Abstract: The present disclosure relates to on-chip self calibrating delay monitoring circuitry.

Abstract: The present disclosure relates to on-chip self calibrating delay monitoring circuitry.

Abstract: Implementations are presented herein that include a plurality of on-chip monitor circuits and a controller. Each of the plurality of on-chip monitor circuits is configured to measure a parameter of a semiconductor chip. The controller is coupled to the plurality of on-chip monitor circuits. The controller is configured to receive a measurement result from at least one of the plurality of on-chip monitor circuits and to control a calibration of another one of the plurality of on-chip monitor circuits in accordance with the measurement result.

Abstract: One or more embodiments relate to an apparatus comprising: a first transistor including a fin; and a second transistor including a fin, the fin of the first transistor having a lower charge carrier mobility than the fin of the second transistor.

Abstract: One or more embodiments of the invention relate to a method comprising: treating a fin of a first n-channel access transistor in a static random access memory cell to have a lower charge carrier mobility than a fin of a first n-channel pull-down transistor in a first inverter in the memory cell, the first n-channel access transistor being coupled between a first bit line and a first node of the first inverter; and treating a fin of a second n-channel access transistor in the memory cell to have a lower charge carrier mobility than a fin of a second n-channel pull-down transistor in a second inverter in the memory cell, the second n-channel access transistor being coupled between a second bit line and a second node of the second inverter.

Abstract: The present disclosure relates to on-chip self calibrating delay monitoring circuitry.

Abstract: A pulsed static flip-flop comprises a first logic device which combines a logic signal with a pulsed signal and outputs a set signal, a second logic device which logically combines the logic signal with a complementary pulsed signal and outputs a reset signal; and a latch device comprising storage means which hold a logic hold level to be tapped off as a stored logic state of the logic signal. The logic hold level is adjustable to a first logic level by a first push-pull transistor controlled by the set signal and to a second logic level by a second push-pull transistor controlled by the reset signal.

Abstract: One or more embodiments relate to a static random access memory cell comprising: a first inverter including a first n-channel pull-down transistor coupled between a first node and a ground voltage; a second inverter including a second n-channel pull-down transistor coupled between a second node and the ground voltage; a first n-channel access transistor coupled between a first bit line and the first node of the first inverter, a fin of the first n-channel access transistor having a lower charge carrier mobility than a fin of the first n-channel pull-down transistor; and a second n-channel access transistor coupled between a second bit line and the second node of the second inverter, a fin of the second n-channel access transistor having a lower charge carrier mobility than a fin of the second n-channel pull-down transistor.

Abstract: Embodiments relate to micromachine structures. In one embodiment, a micromachine structure includes a first electrode, a second electrode, and a sensing element. The sensing element is mechanically movable and is disposed intermediate the first and second electrodes and adapted to oscillate between the first and second electrodes. Further, the sensing element includes a FinFET structure having a height and a width, the height being greater than the width.

Abstract: Implementations are presented herein that include a test circuit and a reference circuit.

Abstract: An integrated circuit arrangement contains an insulating region, which is part of a planar insulating layer, and a capacitor which contains: near and far electrode regions near and remote from the insulating region and a dielectric region. The capacitor and an active component are on the same side of the insulating layer, and the near electrode region and an active region of the component are planar and parallel to the insulating layer. The near electrode region is monocrystalline and contains multiple webs.

Abstract: A memory device includes a multi gate field effect transistor (MuGFET) having a fin with a contact area. A programmable memory element abuts the fin contact area.

Abstract: Implementations are presented herein that include a test circuit and a reference circuit.

Abstract: Embodiments of the invention are related to micromachine structures. In one embodiment, a micromachine structure comprises a first electrode, a second electrode, and a sensing element. The sensing element is mechanically movable and is disposed intermediate the first and second electrodes and adapted to oscillate between the first and second electrodes. Further, the sensing element comprises a FinFET structure having a height and a width, the height being greater than the width.

Abstract: A memory device includes a multi gate field effect transistor (MuGFET) having a fin with a contact area. A programmable memory element abuts the fin contact area.

Abstract: The present disclosure relates to on-chip self calibrating delay monitoring circuitry.

Abstract: A device includes a first transistor including a fin and a second transistor including a fin, the fin of the first transistor having a lower charge carrier mobility than the fin of the second transistor. In a method, the fin of the first transistor is treated to have a lower charge carrier mobility than the fin of the second transistor.

Abstract: A circuit arrangement may include a scan test input stage having a test input for receiving a test signal, wherein the scan test input stage can be switched in high-impedance state; a data input stage having a data input for receiving a data signal, wherein the data input stage can be switched in high-impedance state. The circuit arrangement may further include a latch coupled to at least one output of the scan test input stage and to at least one output of the data input stage; and a drive circuit, which is configured to generate a pulsed clock signal for the data input stage and a signal for driving the scan test input stage.

Abstract: Some embodiments relate to an apparatus that exhibits vertical diode activity to occur between a semiconductive body and an epitaxial film that is disposed over a doping region of the semiconductive body. Some embodiments include an apparatus that causes both vertical and lateral diode activity. Some embodiments include a gated vertical diode for a finned semiconductor apparatus. Process embodiments include the formation of vertical-diode apparatus.

Abstract: A device includes a first transistor including a fin and a second transistor including a fin, the fin of the first transistor having a lower charge carrier mobility than the fin of the second transistor. In a method, the fin of the first transistor is treated to have a lower charge carrier mobility than the fin of the second transistor.