Patents by Inventor Chou

Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230261013
    Abstract: The invention provides a photoelectric sensor including a substrate and multiple pixel structures. The pixel structures are disposed on the substrate and arranged in an array. Each of the pixel structures includes a transistor and a photodiode. The photodiode includes a first electrode, a photosensitive layer, and a second electrode. The first electrode and the transistor are laterally arranged side by side. A first part of the photosensitive layer is disposed on the first electrode, and a second part of the photosensitive layer extends from the first part to above the transistor. The second electrode is disposed on the photosensitive layer, and is located above the first electrode and the transistor.
    Type: Application
    Filed: November 27, 2020
    Publication date: August 17, 2023
    Applicant: Egis Technology Inc.
    Inventors: Bruce C. S. Chou, Chen-Chang Huang, Chen-Chih Fan
  • Publication number: 20230259639
    Abstract: A method and a system for automatically loading parameters, and a client-end server thereof are provided, and the method and the system, by a reversible information hiding technology, entrain various required parameters in an engineering drawing hiddenly to generate an encrypted file; and then, after decrypting the encrypted file by a pre-stored cipher key, obtain and automatically load the required parameters. Therefore, the parameters can be automatically loaded quickly, accurately and safely.
    Type: Application
    Filed: February 14, 2022
    Publication date: August 17, 2023
    Inventors: Shang-Hua Tsai, Chi-Lun Cheng, Cheng-Fu Chou
  • Publication number: 20230262923
    Abstract: An electronic device includes: a body, including opposite outer and inner surfaces, and a through opening passing through the outer and inner surfaces; a fan, disposed on the outer surface and having an air outlet; a heat sink assembly, disposed at the air outlet and corresponding to the through opening; a first thermal tube, having one end assembled on the heat sink assembly and located on the side of the outer surface; a first heat source, disposed corresponding to the other end of the first thermal tube; a thermal plate, disposed in the body and corresponding to the through opening, having one side abutting against the heat sink assembly and the inner surface; a second thermal tube, having one end connected to the other side of the thermal plate; and a second heat source, disposed corresponding to the other end of the second thermal tube.
    Type: Application
    Filed: November 4, 2022
    Publication date: August 17, 2023
    Inventors: JUI-LIN YANG, WAN-LIN HSU, HSIN-CHIH CHOU, KUN-CHENG LEE, JUEI-CHI CHANG
  • Publication number: 20230256717
    Abstract: Provided is an interlayer film for laminated glass capable of making bluish fogging less likely to occur. An interlayer film for laminated glass according to the present invention contains a pigment, and in the interlayer film for laminated glass, a value YId obtained by subtracting a yellow index YIp calculated from parallel light transmittance from a yellow index YIt calculated from total light transmittance is ?1.0 or more.
    Type: Application
    Filed: June 23, 2021
    Publication date: August 17, 2023
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Atsushi NOHARA, Kinryou CHOU, Kazuhiko NAKAYAMA, Moyuru OKAJIMA
  • Publication number: 20230260758
    Abstract: Methods and systems for uniformly cooling a dome within a plasma treatment system are disclosed. The methods and systems utilize a diffuser including a perforated plate and a cone. The perforated plate includes a center portion and multiple arrays of holes with each array being located circumferentially at a different distance from the center. The cone extends away from the center. The diffuser spreads cooling gas more uniformly across the surface of the dome.
    Type: Application
    Filed: February 14, 2022
    Publication date: August 17, 2023
    Inventors: Cheng Kuang Tso, Chou-Feng Lee, Chih-Hsien Hsu, Chung-Hsiu Cheng, Jr-Sheng Chen
  • Publication number: 20230260197
    Abstract: Example embodiments of the present disclosure relate to systems and methods for compressing attributes of volumetric and hypervolumetric datasets. An example system performs operations including obtaining a reference dataset comprising attributes indexed by a domain of multidimensional coordinates; subdividing the domain into a plurality of blocks respectively associated with a plurality of attribute subsets; inputting, to a local nonlinear operator, a latent representation for an attribute subset associated with at least one block of the plurality of blocks; obtaining, using the local nonlinear operator and based on the latent representation, an attribute representation of one or more attributes of the attribute subset; and updating the latent representation based on a comparison of the attribute representation and the reference dataset.
    Type: Application
    Filed: March 30, 2022
    Publication date: August 17, 2023
    Inventors: Philip Andrew Chou, Berivan Isik, Sung Jin Hwang, Nicholas Milo Johnston, George Dan Toderici
  • Publication number: 20230262896
    Abstract: An electronic device assembly includes an expansion component and a host. The expansion component includes a first case, a first circuit board, and a first connector. The host includes a second case, a main circuit board, and a main connector. The first circuit board is arranged in the first case. The first connector is electrically connected to the first circuit board and is exposed from a top plate of the first case. The main circuit board is arranged in the second case. The main connector is electrically connected to the main circuit board and exposed from a second surface of the second case. When the host is assembled to the expansion component, the second surface of the second case covers the top plate of the first case, and the first connector is electrically connected to the main connector.
    Type: Application
    Filed: February 6, 2023
    Publication date: August 17, 2023
    Inventors: Jui-Lin YANG, Wan-Lin HSU, Hsin-Chih CHOU, Kun-Cheng LEE, Juei-Chi CHANG
  • Publication number: 20230261103
    Abstract: A nitride-based semiconductor device includes a first nitride-based semiconductor layer, a lattice layer, a third nitride-based semiconductor layer, a first source electrode and a second electrode, and a gate electrode. The second nitride-based semiconductor layer is disposed over the first nitride-based semiconductor layer. The lattice layer is disposed between the first and second nitride-based semiconductor layers and doped to the first conductivity type. The lattice layer comprises a plurality of first III-V layers and second III-V layers alternatively stacked. Each of the first III-V layers has a high resistivity region and a current aperture enclosed by the high resistivity region. The high resistivity region comprises more metal oxides than the current aperture so as to achieve a resistivity higher than that of the current aperture. At least two of the first III-V layers have the same group III element at different concentrations.
    Type: Application
    Filed: February 14, 2022
    Publication date: August 17, 2023
    Inventors: Yi-Lun CHOU, Shuang GAO, Chuangang LI
  • Publication number: 20230262969
    Abstract: The present disclosure provides a memory device, a semiconductor device, and a method of operating a memory device. A memory device includes a memory cell, a bit line, a word line, a select transistor, a fuse element, and a heater. The bit line is connected to the memory cell. The word line is connected to the memory cell. The select transistor is disposed in the memory cell. A gate of the select transistor is connected to the word line. The fuse element is disposed in the memory cell. The fuse element is connected to the bit line and the select transistor. The heater is configured to heat the fuse element.
    Type: Application
    Filed: February 16, 2022
    Publication date: August 17, 2023
    Inventors: PERNG-FEI YUH, YIH WANG, MENG-SHENG CHANG, JUI-CHE TSAI, KU-FENG LIN, YU-WEI LIN, KEH-JENG CHANG, CHANSYUN DAVID YANG, SHAO-TING WU, SHAO-YU CHOU, PHILEX MING-YAN FAN, YOSHITAKA YAMAUCHI, TZU-HSIEN YANG
  • Publication number: 20230257386
    Abstract: A compound of Formula (I): pharmaceutically acceptable salts thereof, deuterated analogs thereof, compositions thereof, and methods of treating disease using a compound thereof, wherein the variable substituents are disclosed herein.
    Type: Application
    Filed: November 23, 2022
    Publication date: August 17, 2023
    Inventors: Stephen Ammann, Elizabeth M. Bacon, Gediminas J. Brizgys, Elbert Chin, Chienhung Chou, Jeromy J. Cottell, Marilyn S. Ndukwe, James G. Taylor, Nathan E. Wright, Zheng-Yu Yang, Sheila M. Zipfel
  • Patent number: 11727619
    Abstract: A mixed reality system that includes a device and a base station that communicate via a wireless connection The device may include sensors that collect information about the user's environment and about the user. The information collected by the sensors may be transmitted to the base station via the wireless connection. The base station renders frames or slices based at least in part on the sensor information received from the device, encodes the frames or slices, and transmits the compressed frames or slices to the device for decoding and display. The base station may provide more computing power than conventional stand-alone systems, and the wireless connection does not tether the device to the base station as in conventional tethered systems. The system may implement methods and apparatus to maintain a target frame rate through the wireless link and to minimize latency in frame rendering, transmittal, and display.
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: August 15, 2023
    Assignee: Apple Inc.
    Inventors: Arthur Y Zhang, Ray L. Chang, Timothy R. Oriol, Ling Su, Gurjeet S. Saund, Guy Cote, Jim C. Chou, Hao Pan, Tobias Eble, Avi Bar-Zeev, Sheng Zhang, Justin A. Hensley, Geoffrey Stahl
  • Patent number: 11727188
    Abstract: A semiconductor device including a cell region which includes components representing a circuit arranged such that a rectangular virtual perimeter is drawable around substantially all of the components and includes first and second virtual side boundaries, the components including: a first conductor which is an intra-cell conductor of a first signal that is internal to the circuit, a first end of the intra-cell conductor being substantially a minimum virtual boundary offset inside the first virtual side boundary; and a second conductor of a second signal of the circuit; a portion of the second conductor having a first end which extends outside the first virtual side boundary by a protrusion length substantially greater than the minimum virtual boundary offset; and a second end of the second conductor being receded inside the second virtual side boundary by a first gap substantially greater than the minimum virtual boundary offset.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: August 15, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Fong-Yuan Chang, Chin-Chou Liu, Sheng-Hsiung Chen, Po-Hsiang Huang
  • Patent number: 11728374
    Abstract: A capacitor structure for a power semiconductor device includes a semiconductor substrate, an isolation insulating layer having a ring-shape and including an outer periphery and an inner periphery defining an opening region, a first electrode disposed on the isolation insulating layer, a dielectric layer disposed on the first electrode, and a second electrode disposed on the dielectric layer.
    Type: Grant
    Filed: October 11, 2021
    Date of Patent: August 15, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hong-Yang Chen, Tian Sheng Lin, Yi-Cheng Chiu, Hung-Chou Lin, Yi-Min Chen, Kuo-Ming Wu, Chiu-Hua Chung
  • Patent number: 11728292
    Abstract: The invention provides a semiconductor package assembly. The semiconductor package assembly includes a first semiconductor package including a first redistribution layer (RDL) structure having a first surface and a second surface opposite to the first substrate. The first RDL structure includes a plurality of first conductive traces close to the first surface of the first RDL structure. An antenna pattern is disposed close to the second surface of the first RDL structure. A first semiconductor die is disposed on the first surface of the first RDL structure and electrically coupled to the first RDL structure. A plurality of conductive structures is disposed on the first surface of the first RDL structure and electrically coupled to the first RDL structure. The plurality of conductive structures is spaced apart from the antenna pattern through the plurality of first conductive traces of the first RDL structure.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: August 15, 2023
    Assignee: MediaTek Inc.
    Inventors: Tzu-Hung Lin, I-Hsuan Peng, Nai-Wei Liu, Wei-Che Huang, Che-Ya Chou
  • Patent number: 11729647
    Abstract: An apparatus of a management service equipment includes processing circuitry. To configure the management service equipment for measuring a plurality of key performance indicators (KPIs) in a 5G network with a plurality of network functions (NFs), the processing circuitry is to retrieve using a data analytic function of the management service equipment, a plurality of performance measurements associated with a cell of a radio access network (RAN) within the 5G network. A KPI of the plurality of KPIs associated with the cell is generated using the data analytic function of the management service equipment, based on the plurality of performance measurements. The KPI is encoded for transmission to a service application executing on a user equipment (UE) active within the cell of the RAN or executing within a cloud architecture.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: August 15, 2023
    Assignee: Apple Inc.
    Inventors: Joey Chou, Yizhi Yao
  • Patent number: 11729016
    Abstract: A vehicle data analysis device and a vehicle data analysis method thereof are provided. The vehicle data analysis device receives a sensing data and a controller area network (CAN) message, and performs a similarity comparison on the sensing data and a plurality of bytes of a data field of the CAN message to determine whether the CAN message is a target CAN message corresponding to the sensing data.
    Type: Grant
    Filed: November 23, 2020
    Date of Patent: August 15, 2023
    Assignee: INSTITUTE FOR INFORMATION INDUSTRY
    Inventors: I-Chou Hung, Chih-Min Shih, Hsing-Yu Chen, Shih-Sian Jhuang, Wen-Kai Liu
  • Patent number: 11728365
    Abstract: A semiconductor device includes a semiconductor substrate, a radiation-sensing region, at least one isolation structure, and a doped passivation layer. The radiation-sensing region is present in the semiconductor substrate. The isolation structure is present in the semiconductor substrate and adjacent to the radiation-sensing region. The doped passivation layer at least partially surrounds the isolation structure in a substantially conformal manner.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: August 15, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tsung-Han Tsai, Yun-Wei Cheng, Kuo-Cheng Lee, Chun-Hao Chou, Yung-Lung Hsu
  • Patent number: 11729067
    Abstract: Systems and methods of providing a management data analytics service are described. After receiving a request for a management data analytical KPI, the MDAS producer determines from which of network objects to collect the performance measurements to generate the management analytical data. The network objects include an NF, NSI, NSSI, subnetwork or the network. Performance data is collected for a past period and management analytical data generated based on the collected performance data. The KPI for a future period related to the past period is determined. The KPI is to predict uplink or downlink traffic volume or resource utilization associated with the network object.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: August 15, 2023
    Assignee: Apple Inc.
    Inventors: Joey Chou, Yizhi Yao
  • Patent number: 11729690
    Abstract: Systems and methods of providing performance measurements are described. The performance measurements reflect the performance of NF service management, PFD management, UE policy association, QoS flow release and handovers. Raw performance data is collected from one or more NFs and then measurement data results are provided to an NF measurement consumer. The measurement data results is used to diagnose ongoing issues impacting the performance of the mobile network and predict any potential issues.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: August 15, 2023
    Assignee: Intel Corporation
    Inventors: Yizhi Yao, Joey Chou
  • Patent number: 11725227
    Abstract: The present invention provides devices, systems, and methods, for performing biological and chemical assays.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: August 15, 2023
    Assignee: Essenlix Corporation
    Inventors: Stephen Y. Chou, Wei Ding