Abstract: A valve arrangement for applying fluid media, in particular glue, to surfaces, comprising a plurality of individual modules detachably connected to form a row, wherein in the row and between the adjacent individual modules is respectively formed a dividing plane, in which the respectively adjacent individual modules bear one against another, and at least one dividing plane is assigned a heating member for warming the valve arrangement, preferably a plurality of or all dividing planes are respectively assigned a heating member, which is seated in appropriate, mutually opposing receptacles, arranged to both sides of the dividing plane, of the two adjacent individual modules, and cooperates in such a way with those walls of the individual modules which delimit the receptacles that relative movements of the two individual modules in at least one spatial direction are limited or prevented.

Abstract: A power electronics arrangement has a power semiconductor module, with a contact spring, with a load connecting element and with a mounting device which is embodied as part of an electrically operated vehicle. The power semiconductor module has a load connection element which preferably projects outwards from the interior of the power semiconductor module, and preferably has there a first external contact face for external connection, and the load-connecting element has a second contact face. An electrically conductive pressure contact connection is embodied between the first contact face and the second contact face by a contact spring, wherein the pressure on the contact spring which is necessary for this is implemented by connecting the power semiconductor module in a frictionally locking fashion to the mounting device.

Abstract: The invention relates to a power semiconductor device with a substrate and an electrically conductive DC voltage bus bar system and a capacitor connected to the bus bar system, wherein the power semiconductor device has, for securing the capacitor, a capacitor securing apparatus comprising a receptacle device for receiving the capacitor, in which at least part of the capacitor is arranged. Electrically conductive bus bar system terminal elements are electrically connected thereto and run in the direction of the substrate. An elastic first deformation element is materially bonded to the capacitor securing apparatus and is formed from an elastomer is arranged on the side of the capacitor securing apparatus facing the DC voltage bus bar system.

Abstract: A glue valve arrangement having a controllable, in particular electromagnetically operated metering member for the delivery of glue, having a main body with glue duct leading to the metering member, having a tubular glue line, with which glue originating from a separate glue source can be fed to the glue duct, having a rotary feedthrough, detachably fastened to the main body, for the articulated connection of the tubular glue line to the main body, and having a filter for the filtering of the glue. The invention is characterized in that the filter is assigned to the rotary feedthrough.

Abstract: A valve for free-flowing media, in particular a glue valve, with a valve housing, and with a closure member, in particular a valve tappet, which is movable in the valve housing by means of an electromagnet and which bears with a closure piece on a valve seat in the closed position of the valve and which sits at least partially in an in particular continuous interior of a preferably one-piece coil carrier on which the windings of a coil of the electromagnet are wound, and with a valve lift adjustment unit with an elongate abutment part which is arranged at least in part in the interior of the coil carrier and which limits a movement of the closure member in the direction of the valve lift adjustment unit, with the valve lift adjustment unit being is secured on the coil carrier.

Abstract: A modular valve for free-flowing media, with a main module with a valve housing and an electromagnet, a dosing module with a closure member which is movable by means of the electromagnet and which closes a dispensing opening of the dosing module, and a valve lift adjustment module for adjusting the valve lift, which valve lift adjustment module comprises an elongate abutment part which is arranged at least in part in a valve interior of the main module and is modifiable in its axial position in the valve interior, which abutment part limits the movement of the closure member in the direction of the valve lift adjustment module, the dosing module and the valve lift adjustment module being connected releasably to the main module in such a way that the dosing module and the valve lift adjustment module can each be replaced by another module of the same module type.

Abstract: A power electronics arrangement has a power semiconductor module, with a contact spring, with a load connecting element and with a mounting device which is embodied as part of an electrically operated vehicle. The power semiconductor module has a load connection element which preferably projects outwards from the interior of the power semiconductor module, and preferably has there a first external contact face for external connection, and the load-connecting element has a second contact face. An electrically conductive pressure contact connection is embodied between the first contact face and the second contact face by a contact spring, wherein the pressure on the contact spring which is necessary for this is implemented by connecting the power semiconductor module in a frictionally locking fashion to the mounting device.

Abstract: A power electronics module having a base plate, a circuit carrier arranged on the base plate and a plurality of conductor tracks which are electrically insulated from the base plate. A power semiconductor component is arranged on one of the conductor tracks, and has a load connection element. In this case, the base plate has a substantially continuous first recess and the circuit carrier has a substantially continuous second recess, wherein the first and second recesses are arranged such that they are in alignment with one another. The load connection element has a first contact device which is in electrically conductive contact with a contact area of that side of the conductor track which is averted from the base plate, a second contact device for externally making contact with the circuit carrier, and a connecting section, which extends through the first and second recesses, between the first and second contact devices.

Abstract: In a computer-implemented method for controlling the program flow of a training program, in particular for mental training, in which the program flow determines the time and order of the playing of electronically stored speech announcements, periodic movements of the user are detected on a touch-sensitive surface and evaluated, and the program flow is controlled as a function of the result of the evaluation.

Abstract: A process to produce a workpiece surface or a groove inner surface on a rod-shaped, especially cylindrical workpiece. From the workpiece, a rotary tool is supposed to be produced. The material removal is done using laser beam pulses, which are directed through a deflection device onto points of incidence within a pulse area with a specified outside contour on the workpiece. Multiple machine axis drives position the workpiece and the deflection device relative to one another so that the pulse area is oriented essentially at right angles to the emission direction of the laser beam pulses and at right angles to the section of the tool surface that has already been produced and that borders the pulse area. While the material is being removed, the at least one machine axis drive moves the pulse area relative to the workpiece along a specified path of motion while maintaining the orientation.

Abstract: A power electronics module having a base plate, a circuit carrier arranged on the base plate and a plurality of conductor tracks which are electrically insulated from the base plate. A power semiconductor component is arranged on one of the conductor tracks, and has a load connection element. In this case, the base plate has a substantially continuous first recess and the circuit carrier has a substantially continuous second recess, wherein the first and second recesses are arranged such that they are in alignment with one another. The load connection element has a first contact device which is in electrically conductive contact with a contact area of that side of the conductor track which is averted from the base plate, a second contact device for externally making contact with the circuit carrier, and a connecting section, which extends through the first and second recesses, between the first and second contact devices.

Abstract: A valve arrangement for applying fluid media, in particular glue, to surfaces, comprising a plurality of individual modules detachably connected to form a row, wherein in the row and between the adjacent individual modules is respectively formed a dividing plane, in which the respectively adjacent individual modules bear one against another, and at least one dividing plane is assigned a heating member for warming the valve arrangement, preferably a plurality of or all dividing planes are respectively assigned a heating member, which is seated in appropriate, mutually opposing receptacles, arranged to both sides of the dividing plane, of the two adjacent individual modules, and cooperates in such a way with those walls of the individual modules which delimit the receptacles that relative movements of the two individual modules in at least one spatial direction are limited or prevented.

Abstract: The invention relates to a surgical instrument system encompassing a morcellator with a hollow shaft on whose distal end a cutting blade is configured, as well as a gripping instrument with a shaft on whose distal end a tool consisting of at least two jaw members and on whose proximal end a handle consisting of at least two gripping members is configured to activate the tool, in such a way that the gripping instrument can be inserted into the hollow shaft of the morcellator so that it can slide in the longitudinal direction of the morcellator shaft. To ensure versatile application along with simple structure, it is proposed with the invention that the morcellator with the insertable gripping instrument can be inserted into a hollow shaft of an additional medical instrument, in particular a resectoscope, and that an additional irrigation and/or suction canal is configured between the shaft of the morcellator and the inside of the hollow shaft of the additional medical instrument.

Abstract: A power semiconductor module, and method for its manufacture, comprising a first housing part having a cutout and a DC voltage load connection apparatus forming a structural unit, wherein the DC voltage load connection apparatus has first and second DC voltage load connection elements. The first DC voltage load connection element has a first leadthrough section arranged in the cutout, and the second DC voltage load connection element has a second leadthrough section arranged in the cutout forming a gap therebetween. The first and second leadthrough sections are sheathed by an elastomer, which fills the gap, is cohesively connected to the first and second leadthrough sections and seals off the first and second leadthrough sections with respect to the first housing part. The inventive power semiconductor module exhibits a high resistance to thermal cycling, and the distance between the DC voltage load connection elements can be configured to be small.

Abstract: A method and system for testing the functional capability of an analytical instrument uses first and second blind samples. Each blind sample is a test substance with an amount of a parameter to be tested that is unknown to the user. Each blind sample is provided with an identification means with a unique identification. When the blind samples are tested by the user in the instrument being tested, the measurement values obtained and the unique identifications read are compared against predetermined values that are accessible to a test program configured as software on the analytical instrument. By comparison of the measurement values and the predetermined values, the functional capability of the analytical instrument is determined and the result is transmitted to an output unit of the analytical instrument.

Abstract: A power semiconductor module, and method for its manufacture, comprising a first housing part having a cutout and a DC voltage load connection apparatus forming a structural unit, wherein the DC voltage load connection apparatus has first and second DC voltage load connection elements. The first DC voltage load connection element has a first leadthrough section arranged in the cutout, and the second DC voltage load connection element has a second leadthrough section arranged in the cutout forming a gap therebetween. The first and second leadthrough sections are sheathed by an elastomer, which fills the gap, is cohesively connected to the first and second leadthrough sections and seals off the first and second leadthrough sections with respect to the first housing part. The inventive power semiconductor module exhibits a high resistance to thermal cycling, and the distance between the DC voltage load connection elements can be configured to be small.

Abstract: A method and system for testing the functional capability of an analytical instrument uses first and second blind samples. Each blind sample is a test substance with an amount of a parameter to be tested that is unknown to the user. Each blind sample is provided with an identification means with a unique identification. When the blind samples are tested by the user in the instrument being tested, the measurement values obtained and the unique identifications read are compared against predetermined values that are accessible to a test program configured as software on the analytical instrument. By comparison of the measurement values and the predetermined values, the functional capability of the analytical instrument is determined and the result is transmitted to an output unit of the analytical instrument.