Type: Application
    Filed: December 14, 2017
    Publication date: March 18, 2021
    Inventors: Choo Kean Lim, Choon Keat Or, Siew Yan Chua, Choon Kim Lim
  • Patent number: 10934404
    Abstract: The present disclosure is an acryl film formed from a main dope solution including an acryl resin shown in the following formula 1 and CSR particles, and peel strength measured in peeling speed of 0.5 mpm is 20 gf/2 inch or less, tear strength is 6 gf or more, has excellent peel strength, thereby visual stain by thickness unevenness is improved, and having excellent tear strength and good brittleness. a and b are an integer and 1 or more. MMA-BMA wherein, MMA is methyl methacrylate unit and BMA is butyl methacrylate unit.
    Type: Grant
    Filed: June 18, 2018
    Date of Patent: March 2, 2021
    Assignee: HYOSUNG CHEMICAL CORPORATION
    Inventors: Young Soo Kim, Kyung Soo Kim, Ho Jun Lee, Hyun Woo Choi, Hyeok Mo Kang, Hyun Suk Chung, Bong Choon Kim, Jong Hyuk Eun