Abstract: An inductive device includes an insulating layer, a lower magnetic layer, and an upper magnetic layer that are formed such that the insulating layer does not separate the lower magnetic layer and the upper magnetic layer at the outer edges or wings of the inductive device. The lower magnetic layer and the upper magnetic layer form a continuous magnetic layer around the insulating layer and the conductors of the inductive device. Magnetic leakage paths are provided by forming openings through the upper magnetic layer. The openings may be formed through the upper magnetic layer by semiconductor processes that have relatively higher precision and accuracy compared to semiconductor processes for forming the insulating layer such as spin coating. This reduces magnetic leakage path variation within the inductive device and from inductive device to inductive device.

Abstract: Systems and methods for reducing false positives for financial transaction fraud monitoring using machine learning techniques. Using an original model for separating transactions into high risk and low risk categories for fraud, transactions falling into the high-risk category may be labeled as a false positive or a true positive. The labels and data associated with the transactions may be used to train two or more false positive reduction models (FPRMs) using iterative machine learning techniques. Once training is complete, a future transaction may be processed using the original model, and, if the original model indicates that the future transaction is high risk, data associated with the future transaction may be processed by the trained FPRM(s), which may determine whether the future transaction is at a high risk or a low risk of being fraudulent.

Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including an optical device within or on a semiconductor substrate. A light guide structure overlies the optical device. A first etch stop layer extends along first sidewalls and a lower surface of the light guide structure. A second etch stop layer overlies the first etch stop layer and extends along second sidewalls of the light guide structure.

Abstract: A semiconductor device a method of forming the same are provided. A semiconductor device includes a gate stack over a substrate. A first dielectric layer is over the gate stack. The first dielectric layer includes a first material. A second dielectric layer is over the first dielectric layer. The second dielectric layer includes a second material different from the first material. A first conductive feature is adjacent the gate stack. A second conductive feature is over and in physical contact with a topmost surface of the first conductive feature. A bottommost surface of the second conductive feature is in physical contact with a topmost surface of the second dielectric layer.

Abstract: Various examples of a circuit device that includes gate stacks and gate seals are disclosed herein. In an example, a substrate is received that has a fin extending from the substrate. A placeholder gate is formed on the fin, and first and second gate seals are formed on sides of the placeholder gate. The placeholder gate is selectively removed to form a recess between side surfaces of the first gate seal and the second gate seal. A functional gate is formed within the recess and between the side surfaces of the first gate seal and the second gate seal.

Abstract: A graph partitioning compiler partitions an AI program or model for execution on multiple TSP modules configured for accelerating deep learning workloads.

Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media for speech recognition. One method includes obtaining an input acoustic sequence, the input acoustic sequence representing one or more utterances; processing the input acoustic sequence using a speech recognition model to generate a transcription of the input acoustic sequence, wherein the speech recognition model comprises a domain-specific language model; and providing the generated transcription of the input acoustic sequence as input to a domain-specific predictive model to generate structured text content that is derived from the transcription of the input acoustic sequence.

Abstract: A liquid-crystal (LC) medium which is based on a mixture of polar compounds and is substantially dielectrically neutral, its use for optical, electro-optical and electronic purposes, in particular as optical retarder or optical compensator in LC displays, an optical retarder or optical compensator containing the LC medium, an optical, electrooptical or electronic device containing the optical retarder or optical compensator, and a process of manufacturing the optical retarder or optical compensator.

Abstract: A method includes forming a plurality of dielectric layers over a semiconductor substrate, forming a plurality of metal lines and vias in the plurality of dielectric layers, forming a lower portion of an inner seal ring and a lower portion of an outer seal ring extending into the plurality of dielectric layers, depositing a first dielectric layer over the plurality of metal lines and vias, and etching the first dielectric layer to form an opening penetrating through the first dielectric layer. After the first dielectric layer is etched, a top surface of the lower portion of the inner seal ring is exposed, and an entire topmost surface of the lower portion of the outer seal ring is in contact with a bottom surface of the first dielectric layer. An upper portion of the inner seal ring is then formed to extend into the opening and to join the lower portion of the inner seal ring. A second dielectric layer is deposited to cover the upper portion of the inner seal ring.

Abstract: Interlayer dielectric (ILD) layer(s) of a semiconductor device may be configured as a gate oxide for high-voltage transistors, and therefore additional process operations to deposit dedicated gate oxide layers are not needed. Moreover, additional processing operations to form the gate structures of the high-voltage fin-based PMOS transistors and high-voltage fin-based NMOS transistors are not needed in that middle end of line (MEOL process and back end of line (BEOL) processes can be used as the gate formation process of the high-voltage transistors.

Abstract: The present disclosure provides a method of manufacturing a semiconductor structure of a CMOS image sensor. The method includes providing a substrate; growing an epitaxial layer on the substrate; forming a barrier layer on the epitaxial layer; forming a trench extending into the epitaxial layer; oxidizing the epitaxial layer to form a liner layer; defining a region of a photodiode and a first dopant thickness; implanting dopants into the epitaxial layer around a sidewall of the trench to form a protective layer with a second dopant thickness less than the first dopant thickness; forming an oxide layer in the trench; performing an annealing operation to densify the oxide layer to form a densified oxide layer, wherein the protective layer, expanded from the second dopant thickness to a third dopant thickness less than the first dopant thickness, is kept spaced from the region; and forming the photodiode in the region.

Abstract: A method for making a middle-of-line interconnect structure in a semiconductor device includes forming, near a surface of a first interconnect structure comprised of a first metal, a region of varied composition including the first metal and a second element. The method further includes forming a recess within the region of varied composition. The recess laterally extends a first distance along the surface and vertically extends a second distance below the first surface. The method further includes filling the recess with a second metal to form a second interconnect structure that contacts the first interconnect structure.

Abstract: A robotic procedure system for treating neurovasculature of a patient including a guide sheath, catheter system having a support catheter and a navigation catheter, and robotic drive system configured to drive the catheter system within a patient's vessel. The robotic drive system includes a cassette with at least a first set of rollers and at least a second set of rollers and a controller operatively coupled to the cassette. The first set of rollers is configured to engage a proximal control element of the support catheter and the second set of rollers configured to engage a proximal extension of the navigation catheter. The controller is configured to control the first set and second set of rollers so as to determine a magnitude of linear translation of the support catheter and a magnitude of linear translation of the navigation catheter. Related devices, systems, and methods are provided.

Abstract: A method for preparing a semiconductor device, includes: forming a first dielectric structure and a second dielectric structure over a semiconductor substrate; forming a conductive material over the first dielectric structure and the second dielectric structure, wherein the conductive material extends into a first opening between the first dielectric structure and the second dielectric structure; partially removing the conductive material to form a first bit line and a second bit line in the first opening; forming a first capacitor contact and a second capacitor contact in the first dielectric structure and the second dielectric structure, respectively; forming a sealing dielectric layer over the first bit line and the second bit line such that an air gap is formed between the sealing dielectric layer and the semiconductor substrate; and forming a first capacitor and a second capacitor over the first capacitor contact and the second capacitor contact, respectively.

Abstract: A system (1) of an electronic lock (3) and an electronic key (2).

Abstract: A semiconductor structure includes a substrate, a first FET device and a second FET device. The substrate has a first region and a second region. The first FET device is in the first region, and the second FET device is in the second region. The first FET device includes a first isolation structure, a first gate electrode disposed over a portion of the first isolation structure, and a first gate dielectric layer between the substrate and the first gate electrode. The first gate dielectric layer has a first thickness. The second FET device includes a plurality of fin structures, a plurality of second isolation structures, a second gate electrode over the plurality of fin structures, and a second gate dielectric layer between the second gate electrode and the plurality of fin structures. The second gate dielectric layer has a second thickness. The second thickness is less than the first thickness.

Abstract: Methods of configuring a memory might include characterizing a read window budget for a programming operation of the memory as a function of a programming step voltage for a plurality of memory cell ages, determining a respective programming step voltage for each memory cell age of the plurality of memory cell ages in response to a desired read window budget, and storing data to the memory indicative of the determined respective programming step voltage for each memory cell age of the plurality of memory cell ages.

Abstract: In an embodiment, a circuit includes: a transformer defining an inductive footprint within a first layer; a grounded shield bounded by the inductive footprint within a second layer separate from the first layer; and a circuit component bounded by the inductive footprint within a third layer separate from the second layer, wherein: the circuit component is coupled with the transformer through the second layer, and the third layer is separated from the first layer by the second layer.

Abstract: A method of making a golf club head includes interposing bonding tape between a first piece and a second piece of the golf club head such that the first piece is temporarily adhered to the second piece via a tackiness of the bonding tape. The method additionally includes positioning the first piece, the second piece, and the bonding tape, interposed between the first piece and the second piece, in a vacuum bag, and reducing a pressure within the vacuum bag, relative to a pressure external to the vacuum bag, such that the vacuum bag collapses onto the first piece and the second piece and compresses the bonding tape between the first piece and the second piece. The method also includes heating the bonding tape, at least to a curing temperature of the bonding tape, when the pressure within the vacuum bag is reduced.

Abstract: A method for implementing requests from an app by a SIM in a mobile phone comprises the steps of: binding an app to a BIP server by a mobile phone; delivering a request command to the BIP server from the mobile phone; converting the request command to an APDU format, packing the converted request command in the APDU format in a request packet, and delivering the request packet to an IP of a SIM by the BIP server; receiving and unpacking the request packet to have the converted request command, and providing the converted request command to the SIM; executing the request command to have a result by the SIM; delivering the result in a response packet to the BIP server via the mobile network relayed; unpacking the response packet to fetch the result, and delivering the result to the mobile phone for the app by the BIP server.