Abstract: A laser projector includes a light combining device, a light splitting system, a plurality of light valves, and a beam combiner. The light combining device is for emitting an illumination beam. The light splitting system is for receiving the illumination beam to generate a plurality of color beams. The plurality of light valves is for receiving and modulating the plurality of color beams to generate modulated color beams. The beam combiner is for combining the modulated color beams to form a multi-color image.

Abstract: The Application relates to optically transparent electrostatic transducers. In some embodiments, the transducers comprise graphene. Such transducers are capable of functioning as acoustic sensors and/or transmitters as a singulated device or in an array configuration. Also provided are methods of manufacturing and using such transducers.

Abstract: A semiconductor image sensing structure includes a substrate having a first region and a second region, a metal grid in the first region, and a hybrid metal shield in the second region. The hybrid metal shield includes a first metallization layer, a second metallization layer disposed over the first metallization layer, a third metallization layer disposed over the second metallization layer, and a fourth metallization layer disposed over the third metallization layer. An included angle of the second metallization layer is between approximately 40° and approximately 60°.

Abstract: A heat dissipation module includes a diversion case and a fan. The diversion case includes an input section, an output section, and a connecting section that connects the input section and the output section, where an angle is defined between an extending direction of the input section and an extending direction of the output section, and an end of the input section away from the connecting section and an end of the output section away from the connecting section are respectively inclined relative to the connecting section. The fan is accommodated in the connecting section. An electronic device assembly includes an expansion component and the heat dissipation module.

Abstract: A fluid material dispensing apparatus includes: a material outlet chamber extended outward from a main body of the fluid material dispensing apparatus; multiple pumps arranged to respectively extract multiple fluid materials stored in multiple material containers, and to operably push corresponding fluid materials forward; a fluid output device positioned on a bottom of the material outlet chamber and comprising multiple fluid outlets, wherein the multiple fluid outlets are respectively coupled with the multiple pumps through multiple material transmission paths; and a cold air tunnel coupled with the material outlet chamber and arranged to operably introduce cold air into the material outlet chamber, so as to maintain an internal temperature of the material outlet chamber to be lower than a predetermined temperature.

Abstract: A first serial management interface device includes one or more input/output pins and a controller coupled to the one or more input/output pins. The controller receives a first frame from a second serial management interface device via a first input/output pin and generates a first error code based on the first frame received from the second serial management interface device. The controller receives a second frame from the second serial management interface device via a second input/output pin subsequent to receiving the first frame. The second frame includes a second error code. The controller compares the first error code to the second error code to determine whether first error code and the second error code match.

Abstract: An optocoupler includes a light output chip and a light-sensing chip. A light-receiving surface of the light-sensing chip is disposed to face a light output surface of the light output chip. The light-sensing chip and the light output chip are a blue light-emitting diode and a green light-emitting diode, respectively. Accordingly, the optocoupler has a stable output performance at a working temperature ranging from ?55° C. to 150° C. and a high response frequency.

Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.

Abstract: Various embodiments of the present disclosure are directed towards a processing tool. The processing tool includes a housing structure defining a chamber. A first plate is disposed in the chamber. A first plasma exclusion zone (PEZ) ring is disposed on the first plate. A second plate is disposed in the chamber and underlies the first plate. A second PEZ ring is disposed on the second plate. The second PEZ ring comprises a PEZ ring notch that extends inwardly from a circumferential edge of the second PEZ ring.

Abstract: An imaging lens assembly includes a dual molded optical element, a plurality of imaging lens elements and a light blocking element. The dual molded optical element has an object-side surface and an image-side surface and includes a light transmitting portion and a light absorbing portion. The light transmitting portion includes an optical effective section. The light absorbing portion is located on at least one of the object-side surface and the image-side surface of the dual molded optical element, and a plastic material of the light absorbing portion and a plastic material of the light transmitting portion are different colors. The imaging lens elements are disposed in the inner space of the imaging lens assembly. The light blocking element is disposed adjacent to the light transmitting portion of the dual molded optical element.

Abstract: Ingot puller apparatus that include a silicon feed tube for adding solid silicon to a crucible assembly are disclosed. The silicon feed tubes include a conduit portion having an inner diameter and a kick plate disposed below the conduit portion. The kick plate extends across at least 60% of the inner diameter of the conduit portion.

Abstract: In some examples, a semiconductor package comprises a lead frame. The lead frame includes a first row of leads; a first pad coupled to the first row of leads; a second row of leads; and a second pad coupled to the second row of leads, the first and second pads separated by a gap. The semiconductor package includes a heat-generating device coupled to the first and second pads and exposed to an exterior of the semiconductor package.

Abstract: A system includes an inspection robot comprising a plurality of sensor sleds; a plurality of ultra-sonic (UT) sensors; a couplant chamber mounted to each of the plurality of sleds, each couplant chamber comprising: a cone, the cone comprising a cone tip portion at an inspection surface end of the cone; a sensor mounting end opposite the cone tip portion; a couplant entry fluidly coupled to the cone at a position between the cone tip portion and the sensor mounting end; and wherein each of the UT sensors is mounted to the sensor mounting end of one of the couplant chambers.

Abstract: The present disclosure provides a mutated form of AP4 that is more resistant to degradation relative to wild-type AP4. The disclosure also provides T cells expressing the mutated form of AP4 and methods of using the T cells in adoptive cellular immunotherapy.

Abstract: Methods and devices are provided herein for enhancing robustness of a bipolar electrostatic discharge (ESD) device. The robustness of a bipolar ESD device includes providing an emitter region and a collector region adjacent to the emitter region. An isolation structure is provided between the emitter region and the collector region. A ballasting characteristic at the isolation structure is modified by inserting at least one partition structure therein. Each partition structure extends substantially abreast at least one of the emitter and the collector regions.

Abstract: A light-emitting device comprises a semiconductor stack; a pad electrode comprising a periphery disposed on the semiconductor stack; and a finger electrode connected to the pad electrode, wherein the finger electrode comprises a first portion extended from the periphery of the pad electrode and a second portion away from the pad electrode, the first portion comprises a first side and a second side, the first side is opposite to the second side, the first side comprises a first arc having a first curvature radius, and the first curvature radius is larger than 10 ?m.

Abstract: The present disclosure provides a method to enlarge the process window for forming a source/drain contact. The method may include receiving a workpiece that includes a source/drain feature exposed in a source/drain opening defined between two gate structures, conformally depositing a dielectric layer over sidewalls of the source/drain opening and a top surface of the source/drain feature, anisotropically etching the dielectric layer to expose the source/drain feature, performing an implantation process to the dielectric layer, and after the performing of the implantation process, performing a pre-clean process to the workpiece. The implantation process includes a non-zero tilt angle.

Abstract: A method for a Conditional Primary Secondary Cell Group (SCG) Cell (PSCell) Change (CPC) procedure performed by a master node is provided. The method includes receiving, from a user equipment (UE), a UE capability report indicating that the UE supports conditional reconfiguration for a PSCell change; transmitting, to the UE, a first conditional reconfiguration for changing from a source PSCell to a target PSCell in an SCG portion of a radio resource control (RRC) reconfiguration message, the first conditional reconfiguration including a configuration of the target PSCell and an execution condition; and receiving, from the UE, a response message after the first conditional reconfiguration is applied by the UE. The first conditional reconfiguration enables the UE to evaluate the execution condition, and apply the configuration of the target PSCell and synchronize to the target PSCell after the execution condition is evaluated as satisfied.

Abstract: A keyboard touch electrode module includes a plurality of same electrode matrices, which are arranged along a lengthwise direction and a widthwise direction and formed by a plurality of series of first electrodes and a plurality of series of second electrodes which interlace with each other. Adjacent two of the electrode matrices in the widthwise direction are mis-aligned. The electrode matrices thereon define a plurality of key projection areas, each of which covers a same key-face electrode pattern. A touch keyboard includes a base, a plurality of keycaps, a plurality of supporting structures connected to and between the base and the keycaps, and the keyboard touch electrode module disposed between the base and the keycaps. The keyboard touch electrode module can senses a non-pressing movement on the keycaps. The keycap can move up and down relative to the base and the keyboard touch electrode module through the corresponding supporting structure.

Abstract: A novel integrated circuit and method thereof are provided. The integrated circuit includes a plurality of first interconnect pads, a plurality of second interconnect pads, a first inter-level dielectric layer, a thin film resistor, and at least two end-caps. The end-caps, which are connectors for the thin film resistor, are positioned at the same level with the plurality of second interconnect pads. Therefore, an electrical connection between the end-caps and the plurality of second interconnect pads can be formed by directly connection of them. An integrated circuit with a thin film resistor can be made in a cost benefit way accordingly, so as to overcome disadvantages mentioned above.