Abstract: An integrated circuit arrangement and method of fabricating the integrated circuit arrangement is described. The integrated circuit arrangement contains an insulating region and a sequence of regions which forms a capacitor. The sequence contains a near electrode region near the insulating region, a dielectric region, and a remote electrode region remote from the insulating region. The insulating region is part of an insulating layer arranged in a plane. The capacitor and an active component are arranged on the same side of the insulating layer and form a memory cell. The near electrode region and an active region of the component are arranged in a plane which lies parallel to the plane in which the insulating layer is arranged. A processor is also contained in the integrated circuit arrangement.

Abstract: The flip-flop according to the invention serves for storing an item of logic state information and has at least one data input and at least one data output. The flip-flop comprises at least one latch stage for storing the state information if the flip-flop is switched on. Furthermore, the flip-flop according to the invention comprises at least one memory cell having a capacitance as storage element. In this case, the at least one memory cell serves for storing the state information if the flip-flop is switched off.

Abstract: An integrated circuit arrangement and method of fabricating the integrated circuit arrangement is described. The integrated circuit arrangement contains an insulating region and a sequence of regions which forms a capacitor. The sequence contains a near electrode region near the insulating region, a dielectric region, and a remote electrode region remote from the insulating region. The insulating region is part of an insulating layer arranged in a plane. The capacitor and an active component are arranged on the same side of the insulating layer and form a memory cell. The near electrode region and an active region of the component are arranged in a plane which lies parallel to the plane in which the insulating layer is arranged. A processor is also contained in the integrated circuit arrangement.

Abstract: An integrated circuit arrangement contains an insulating region, which is part of a planar insulating layer, and a capacitor which contains: near and far electrode regions near and remote from the insulating region and a dielectric region. The capacitor and an active component are on the same side of the insulating layer, and the near electrode region and an active region of the component are planar and parallel to the insulating layer. The near electrode region is monocrystalline and contains multiple webs. Alternately, a FET is present in which: a channel region is the active region, the FET contains a web with opposing control electrodes connected by a connecting region that is isolated from the channel region by a thick insulating region. The thick insulating region is thicker than control electrode insulation regions. The control electrodes contain the same material as the far electrode region.

Abstract: The invention relates to a label identification system comprised of a transmitting-receiving unit and of identification labels on which the identification information is stored in the form of a digital identification information word. The provision of a circuit on the identification label in the form of a circuit arrangement, which is prefabricated using a polymer technique and on which the identification information is subsequently placed by the offset printing of conductor tracks, enables the provision of an identification label involving a minimal consumption of energy during inexpensive mass production. The bulk of the identification information processing is transferred to the transmitting-receiving unit.

Abstract: Method for producing a first SOI field effect transistor with predetermined transistor properties by forming a laterally delimited layer sequence with a gate-insulating layer and a gate region on an undoped substrate, forming a spacer layer having a predetermined thickness, on at least a portion of the sidewalls of the laterally delimited layer sequence, and forming two source/drain regions having a predetermined dopant concentration profile, by introducing dopant into two surface regions of the substrate which are adjoined by the spacer layer, the layer sequence and the spacer layer forming a shading structure that prevents dopant from being introduced into a surface region of the substrate between the two source/drain regions, wherein the predetermined transistor properties of the first SOI field effect transistor are set by setting the thickness of the spacer layer and by setting the dopant concentration profile.

Abstract: The invention relates to an SRAM memory cell, a memory cell arrangement and a method for fabricating a memory cell arrangement. The SRAM memory cell has six vertical transistors, of which four are connected up as flip-flip transistors and two are connected up as switching transistors, four of the vertical transistors being arranged at corners of the rectangular base area.

Abstract: A circuit arrangement comprising a flip-flop, a first power switch transistor, and a plurality of switching transistors. The flip-flop has a plurality of storage transistors with a threshold voltage of a first value. The first power switch transistor has a threshold voltage of a second value, wherein an application of a predetermined electrical potential to its gate terminal brings the circuit arrangement to an operating state such that if at least one supply voltage is switched off, electric charge carriers contained in the circuit arrangement are prevented from flowing away from the circuit arrangement. The plurality of switching transistors, which have a threshold voltage of a third value, are provided between the flip-flop and the first power switch transistor, for coupling a flip-flop input signal into the flip-flop. The magnitude of the first and/or the second value is greater than the magnitude of the third value.

Abstract: The invention relates to an SRAM memory cell, a memory cell arrangement and a method for fabricating a memory cell arrangement. The SRAM memory cell has six vertical transistors, of which four are connected up as flip-flip transistors and two are connected up as switching transistors, four of the vertical transistors being arranged at corners of the rectangular base area.