Patents by Inventor Chris Chen

Chris Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10430806
    Abstract: A contextual analysis engine systematically extracts, analyzes and organizes digital content stored in an electronic file such as a webpage. Content can be extracted using a text extraction module which is capable of separating the content which is to be analyzed from less meaningful content such as format specifications and programming scripts. The resulting unstructured corpus of plain text can then be passed to a text analytics module capable of generating a structured categorization of topics included within the content. This structured categorization can be organized based on a content topic ontology which may have been previously defined or which may be developed in real-time. The systems disclosed herein optionally include an input/output interface capable of managing workflows of the text extraction module and the text analytics module, administering a cache of previously generated results, and interfacing with other applications that leverage the disclosed contextual analysis services.
    Type: Grant
    Filed: October 15, 2013
    Date of Patent: October 1, 2019
    Assignee: Adobe Inc.
    Inventors: Walter Chang, Shone Sadler, David Jared, Chris Chen
  • Publication number: 20190259655
    Abstract: The present disclosure, in some embodiments, relates to a silicon on insulator (SOI) substrate. The SOI substrate includes a dielectric layer disposed over a first substrate. The dielectric layer has an outside edge aligned with an outside edge of the first substrate. An active layer covers a first annular portion of an upper surface of the dielectric layer. The upper surface of the dielectric layer has a second annular portion that surrounds the first annular portion and extends to the outside edge of the dielectric layer. The second annular portion is uncovered by the active layer.
    Type: Application
    Filed: May 7, 2019
    Publication date: August 22, 2019
    Inventors: Yu-Hung Cheng, Cheng-Ta Wu, Ming-Che Yang, Wei-Kung Tsai, Yong-En Syu, Yeur-Luen Tu, Chris Chen
  • Patent number: 10319699
    Abstract: Structures and formation methods of a chip package are provided. The chip package includes a chip stack including a number of semiconductor dies. The chip package also includes a semiconductor chip, and the semiconductor chip is higher than the chip stack. The chip package further includes a package layer covering a top and sidewalls of the chip stack and sidewalls of the semiconductor chip.
    Type: Grant
    Filed: October 16, 2017
    Date of Patent: June 11, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wen-Hsin Wei, Chi-Hsi Wu, Chen-Hua Yu, Hsien-Pin Hu, Shang-Yun Hou, Weiming Chris Chen
  • Patent number: 10304723
    Abstract: The present disclosure, in some embodiments, relates to a method of forming an SOI substrate. The method may be performed by epitaxially forming a silicon-germanium (SiGe) layer over a sacrificial substrate and epitaxially forming a first active layer on the SiGe layer. The first active layer has a composition different than the SiGe layer. The sacrificial substrate and is flipped and the first active layer is bonded to an upper surface of a dielectric layer formed over a first substrate. The sacrificial substrate and the SiGe layer are removed and the first active layer is etched to define outermost sidewalls and to expose an outside edge of an upper surface of the dielectric layer. A contiguous active layer is formed by epitaxially forming a second active layer on the first active layer. The first active layer and the second active layer have a substantially same composition.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: May 28, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Hung Cheng, Cheng-Ta Wu, Ming-Che Yang, Wei-Kung Tsai, Yong-En Syu, Yeur-Luen Tu, Chris Chen
  • Patent number: 10304800
    Abstract: A semiconductor structure includes a first substrate including a first surface and a second surface opposite to the first surface; a first die disposed over the second surface of the first substrate; a plurality of first conductive bumps disposed between the first die and the first substrate; a molding disposed over the first substrate and surrounding the first die and the plurality of first conductive bumps; a second substrate disposed below the first surface of the first substrate; a plurality of second conductive bumps disposed between the first substrate and the second substrate; and a second die disposed between the first substrate and the second substrate.
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: May 28, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Weiming Chris Chen, Ting-Yu Yeh, Chia-Hsin Chen, Tu-Hao Yu, Kuo-Chiang Ting, Shang-Yun Hou, Chi-Hsi Wu
  • Publication number: 20190157138
    Abstract: The present disclosure, in some embodiments, relates to a method of forming an SOI substrate. The method may be performed by epitaxially forming a silicon-germanium (SiGe) layer over a sacrificial substrate and epitaxially forming a first active layer on the SiGe layer. The first active layer has a composition different than the SiGe layer. The sacrificial substrate and is flipped and the first active layer is bonded to an upper surface of a dielectric layer formed over a first substrate. The sacrificial substrate and the SiGe layer are removed and the first active layer is etched to define outermost sidewalls and to expose an outside edge of an upper surface of the dielectric layer. A contiguous active layer is formed by epitaxially forming a second active layer on the first active layer. The first active layer and the second active layer have a substantially same composition.
    Type: Application
    Filed: February 26, 2018
    Publication date: May 23, 2019
    Inventors: Yu-Hung Cheng, Cheng-Ta Wu, Ming-Che Yang, Wei-Kung Tsai, Yong-En Syu, Yeur-Luen Tu, Chris Chen
  • Patent number: 10235681
    Abstract: A contextual analysis engine systematically extracts, analyzes and organizes digital content stored in an electronic file such as a webpage. Content can be extracted using a text extraction module which is capable of separating the content which is to be analyzed from less meaningful content such as format specifications and programming scripts. The resulting unstructured corpus of plain text can then be passed to a text analytics module capable of generating a structured categorization of topics included within the content. This structured categorization can be organized based on a content topic ontology which may have been previously defined or which may be developed in real-time. The systems disclosed herein optionally include an input/output interface capable of managing workflows of the text extraction module and the text analytics module, administering a cache of previously generated results, and interfacing with other applications that leverage the disclosed contextual analysis services.
    Type: Grant
    Filed: October 15, 2013
    Date of Patent: March 19, 2019
    Assignee: Adobe Inc.
    Inventors: Walter Chang, Chris Chen, Shone Sadler, David Jared
  • Publication number: 20180374821
    Abstract: A semiconductor structure includes a first substrate including a first surface and a second surface opposite to the first surface; a first die disposed over the second surface of the first substrate; a plurality of first conductive bumps disposed between the first die and the first substrate; a molding disposed over the first substrate and surrounding the first die and the plurality of first conductive bumps; a second substrate disposed below the first surface of the first substrate; a plurality of second conductive bumps disposed between the first substrate and the second substrate; and a second die disposed between the first substrate and the second substrate.
    Type: Application
    Filed: November 1, 2017
    Publication date: December 27, 2018
    Inventors: WEIMING CHRIS CHEN, TING-YU YEH, CHIA-HSIN CHEN, TU-HAO YU, KUO-CHIANG TING, SHANG-YUN HOU, CHI-HSI WU
  • Publication number: 20180366440
    Abstract: A semiconductor device includes a first electronic component, a second electronic component and a plurality of interconnection structures. The first electronic component has a first surface. The second electronic component is over the first electronic component, and the second electronic component has a second surface facing the first surface of the first electronic component. The interconnection structures are between and electrically connected to the first electronic component and the second electronic component, wherein each of the interconnection structures has a length along a first direction substantially parallel to the first surface and the second surface, a width along a second direction substantially parallel to the first surface and the second surface and substantially perpendicular to the first direction, and the length is larger than the width of at least one of the interconnection structures.
    Type: Application
    Filed: October 4, 2017
    Publication date: December 20, 2018
    Inventors: WEIMING CHRIS CHEN, TU-HAO YU, KUO-CHIANG TING, SHANG-YUN HOU, CHI-HSI WU
  • Patent number: 10011708
    Abstract: Injection molded article with reduced stress whitening, said article comprises a composition of a heterophasic propylene copolymer, inorganic filler and optionally low amounts of a high density polyethylene, wherein said heterophasic propylene copolymer has a propylene copolymer as a matrix.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: July 3, 2018
    Assignees: ABU DHABI POLYMERS CO. LTD (BOROUGE) LLC., Borealis AG
    Inventors: Janne Lampela, Thomas Rothmayer, Chris Chen
  • Publication number: 20180040586
    Abstract: Structures and formation methods of a chip package are provided. The chip package includes a chip stack including a number of semiconductor dies. The chip package also includes a semiconductor chip, and the semiconductor chip is higher than the chip stack. The chip package further includes a package layer covering a top and sidewalls of the chip stack and sidewalls of the semiconductor chip.
    Type: Application
    Filed: October 16, 2017
    Publication date: February 8, 2018
    Inventors: Wen-Hsin Wei, Chi-Hsi Wu, Chen-Hua Yu, Hsien-Pin Hu, Shang-Yun Hou, Weiming Chris Chen
  • Publication number: 20170373022
    Abstract: A method includes performing a first light-exposure and a second a second light-exposure on a photo resist. The first light-exposure is performed using a first lithograph mask, which covers a first portion of the photo resist. The first portion of the photo resist has a first strip portion exposed in the first light-exposure. The second light-exposure is performed using a second lithograph mask, which covers a second portion of the photo resist. The second portion of the photo resist has a second strip portion exposed in the second light-exposure. The first strip portion and the second strip portion have an overlapping portion that is double exposed. The method further includes developing the photo resist to remove the first strip portion and the second strip portion, etching a dielectric layer underlying the photo resist to form a trench, and filling the trench with a conductive feature.
    Type: Application
    Filed: August 21, 2017
    Publication date: December 28, 2017
    Inventors: Wen Hsin Wei, Hsien-Pin Hu, Shang-Yun Hou, Weiming Chris Chen
  • Publication number: 20170322649
    Abstract: A method is disclosed for determining detecting a conductive object and determining the type of object and the type of contact that object has with a touch sensitive surface, the method comprising measuring capacitance on a plurality of mutual capacitance sensors, each mutual capacitance sensor corresponding to a unit cell in an array of unit cells. After mutual capacitance is measured a peak unit cell is identified based on the measured capacitances and a matrix sum of a plurality of unit cells surround the peak unit cell is calculated. The value of the peak unit cell and the matrix sum are then compared to a range and a contact type determined based on the comparison.
    Type: Application
    Filed: October 13, 2014
    Publication date: November 9, 2017
    Inventors: Han Wang, Petro Ksondzyk, Chris Chen
  • Publication number: 20170313867
    Abstract: Injection molded article with reduced stress whitening, said article comprises a composition of a heterophasic propylene copolymer, inorganic filler and optionally low amounts of a high density polyethylene, wherein said heterophasic propylene co polymer has a propylene copolymer as a matrix.
    Type: Application
    Filed: December 19, 2014
    Publication date: November 2, 2017
    Applicants: ABU DHABI POLYMERS CO. LTD (BOROUGE) LLC., BOREALIS AG
    Inventors: Janne LAMPELA, Thomas ROTHMAYER, Chris CHEN
  • Patent number: 9156368
    Abstract: A method and application that utilizes a signal processing algorithm is provided for detecting plug-in electric vehicle charging events through interrogation of smart meter data. The method is a form of non-invasive load monitoring that allows the utility to track plug-in electric vehicle charging events in real time or over extended periods. These parameters are suitably flexible so as to accommodate diverse electric vehicle technologies and a range of electric vehicle owners' charging habits. Application of the method facilitates the integration of electric vehicles into utilities' electrical grids, protection of the utilities' assets, geographic mapping of electric vehicle owners and charging events, managed charging through communication between the utility and the vehicle or owner, managed charging through the offer of time of use rates for electric vehicle owners, and an enabling technology to accompany other Smart Grid functions such as Vehicle-to-Grid distributed energy storage.
    Type: Grant
    Filed: November 11, 2011
    Date of Patent: October 13, 2015
    Assignee: SAN DIEGO GAS & ELECTRIC COMPANY
    Inventors: Chris Chen, William Vincent Torre, Charles Lyle, Benjamin L. Colson, Eric S. Fan, Praneet Kolluru
  • Publication number: 20150267308
    Abstract: Embodiments of the present invention are directed to photoelectrodes having a wire array core and a conformal coating on the core. The wire array core and the conformal coating can be independently selected from inorganic semiconductor materials. The photoelectrodes can be used as either or both the anode and cathode in a device for fuel generation. Such a device, for example, could include a photoanode and a photocathode separated from each other by an electrically and ionically permeable, and proton-conductive membrane.
    Type: Application
    Filed: May 2, 2011
    Publication date: September 24, 2015
    Inventors: Adele Tamboli, Daniel B. Turner-Evans, Manav Malhotra, Harry A. Atwater, Nathan S. Lewis, Chris Chen
  • Publication number: 20150106156
    Abstract: A contextual analysis engine systematically extracts, analyzes and organizes digital content stored in an electronic file such as a webpage. Content can be extracted using a text extraction module which is capable of separating the content which is to be analyzed from less meaningful content such as format specifications and programming scripts. The resulting unstructured corpus of plain text can then be passed to a text analytics module capable of generating a structured categorization of topics included within the content. This structured categorization can be organized based on a content topic ontology which may have been previously defined or which may be developed in real-time. The systems disclosed herein optionally include an input/output interface capable of managing workflows of the text extraction module and the text analytics module, administering a cache of previously generated results, and interfacing with other applications that leverage the disclosed contextual analysis services.
    Type: Application
    Filed: October 15, 2013
    Publication date: April 16, 2015
    Applicant: Adobe Systems Incorporated
    Inventors: Walter Chang, Shone Sadler, David Jared, Chris Chen
  • Publication number: 20150106157
    Abstract: A contextual analysis engine systematically extracts, analyzes and organizes digital content stored in an electronic file such as a webpage. Content can be extracted using a text extraction module which is capable of separating the content which is to be analyzed from less meaningful content such as format specifications and programming scripts. The resulting unstructured corpus of plain text can then be passed to a text analytics module capable of generating a structured categorization of topics included within the content. This structured categorization can be organized based on a content topic ontology which may have been previously defined or which may be developed in real-time. The systems disclosed herein optionally include an input/output interface capable of managing workflows of the text extraction module and the text analytics module, administering a cache of previously generated results, and interfacing with other applications that leverage the disclosed contextual analysis services.
    Type: Application
    Filed: October 15, 2013
    Publication date: April 16, 2015
    Applicant: Adobe Systems Incorporated
    Inventors: Walter Chang, Chris Chen, Shone Sadler, David Jared
  • Publication number: 20130188017
    Abstract: A method for instantly determining the mutual geometric positions and orientations between a plurality of 3D motion capture sensors has three or more reference markers mounted fixedly relative to each other on substantially one single plane which are sensed by each sensor. Said method enables said sensors to cooperate as a larger sensing system for 3D motion capture applications without requiring said sensors to be mounted rigidly relative to each other.
    Type: Application
    Filed: January 24, 2012
    Publication date: July 25, 2013
    Inventor: Chris Chen-Hsing Ma
  • Publication number: 20120123709
    Abstract: A method and application that utilizes a signal processing algorithm is provided for detecting plug-in electric vehicle charging events through interrogation of smart meter data. The method is a form of non-invasive load monitoring that allows the utility to track plug-in electric vehicle charging events in real time or over extended periods. These parameters are suitably flexible so as to accommodate diverse electric vehicle technologies and a range of electric vehicle owners' charging habits. Application of the method facilitates the integration of electric vehicles into utilities' electrical grids, protection of the utilities' assets, geographic mapping of electric vehicle owners and charging events, managed charging through communication between the utility and the vehicle or owner, managed charging through the offer of time of use rates for electric vehicle owners, and an enabling technology to accompany other Smart Grid functions such as Vehicle-to-Grid distributed energy storage.
    Type: Application
    Filed: November 11, 2011
    Publication date: May 17, 2012
    Applicant: San Diego Gas & Electric Company, c/o Sempra Energy
    Inventors: Chris Chen, William Vincent Torre, Charles Lyle, Benjamin L. Colson, Eric S. Fan, Praneet Kolluru