Patents by Inventor Chou

Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230394782
    Abstract: The embodiments of the disclosure provide a method for determining a floor plane and a host. The method includes: determining a first plane as a reference floor plane based on motion data; in response to determining that the host has moved for a predetermined distance after determining the first plane as the reference floor plane, determining a plurality of first feature points on the reference floor plane; determining a second plane based on the first feature points on the reference floor plane; and in response to determining that the second plane meets a predetermined condition, determining the second plane as the reference floor plane.
    Type: Application
    Filed: April 17, 2023
    Publication date: December 7, 2023
    Applicant: HTC Corporation
    Inventors: Yun-Ting Wang, Nien Hsin Chou
  • Publication number: 20230395632
    Abstract: A heterogeneously substrate-bonded optical assembly includes a processor chip, an optical chip and a molding compound layer. The processor chip includes: a processor circuit; reader circuits electrically connected to the processor circuit; a first protection layer disposed on the processor circuit and the reader circuits; and first vias penetrating through first protection layer and being electrically connected to the reader circuit. The optical chip includes: a second protection layer bonded to the first protection layer; second vias penetrating through the second protection layer and being bonded to the first vias; and optical pixels electrically connected to the reader circuit respectively through the second vias and the first vias. The molding compound layer surrounds the optical chip and is disposed on the first protection layer. A method of manufacturing the optical assembly applicable to high-resolution applications is also disclosed.
    Type: Application
    Filed: February 8, 2023
    Publication date: December 7, 2023
    Inventor: BRUCE C. S. CHOU
  • Publication number: 20230391838
    Abstract: ?-RgIA4 peptide analogs, compositions therewith, and methods for their treatment and use are disclosed and described. For example, an ?-RgIA4 peptide analog can comprise a recognition finger region configured to bind to an ?9?10 nicotinic acetylcholine receptor, and a side chain bonding configuration that protects an inter-cysteine sulfur linkage.
    Type: Application
    Filed: June 3, 2021
    Publication date: December 7, 2023
    Inventors: Joseph Michael McIntosh, Nan Zheng, Hung-Chieh Chou
  • Publication number: 20230391747
    Abstract: The present disclosure provides GLP-1R agonists, and compositions, methods, and kits thereof. Such compounds are generally useful for treating a GLP-1R mediated disease or condition in a human.
    Type: Application
    Filed: May 10, 2023
    Publication date: December 7, 2023
    Inventors: Stephen E. Ammann, Gediminas J. Brizgys, James S. Cassidy, Elbert Chin, Chienhung Chou, Jeromy J. Cottell, Michael Graupe, Chao-I Hung, Kavoos Kolahdouzan, Scott D. Schroeder, Nathan D. Shapiro, Daniel G. Shore, Suzanne M. Szewczyk, James G. Taylor, Rhiannon Thomas-Tran, Nathan E. Wright, Zheng-Yu Yang, Sheila M. Zipfel
  • Publication number: 20230396161
    Abstract: A system includes a charge pump system having a plurality of enable signal input terminals and an output terminal, the charge pump system configured to provide an output voltage at the output terminal; and a detection circuit connected to the enable terminals and the output terminal of the charge pump system, the detection circuit configured to compare the charge pump system output voltage to a plurality of predefined input detection voltage levels, and to selectively output a plurality of enable signals to the charge pump system enable signal input terminals in response to the comparison.
    Type: Application
    Filed: August 4, 2023
    Publication date: December 7, 2023
    Inventors: Chung-Cheng Chou, Tien-Yen Wang
  • Publication number: 20230395640
    Abstract: Various embodiments of the present disclosure are directed towards a pixel sensor. The pixel sensor includes a substrate having a front-side opposite a back-side. An image sensor element comprises an active layer disposed within the substrate, where the active layer comprises germanium. An anti-reflective coating (ARC) structure overlies the back-side of the substrate. The ARC structure includes a first dielectric layer overlying the back-side of the substrate, a second dielectric layer overlying the first dielectric layer, and a third dielectric layer overlying the second dielectric layer. A first index of refraction of the first dielectric layer is less than a second index of refraction of the second dielectric layer, and a third index of refraction of the third dielectric layer is less than the first index of refraction.
    Type: Application
    Filed: August 4, 2023
    Publication date: December 7, 2023
    Inventors: Cheng-Hsien Chou, Sheng-Chau Chen, Ming-Che Lee
  • Publication number: 20230393873
    Abstract: A value-added content providing method for a computer system includes receiving an input message indicating to present a pop-up window in a display area of the computer system; obtaining a content area in the display area according to the input message; analyzing the content area to generate an analysis content; and providing and displaying a value-added content in the pop-up window according to the analysis content.
    Type: Application
    Filed: June 4, 2023
    Publication date: December 7, 2023
    Applicants: Inventec (Pudong) Technology Corp., Inventec Corporation
    Inventors: Hsueh-Liang Chen, Chen-Chou Huang, Yan-Yue Yin
  • Publication number: 20230391661
    Abstract: A method for manufacturing ultra-thin glass substrates and a method for manufacturing a display panel are provided. The method for manufacturing ultra-thin glass substrates includes: providing a glass base material preset with n substrate areas and a skeleton area surrounding the substrate areas; at least forming an etching protection layer on each substrate area of the glass base material; immersing the glass base material in a reaction chamber having etching medium; after the edge of each substrate area is etched to form the stress dissipation edge and the substrate areas are separated from the glass base material, the substrate areas falling down by gravity and falling into the basket; pulling the basket out of the reaction chamber to get the substrate areas separated from the glass base material; removing the etching protection layer to get independent glass substrates.
    Type: Application
    Filed: November 18, 2020
    Publication date: December 7, 2023
    Inventors: Hao-Yu CHOU, Cheng-Chung CHIANG, Tian-Ming WU, Chun-Chieh HUANG, Feng CHEN
  • Publication number: 20230395703
    Abstract: A semiconductor structure includes substrate, semiconductor layers, source/drain features, metal oxide layers, and a gate structure. The semiconductor layers extend in an X-direction and over the substrate. The semiconductor layers are spaced apart from each other in a Z-direction. The source/drain features are on opposite sides of the semiconductor layers in the X-direction. The metal oxide layers cover bottom surfaces of the semiconductor layers. The gate structure wraps around the semiconductor layers and the metal oxide layers. The metal oxide layers are in contact with the gate structure.
    Type: Application
    Filed: August 10, 2023
    Publication date: December 7, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih-Hao LIN, Chia-Hung CHOU, Chih-Hsuan CHEN, Ping-En CHENG, Hsin-Wen SU, Chien-Chih LIN, Szu-Chi YANG
  • Publication number: 20230393613
    Abstract: A display assembly including a stand, a mounting assembly and a display. The mounting assembly includes a fixed base, a first pivot, a pivotable base, a second pivot, a handle, a plurality of first engagement structures and a second engagement structure. The handle includes a handheld part and a mounting part. The mounting part is connected to the handheld part and pivotally connected to the pivotable base via the second pivot. The first engagement structures are disposed at one of the fixed base and the mounting part of the handle. The second engagement structure is disposed at another one of the fixed base and the mounting part of the handle. The display is fixed on the pivotable base. The first pivot is not coaxial with the second pivot so that the second engagement structure is configured to be engaged with any one of the first engagement structures.
    Type: Application
    Filed: June 7, 2022
    Publication date: December 7, 2023
    Applicants: MICRO-STAR INT'L CO.,LTD., MSI COMPUTER (SHENZHEN) CO.,LTD.
    Inventors: Ping-Cheng CHOU, Huang-Lei SUN, Chuan Li KAO
  • Publication number: 20230396869
    Abstract: A dynamic image processing method is executed by an electronic device communicating with a photographing device and reading an executable code to identify a preset object by using artificial intelligence, and perform dynamic image processing for the preset object. The method includes the steps of identifying the preset object, image filtering and forming a concatenated video. In the step of image filtering, a filter condition is set, the filter condition includes detecting a movement variable of the preset object in the initial image, and when the filter condition meets a threshold, a catch moment in the initial image is selected. In the step of forming a concatenated video, at least one video clip in the initial image is selected according to the catch moment, and the video clip is assembled to form the concatenated video. The present disclosure also provides an electronic device and a terminal device.
    Type: Application
    Filed: October 26, 2022
    Publication date: December 7, 2023
    Inventors: PIN-YU CHOU, YUEH-HUA LEE, YU-NING CHANG, MING-HSIEN WU, YU-SYUAN HUANG
  • Publication number: 20230396824
    Abstract: An electronic device includes a wireless transceiver configured to receive content primitives via a wireless communication channel. The electronic device also includes control circuitry control circuitry coupled to the wireless transceiver, and configured to perform content provisioning operations based on the received content primitives, wherein the content provisioning operations comprise generating content image data and transmitting the content image data to the wireless communication channel using the wireless transceiver. In response to a bandwidth condition of the wireless communication channel being less than a threshold, the control circuitry is configured to perform adjusted content provisioning operations that decrease an amount of content image data conveyed by the wireless transceiver to the wireless communication channel.
    Type: Application
    Filed: June 5, 2023
    Publication date: December 7, 2023
    Inventors: Moinul H. Khan, Jim C. Chou, Sorin C. Cismas
  • Publication number: 20230395472
    Abstract: In an example, an apparatus comprises a lead frame that includes a first row of leads, a first pad coupled to th first row of leads, and a second row of leads parallel to the first row of leads. The lead frame also includes a second pad coupled to the second row of leads. The first and second pads are separated by a gap, and each of the first and second pads has a substantially uniform thickness. The apparatus also includes a device coupled to the first and second pads. The first and second pads are exposed to an exterior of the apparatus.
    Type: Application
    Filed: August 22, 2023
    Publication date: December 7, 2023
    Inventors: Hung-Yu CHOU, Bo-Hsun PAN, Yuh-Harng CHIEN, Fu-Hua YU, Steven Alfred KUMMERL, Jie CHEN, Rajen M. MURUGAN
  • Publication number: 20230395466
    Abstract: A method according to the present disclosure includes providing a first workpiece that includes a first substrate and a first interconnect structure, providing a second workpiece that includes a second substrate, a second interconnect structure, and a through via extending through a portion of the second substrate and a portion of the second interconnect structure, forming a first bonding layer on the first interconnect structure, forming a second bonding layer on the second interconnect structure, bonding the second workpiece to the first workpiece by directly bonding the second bonding layer to the first bonding layer, thinning the second substrate, forming a protective film over the thinned second substrate, forming a backside via opening through the protective film and the thinned second substrate to expose the through via, and forming a backside through via in the backside via opening to physically couple to the through via.
    Type: Application
    Filed: June 2, 2022
    Publication date: December 7, 2023
    Inventors: Harry-Haklay Chuang, Wen-Tuo Huang, Wei-Cheng Wu, Yu-Ling Hsu, Pai Chi Chou, Ya-Chi Hung
  • Publication number: 20230395392
    Abstract: A method for manufacturing a semiconductor structure includes: forming a semiconductor device on a main region of the device substrate, the device substrate having a peripheral region surrounding the main region; forming a first filling layer on the peripheral region of the device substrate; forming a second filling layer over the first filling layer and the semiconductor device after forming the first filling layer, the second filling layer having a polishing rate different from that of the first filling layer; performing a planarization process over the second filling layer to remove a portion of the second filling layer so that a remaining portion of the second filling layer has a planarized surface opposite to the device substrate; and bonding the device substrate to a carrier substrate through the first filling layer and the remaining portion of the second filling layer.
    Type: Application
    Filed: June 6, 2022
    Publication date: December 7, 2023
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Pei-Yu CHOU, Yen-Yu CHEN, Meng-Ku CHEN, Shiang-Bau WANG, Tze-Liang LEE
  • Publication number: 20230394219
    Abstract: A method (of generating a layout diagram of a wire routing arrangement in a multi-patterning context having multiple masks, the layout diagram being stored on a non-transitory computer-readable medium) includes: placing, relative to a given one of the masks, a given cut pattern at a first candidate location over a corresponding portion of a given conductive pattern in a metallization layer; determining whether the first candidate location results in a group of cut patterns which violates a design rule; and temporarily preventing placement of the given cut pattern in the metallization layer at the first candidate location until a correction is made which avoids violating the design rule.
    Type: Application
    Filed: August 10, 2023
    Publication date: December 7, 2023
    Inventors: Fong-Yuan CHANG, Chin-Chou LIU, Hui-Zhong ZHUANG, Meng-Kai HSU, Pin-Dai SUE, Po-Hsiang HUANG, Yi-Kan CHENG, Chi-Yu LU, Jung-Chou TSAI
  • Publication number: 20230393767
    Abstract: A data storage system with intelligent power management includes a plurality of data storage devices and a controller. Each data storage device is capable of operating in one of (N+1) power saving functions where N is an integer larger than 1. The (N+1) power saving functions sequentially correspond to from the 0th to the Nth power saving levels. The controller reads a user-setting power saving level (I) where I is an integer index ranging from 0 to N. The controller reads a current power saving level (J) of a current power saving function of one of the plurality of data storage devices where J is an integer index ranging from 0 to N. The controller controls said one data storage device to operate in one power saving function among the (N+1) power saving functions according to the user-setting power saving level (I) and the current power saving level (J).
    Type: Application
    Filed: May 23, 2023
    Publication date: December 7, 2023
    Inventors: Zhi-Yu WU, Cheng-Chou WANG, Che-Jen WANG
  • Publication number: 20230390922
    Abstract: A robot intelligence engine receives highly immersive virtual environment (HIVE) data characterizing a set of robot tasks executed by a test robot in a HIVE, wherein the robot tasks of the set of robot tasks include a robot skill. The robot intelligence engine receives sensor data from a problem detecting robot deployed in an environment of operation that characterizes conditions corresponding to a detected problem and searches the set of robot tasks to identify a subset of the robot tasks that are potentially employable to remedy the detected problem. The robot intelligence engine simulates the subset of robot tasks to determine a likelihood of success for the subset of robot tasks. The simulation generates a set of unsupervised robot tasks that are potentially employable to remedy the detected problem. The robot intelligence engine selects one of the subset of robot tasks or one of the unsupervised robot tasks.
    Type: Application
    Filed: June 2, 2022
    Publication date: December 7, 2023
    Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: SIBO CHOU, DANIEL W. PLAWECKI
  • Publication number: 20230394822
    Abstract: A dynamic image processing method, executed by an electronic device communicating with a photographing device and reading an executable code is introduced. The method includes the steps of identifying the preset object, image filtering and forming a concatenated video. In the step of image filtering, a filter condition is set, the filter condition includes that the preset object appears in a focus area of the initial image, and when the preset object in the initial image meets the filter condition, a catch moment in the initial image is selected. In the step of forming a concatenated video, at least one video clip in the initial image is selected according to the catch moment, and the at least one video clip is assembled to form the concatenated video. An electronic device, a terminal device and a mobile communication device are also introduced.
    Type: Application
    Filed: August 24, 2022
    Publication date: December 7, 2023
    Inventors: PIN-YU CHOU, YU-NING CHANG, YUEH-HUA LEE, MING-HSIEN WU, YU-SYUAN HUANG
  • Publication number: 20230389997
    Abstract: A sensor includes a core oriented along a first vector corresponding to an axis of the core. A slanted coil has windings around the core at an angle to the axis of the core along a second vector oriented at a substantial angle to the direction of the windings. At least one middle conductor is coupled to the windings to enable dividing the windings into sub-coils about the middle conductors. The sub-coils may have different slants with respect to the direction of the windings. A pair of end conductors are coupled to opposite ends of the coils such that signals obtained from the middle and end conductors provide sufficient information to determine roll about the axis of the core.
    Type: Application
    Filed: June 7, 2023
    Publication date: December 7, 2023
    Inventors: Sean Morgan, Wai Welly Chou, Roshan Shrestha, Peter Mueller, Richard John Barthel, Syewon Sei Weah, Lev Koyrakh, Andrew Gadbois