Abstract: A semiconductor device package for one or more semiconductor dice uses a package substrate having one pair of biplanar conductive planes and another pair of biplanar conductive planes. The pairs of planes are positioned in a coplanar relationship between the top traces and the bottom traces. Power may be supplied to die core circuits through one pair of planes and to die input-output circuits through another pair of planes to decouple the core circuits from the input-output circuits and minimize noise induced false switching in either set of circuits. The core circuits and the input-output circuits may be powered by the same power supply or separate power supplies.

Abstract: A frame assembly for doors, windows and the like includes a fastening element consisting of a longitudinal connecting portion and a transverse clamping portion, a first frame provided with a plurality of locking holes and a second frame provided with two fastening holes. The connecting portion has a side plate extending substantially perpendicular to either lateral side thereof and is provided with a plurality of threaded holes at an upper portion thereof for matching the locking holes. The clamping portion consists of a clamp plate punched and bent from a middle portion of the connecting portion and a grip plate in a relative clamping relationship with the clamp plate; the grip plate being provided with two projecting hook pieces for matching the fastening holes. The connecting portion may be inserted into the first frame so that they may be locked firmly and conveniently by screws.

Abstract: A circuit (10) and method for reducing a tilt of a video picture on a color monitor includes a circuit (30) for providing an output signal for controlling the vertical position of the scanning beam that includes an MOS transistor (60) having substantially zero current flow in its gate element, and connected to control the magnitude of the output drive signal. In a preferred embodiment, a LinBiCMOS semiconductor manufacturing process is employed to fabricate a plurality of bipolar transistors connected to provide a control voltage on the gate of the MOS transistor (60), which may conveniently be an NMOS device. The bipolar transistors may be connected to form a translinear cell (11) connected to receive a signal (17) related to a horizontal synchronizing signal and to provide a voltage output to the gate of the MOS transistor (60) in response thereto.

Abstract: A razor blade includes a substrate with a wedge-shaped edge at a distance of forty micrometers from the sharpened tip, and a layer of diamond or diamond-like material defined by facets that have an included angle of less than seventeen degrees that has a thickness of at least twelve hundred angstroms from the sharpened tip of said substrate to a distance of forty micrometers from the sharpened tip, and an ultimate tip defined by facets that have lengths of at least about 0.1 micrometer and define an included angle of at least sixty degrees, and that defines a tip radius of less than about 400 angstroms, an aspect ratio in the range of 1:1-3:1, a hardness of at least thirteen gigapascals and an L5 wet wool felt cutter force of less than 0.8 kilogram.

Abstract: A transportable apparatus, or a pod carrier, is disclosed in conjunction with a standardized mechanical interface system (SMIF) whereby the tracking of transported articles is made easier and more reliable. This is accomplished by affixing a card-holder to the pod carrier. The card-holder can hold the process run-cards snugly, or otherwise, at all times in such a way that the cards are visible and amenable to expeditious processing. It is shown that by extending the function of a pod carrier to a tracking device as well, the probability of lost run-cards and the concomitant lost time in the manufacturing line, and/or missteps in the processing of parts are reduced.

Abstract: A controller for a video game console includes first and second handheld control units. Each of the handheld control units has a housing with a finger operating surface that is provided with a control button, and a transmitting unit for transmitting signals to the video game console when the control button unit is operated. An interconnecting unit is provided for releasably interconnecting the housings of the control units.

Abstract: Methods for pretreating patterned masks layers, such as photoresist masks, with electron-beam radiation for use in high temperature processes are disclosed. The electron-beam exposure deactivates compounds within the mask material which would ordinarily decompose and produce gasses within the photoresist layer. The gasses cause blistering in the untreated photoresist layer, which in turn degrades the dimensional integrity of the untreated layer.

Abstract: A method of monitoring the status of plasma in a chamber using real-time spectral data while conducting an etch process during the course of manufacturing of semiconductor wafers. Spectral data is collected during etching, with the spectral data characterizing an emission of light from etch species contained in the plasma, and maintaining the collected data as reference data. A model of principal components of the data is generated. Additional spectral data is extracted from the plasma and compared with the model. Discrepancies pinpoint the presence of foreign material faults and help determine the cause of the failures to ensure appropriate corrective action.

Abstract: A hairbrush is provided having a comb holder and plurality of teeth raised from the comb holder. A plurality of arched flexible bridging strips are respectively connected between each two adjacent teeth and arranged in rows. Each arched flexible bridging strip has a rounded head portion disposed above the topmost edges of the teeth. Each tooth has a plurality of longitudinal scraping grooves formed along its length for removing dirt and water from a user's hair when brushed.

Abstract: A roller conveyor composed of a main body, several rollers, a roller's fixed block and a transmission device and is shaped as a rectangle or a circular arc. The two sides of the main body are preferably composed of an aluminum extrusion frame. The roller is fixed on the aluminum extrusion frame at the two sides of the main body by coupling with a pair of roller's fixed blocks, one being connected to a concave trough positioned on each side of the main body. The inner part of the roller includes a bearing stand of cup shape, a central shaft, an end cover, and a bearing of industrial use. On the outer surface, there is a concave trough for connection with a PU belt and a transmission device to turn and power the rollers. Also, another embodiment of the invention employs a leaning cone roller-type conveyor to make the roller comply with the circular arc shape and enable the conveyor to make a turn.

Abstract: The invention provides composites of organic polymeric compositions including a matrix of an organic polymer and a filler distributed throughout the matrix, the flier being present in the matrix substantially as separate particles, each about the fundamental particle size of the filler. The fillers are unique mixed metal hydroxide compositions that are obtainable in sub-micron size particles. These particles are layered and have a BET specific surface area in excess of about 100 m.sup.2 /g. An anion of the particulates is selected to be compatible with the organic polymer thereby providing ease of dispersion of the filler particles throughout the polymer matrix.

Abstract: A three dimensional module for housing a plurality of integrated circuit chips is shown. The IC chips are mounted in rows on a plurality of substrates. Parallel to each row are communications bars which provide signal paths allowing chips on one substrate to communicate with those on another substrate. The communications bars also serve as spacers between substrates, thereby forming cooling channels. The IC chips are disposed in the cooling channels so that they come into direct contact with the cooling fluid. Signal lines to and from the IC chips are kept as separated as possible from the power lines so as to minimize noise. To this end, relatively thick power supply straps are mounted to each substrate below each row of IC chips. The power supply straps are, in turn, connected to power feed straps such that a very low impedance power supply path to the IC chips is maintained.

Abstract: An air compressor including a cylinder, a motor, a reciprocating mechanism coupled to the motor, a compression mechanism reciprocated in the cylinder by the reciprocating mechanism to compress air, the compression mechanism including a base having a coupling bolt, a compressible conical piston holder and a compressible conical piston mounted around the coupling bolt of the base, wherein the coupling bolt of the base is inserted through the center holes of the compressible conical piston holder and compressible conical piston, having a head stopped above the compressible conical piston holder and the compressible conical piston, and a retainer rod raised from the head; a valve flap is slidably mounted around the retainer rod which opens the air passage through the compression mechanism during its down stroke, and close the air passage during its upstroke; a cap is mounted on the retainer rod to limit upward movement of the valve flap relative to the retainer rod.

Abstract: A high luminescence display, and methods for making such a display, are described. A faceplate for a display device having a glass face is provided, having phosphor elements on the glass face. There are reflective elements, on the glass face and adjacent to the phosphor elements, with surfaces angled toward the phosphor elements, whereby light emitted from the phosphor elements reflects off the reflective elements and travels through the glass face. The reflective elements may be formed of, for example, aluminum, and be directly adjacent to the phosphor, or offset from it.

Abstract: Simple and cost-effective methods for forming tall, high-aspect ratio structures in a material layer comprising a first layer of a image-reversal-type photo-sensitive material and a second layer of a positive-type photo-sensitive material is disclosed. The layers are formed, exposed to actinic radiation, and developed such that the formation, exposure, and development of the second layer does not substantially modify or destroy the patterns formed in the first layer. In one embodiment, the first layer is exposed to actinic radiation through a first mask comprising the complimentary image, or negative, of a desired high-aspect ratio structure. The image in the first layer is then reversed by heating to an elevated temperature and subsequently blank flood exposure of actinic radiation. A second layer of a positive type photo-sensitive material chemically compatible with the IRP layer is then formed over the first layer.

Abstract: A method for segmenting audio data, comprising speech from a plurality of individual speakers, according to speaker is provided. The method comprises providing individual HMMs for each individual speaker, each individual HMM including at least one state, and constructing a speaker network HMM by connecting the individual HMMs in parallel. The audio data is then divided into segments by determining a most likely sequence of states through the speaker network HMM, each of the segments being associated with one of the individual HMMs. Afterward, the speaker of each of the segments is identified. The segmented data may be used to form an index into the audio data according to speaker.

Abstract: A fuse structure is described in which a metallic frame is inserted between the insulation layers, through which the fuse window passes, and the final passivation layer. This frame is used as a mask during fuse window formation so alignment is simplified and problems arising from the presence of insulating residues on the surface of the fuse window layer are avoided.

Abstract: A thin-film bypass capacitor is fabricated by forming a plurality of through holes through the thickness of a nonconductive base substrate and filling the through holes with a conductive material to form ground vias and power vias. A sequence of back side metalization layers are applied to the back side surface of the base substrate. A sequence of bottom contact layers are applied to the front side surface of the base substrate. A bottom contact power terminal is formed in the bottom contact layer and is electrically isolated from remaining portions of the bottom contact layers by insulating plugs. A bottom contact metalization layer is applied to the surface of the bottom contact layers and the insulating plugs. A dielectric layer is formed on the surface of the bottom contact metalization layer. A ground metalization via and a power metalization via are formed at the surface of the dielectric layer.