Abstract: A semiconductor package is provided which includes a redistribution substrate, an interconnect substrate on the redistribution substrate, a metal layer on the semiconductor chip, a semiconductor chip on the redistribution substrate and in the hole of the interconnect substrate, and a mold layer in a gap between the semiconductor chip and the interconnect substrate. The interconnect substrate includes a hole penetrating thereinside. The interconnect substrate includes base layers and a conductive member extending through the base layers. A top surface of the interconnect substrate is positioned either above or below the level of the top surface of the metal layer.

Abstract: A polarizing plate and an optical display apparatus are provided. A polarizing plate includes: a polarizer; and a first retardation layer and a second retardation layer sequentially stacked on a lower surface of the polarizer, and the first retardation layer has a short wavelength dispersion of about 1 to about 1.03, a long wavelength dispersion of about 0.98 to about 1, and an in-plane retardation of about 180 nm to about 220 nm at a wavelength of 550 nm, the second retardation layer has a short wavelength dispersion of about 1 to about 1.1, a long wavelength dispersion of about 0.96 to about 1, and an in-plane retardation Re of about 70 nm to about 120 nm at a wavelength of 550 nm, and a ratio of out-of-plane retardation of the second retardation layer at a wavelength of 550 nm to thickness thereof is about ?33 nm/?m to about ?15 nm/?m.

Abstract: A method of controlling, by using a mobile terminal, at least one Bluetooth Low Energy (BLE) device is provided. The method includes searching for at least one BLE device, displaying a BLE device list, including the at least one searched for BLE device, on a display unit of the mobile terminal, receiving an input of selection of a BLE device from the BLE device list, receiving an input of user added information from a user regarding the selected BLE device, and mapping and storing property information and the user added information regarding the selected BLE device.

Abstract: A cranial nerve control device includes: goggles worn on a patient head; a functional electric stimulator adapted to apply peripheral nerve stimulation to a patient; a plurality of module guides provided to the goggles; a functional electric stimulator controller adapted to control the functional electric stimulator; a transcranial current stimulator-combined near-infrared spectroscopy measurement module controller adapted to control the transcranial current stimulator-combined functional near-infrared spectroscopy measurement module; and a simulation device connected to both the transcranial current stimulator-combined near-infrared spectroscopy measurement module controller and the functional electric stimulator to provide feedback of a transcranial current stimulation control signal to the transcranial current stimulator and feedback of a functional electrical stimulation control signal to the functional electric stimulator while monitoring the patient brain activity.

Abstract: A semiconductor package includes a package substrate, a first semiconductor device arranged on the package substrate, at least one second semiconductor device on the first semiconductor device to partially cover the first semiconductor device from a top down view, a heat dissipating insulation layer coated on the first semiconductor device and the at least one second semiconductor device, a conductive heat dissipation structure arranged on the heat dissipating insulation layer on a portion of the first semiconductor device not covered by the second semiconductor device, and a molding layer on the package substrate to cover the first semiconductor device and the at least one second semiconductor device. The heat dissipating insulation layer is formed of an electrically insulating and thermally conductive material, and the conductive heat dissipation structure formed of an electrically and thermally conductive material.

Abstract: An image sensor package includes an image sensor chip, a logic chip, and a memory chip structure that are vertically stacked. The image sensor chip includes a pixel array and an interconnection structure that receives a power voltage, ground voltage, or signals. The logic chip processes pixel signals from the image sensor chip and receives the power voltage, ground voltage, or signals via the image sensor chip. The memory chip structure includes a memory chip, a molding portion surrounding the memory chip, and at least one through mold via contact vertically passing through the molding portion and connected to at least one of the logic or memory chip. The memory chip stores at least one of a pixel signal processed by the logic chip or a pixel signal from the image sensor chip and receives the power voltage, ground voltage, or signals via the image sensor chip and logic chip.

Abstract: A sensor element is disclosed.

Abstract: An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment a method includes attaching a plurality of optoelectronic semiconductor chips on predetermined locations of an intermediate film, providing a cavity film with a plurality of separated openings, attaching the cavity film to the intermediate film such that each optoelectronic semiconductor chip is associated with a respective opening, wherein the cavity film is thicker than the optoelectronic semiconductor chips such that the cavity film exceeds the optoelectronic semiconductor chips in a direction away from the intermediate film, filling a casting material in each of the openings such that the optoelectronic semiconductor chips are casted with the casting material and removing the intermediate film.

Abstract: A semiconductor package includes: a first thermal pillar disposed on a package substrate, and having an opening; a first chip stack disposed on the package substrate and in the opening of the first thermal pillar, and including a first lateral surface; a semiconductor chip disposed on the package substrate and in the opening, wherein the semiconductor chip is spaced apart from the first chip stack; and a first heat transfer film disposed between the first thermal pillar and the first lateral surface of the first chip stack.

Abstract: A communication terminal and a method of providing a unified natural language interface to the same are disclosed. The method includes: determining, when text information containing many characters is created, whether the text information conforms to one of preset grammatical constraints; extracting, when the text information conforms to one of the grammatical constraints, tokens of one or more of characters from the text information, and extracting, when the text information does not conform to one of the grammatical constraints, one or more characters having an attribute probability higher than a reference probability as a token; and analyzing the extracted tokens to determine a function to handle the extracted tokens, and executing the determined function based on the extracted tokens.

Abstract: A heat radiation device includes a semiconductor substrate. A first electrode is disposed on the semiconductor substrate. A second electrode is disposed on the semiconductor substrate and is spaced apart from the first electrode. A first through electrode is disposed in the semiconductor substrate. The first through electrode is electrically connected to the first electrode.

Abstract: A chip on film package includes; a flexible base film having a first surface and a second surface opposite to each other, and having a chip mounting region on the first surface; a plurality of wirings extending in a first direction toward the chip mounting region; a semiconductor chip mounted in the chip mounting region on the first surface of the base film and electrically connected to the wirings; a pair of first heat dissipation members on the first surface of the base film and spaced apart from the semiconductor chip, and extending in a second direction perpendicular to the first direction; and a second heat dissipation member on the first surface of the base film and covering the semiconductor chip and the pair of first heat dissipation members.

Abstract: The present invention relates to a rotating inspector for a camera module. The rotating inspector includes a rotary table having one or more socket units on which the camera module mounted; a plurality of inspection devices disposed around the rotary table to inspect the camera module; test boards disposed on the rotary table, each of test boards being connected to the one or more socket units, respectively to control the camera module and generate inspection data for the camera module; a first data processing unit disposed on the rotary table and analyzing the inspection data to generate result data for possible defects of the camera module; a second data processing unit disposed outside the rotary table, the second data processing unit being configured to receive the result data and to sort and store the received data; and a data transmission unit transmitting the result data generated in the first data processing unit to the second data processing unit.

Abstract: An electronic device includes a substrate, a first electronic product arranged on the substrate, a second electronic product arranged on the substrate to be spaced apart from the first electronic product, and a heat dissipating assembly covering the first and second electronic products, the heat dissipating assembly comprising a heat dissipating chamber including a hermetically sealed space having a first portion having one or more gaps in which a flowable heat dissipation fluid is disposed and having a second portion in which a solid thermal conductive member is disposed to prevent the flow of the heat dissipation fluid across the second portion with respect to a plan view, wherein the first portion of the heat dissipating chamber has a first thermal conductivity and overlaps with the first electronic product in the plan view, wherein the solid thermal conductive member has a second thermal conductivity less than the first thermal conductivity, wherein the solid thermal conductive member overlaps with the se

Abstract: The present invention relates to a method of manufacturing a multi-structural high-heat-dissipation part having the controlled packing density of a carbon material and to a multi-structural high-heat-dissipation part manufactured thereby, the method including preparing a mixture by mixing a binder pitch with a carbon material including a first carbon material powder and a second carbon material powder having a smaller diameter than the diameter of the first carbon material powder, forming a compact from the mixture using a hot-forming process, and producing a graphitized pitch/carbon material compact by subjecting the compact to graphitization through heat treatment and cooling. Thereby, the packing density of the carbon material can be improved through bimodal distribution using pieces of carbon material having different diameters, thus increasing thermal conductivity in in-plane and through-plane directions and strength.

Abstract: A chip structure is provided. The chip structure includes: a first lower chip structure; and an upper chip structure on the first lower chip structure and having a pixel array region. The first lower chip structure includes: a first lower semiconductor substrate having a first side and a second side opposing each other; a first portion on the first side of the first lower semiconductor substrate; and a second portion on the second side of the first lower semiconductor substrate, the first portion of the first lower chip structure includes a gate wiring, the second portion of the first lower chip structure includes a second side wiring and a heating element, and the heating element is on the same plane as that of the second side wiring and has a length greater than that of the second side wiring.

Abstract: A method for managing a temperature of a device includes determining a temperature of a circuit or a package including the circuit, and selectively operating a thermoelectric semiconductor based on the determined temperature to adjust the temperature of the circuit or the package.

Abstract: An image sensor package includes an image sensor chip, a logic chip, and a memory chip structure that are vertically stacked. The image sensor chip includes a pixel array and an interconnection structure that receives a power voltage, ground voltage, or signals. The logic chip processes pixel signals from the image sensor chip and receives the power voltage, ground voltage, or signals via the image sensor chip. The memory chip structure includes a memory chip, a molding portion surrounding the memory chip, and at least one through mold via contact vertically passing through the molding portion and connected to at least one of the logic or memory chip. The memory chip stores at least one of a pixel signal processed by the logic chip or a pixel signal from the image sensor chip and receives the power voltage, ground voltage, or signals via the image sensor chip and logic chip.

Abstract: A semiconductor package includes a package substrate, a first semiconductor device arranged on the package substrate, at least one second semiconductor device on the first semiconductor device to partially cover the first semiconductor device from a top down view, a heat dissipating insulation layer coated on the first semiconductor device and the at least one second semiconductor device, a conductive heat dissipation structure arranged on the heat dissipating insulation layer on a portion of the first semiconductor device not covered by the second semiconductor device, and a molding layer on the package substrate to cover the first semiconductor device and the at least one second semiconductor device. The heat dissipating insulation layer is formed of an electrically insulating and thermally conductive material, and the conductive heat dissipation structure formed of an electrically and thermally conductive material.

Abstract: An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment a method includes attaching a plurality of optoelectronic semiconductor chips on predetermined locations of an intermediate film, providing a cavity film with a plurality of separated openings, attaching the cavity film to the intermediate film such that each optoelectronic semiconductor chip is associated with a respective opening, wherein the cavity film is thicker than the optoelectronic semiconductor chips such that the cavity film exceeds the optoelectronic semiconductor chips in a direction away from the intermediate film, filling a casting material in each of the openings such that the optoelectronic semiconductor chips are casted with the casting material and removing the intermediate film.